ACS Applied Polymer Materials,
Год журнала:
2024,
Номер
6(17), С. 10738 - 10749
Опубликована: Авг. 28, 2024
The
development
of
polyimide
(PI)
films
with
excellent
mechanical
properties
and
low
dielectric
constants
is
crucial
for
flexible
optoelectronic
devices
printed
circuit
boards.
Here,
a
method
to
improve
the
decrease
constant
PI
reported
by
introducing
synergistic
effect
between
hydrogen
bonding
(H-bonding)
microbranched
cross-linking
structures.
A
triamine
monomer
(4,4′,4″-(1H-imidazole-2,4,5-triyl)
trianiline,
DTI)
acting
as
bond
donor
was
designed
synthesized.
It
then
in
situ
polymerized
commercial
3,3′,4,4′-biphenyl
tetracarboxylic
dianhydride
(BPDA),
4,4′-(hexafluoroisopropylidene)
diphthalic
anhydride
(6FDA),
4,4′-oxidianiline
(ODA),
1,4-phenylenediamine
(PDA)
obtain
four
different
films,
BPDA/ODA/DTI,
BPDA/PDA/DTI,
6FDA/ODA/DTI,
6FDA/PDA/DTI.
With
introduction
DTI,
corresponding
exhibited
high
modulus
coefficient
thermal
expansion
(CTE).
When
DTI
content
optimized,
several
high-performance
suitable
electronic
applications
were
achieved.
At
10
MHz,
6FDA/PDA
series
decreased
from
3.39
2.89,
while
increased
3.41
4.60
GPa.
CTE
BPDA/PDA
reduced
8.61
0.27,
reduction
approximately
97%.
Structural
characterization,
density
functional
theory
(DFT),
molecular
dynamics
(MD)
simulations
revealed
competitive
relationships
bonds
branched
cross-links
within
chains.
This
approach
offers
strategy
overcome
performance
trade-off
films.
Advanced Materials,
Год журнала:
2023,
Номер
35(39)
Опубликована: Март 12, 2023
Abstract
Polyimides
(PIs)
are
widely
used
in
circuit
components,
electrical
insulators,
and
power
systems
modern
electronic
devices
large
appliances.
Electrical/mechanical
damage
of
materials
important
factors
that
threaten
reliability
service
lifetime.
Dynamic
(self‐healable,
recyclable
degradable)
PIs,
a
promising
class
successfully
improve
electrical/mechanical
properties
after
damage,
anticipated
to
solve
this
issue.
The
viewpoints
perspectives
on
the
status
future
trends
dynamic
PI
based
few
existing
documents
shared.
main
forms
dielectric
application
process
first
introduced,
initial
strategies
schemes
these
problems
proposed.
Fundamentally,
bottleneck
issues
faced
by
development
PIs
indicated,
relationship
between
various
universality
method
is
evaluated.
potential
mechanism
deal
with
highlighted
several
feasible
prospective
address
discussed.
This
study
concluded
presenting
short
outlook
improvements
systems,
challenges,
solutions
insulation.
summary
theory
practice
should
encourage
policy
favoring
energy
conservation
environmental
protection
promoting
sustainability.
Advanced Materials,
Год журнала:
2023,
Номер
unknown
Опубликована: Дек. 15, 2023
Polymers
are
essential
components
of
modern-day
materials
and
widely
used
in
various
fields.
The
dielectric
constant,
a
key
physical
parameter,
plays
fundamental
role
the
light-,
electricity-,
magnetism-related
applications
polymers,
such
as
electrical
insulation,
battery
photovoltaic
fabrication,
sensing
contact,
signal
transmission
communication.
Over
past
few
decades,
numerous
efforts
have
been
devoted
to
engineering
intrinsic
constant
particularly
by
tailoring
induced
orientational
polarization
modes
ferroelectric
domain
engineering.
Investigations
into
these
methods
guided
rational
design
on-demand
preparation
polymers
with
desired
constants.
This
review
article
exhaustively
summarizes
from
molecular
mesoscopic
scales,
emphasis
on
application-driven
polymer
synthesis
rooted
chemistry
principles.
Additionally,
it
explores
that
can
benefit
regulation
outlines
future
prospects
this
field.
Chemical Reviews,
Год журнала:
2024,
Номер
124(12), С. 7674 - 7711
Опубликована: Июнь 7, 2024
The
development
of
microelectronics
and
large-scale
intelligence
nowadays
promotes
the
integration,
miniaturization,
multifunctionality
electronic
devices
but
also
leads
to
increment
signal
transmission
delays,
crosstalk,
energy
consumption.
exploitation
materials
with
low
permittivity
(low-
Journal of Materials Chemistry C,
Год журнала:
2023,
Номер
11(30), С. 10274 - 10281
Опубликована: Янв. 1, 2023
The
dissipation
factor
of
a
PI
film
at
high-frequencies
is
mainly
determined
by
its
water
adsorption,
and
the
dielectric
loss
has
linear
relationship
with
slope
0.74.
Macromolecules,
Год журнала:
2023,
Номер
56(5), С. 2164 - 2174
Опубликована: Фев. 23, 2023
The
correlations
between
the
molecular
structures
of
four
Tröger's
base
(TB)-based
polyimides
(PIs)
and
two
non-TB
containing
analogues
physical
properties
including
thermal
conductivity
(λ)
dielectric
both
at
low
high
frequencies
were
investigated
in
detail.
TB-based
PI
films
exhibited
constants
(Dk
=
2.25–2.80)
10
GHz.
They
possessed
much
lower
λ
values
(0.035–0.145
W/mK)
compared
to
commercial
Kapton
(0.240
W/mK).
influences
incorporating
TB
units
into
chain
backbones
on
aggregation
PIs
identified.
Incorporating
effectively
reduced
degree
orientation
increased
fractional
free
volume,
leading
Dk
for
resulting
films.
Also,
introducing
enhanced
weights,
toughness,
glass-transition
temperature
(Tg)
PIs.
Therefore,
can
be
promising
heat-insulating
low-k
materials.
RSC Advances,
Год журнала:
2023,
Номер
13(11), С. 7585 - 7596
Опубликована: Янв. 1, 2023
Dielectric
properties
of
polyimide
(PI)
are
constrained
by
its
inherent
molecular
structure
and
inter-chain
packing
capacities.
The
compromised
dielectric
PI,
however,
could
be
rescued
introducing
trifluoromethyl
forming
a
host-guest
inclusion
complex
with
the
introduction
crown
ethers
(CEs).
Herein,
we
report
PI/crown
ether
composite
films
as
communication
substrate
that
applied
under
high
frequency
circumstances.
In
this
work,
three
kinds
bisphenol
A-containing
diamine
(2,2'-bis[4-(4-aminophenoxy)phenyl]propane,
2,2-bis[4-(2-methyl-4-aminophenoxy)phenyl]propane,
2,2-bis[4-(2-trifluoro
methyl-4-aminophenoxy)phenyl]propane)
synthesized
polymerized
4,4'-(hexafluoroisopropylidene)diphthalic
anhydride
to
prepare
low-dielectric
PI
means
thermal
imidization.
Crown
introduced
into
different
mass
fractions
obtain
series
films.
Following
combination
chain
loss
modified
can
effectively
reduced.
these
materials
(especially
properties)
thoroughly
explored
addition.
results
show
addition
process
offer
increased
free
volume
matrix,
thus
allowing
them
generate
special
necklace-like
supramolecular
structure,
which
makes
disperse
more
uniformly
in
resulting
improved
properties.
Importantly,
constant
at
frequencies
remarkably
reduced
2.33
0.00337,
respectively.
Therefore,
expected
find
extensive
use
5G
future.
