Cited by Dual cross-linking strategy to prepare fluorine-containing poly(arylene ether nitrile) films with a low dielectric constant and ultra-low water uptake

Polymer-based low dielectric constant and loss materials for high-speed communication network: Dielectric constants and challenges DOI

Md Zahidul Islam,

Yaqin Fu,

Hridam Deb

et al.

European Polymer Journal, Journal Year: 2023, Volume and Issue: 200, P. 112543 - 112543

Published: Oct. 28, 2023

Language: Английский

Citations

Rising of Dynamic Polyimide Materials: A Versatile Dielectric for Electrical and Electronic Applications DOI

Baoquan Wan,

Xiaodi Dong,

Xing Yang

et al.

Advanced Materials, Journal Year: 2023, Volume and Issue: 35(39)

Published: March 12, 2023

Abstract Polyimides (PIs) are widely used in circuit components, electrical insulators, and power systems modern electronic devices large appliances. Electrical/mechanical damage of materials important factors that threaten reliability service lifetime. Dynamic (self‐healable, recyclable degradable) PIs, a promising class successfully improve electrical/mechanical properties after damage, anticipated to solve this issue. The viewpoints perspectives on the status future trends dynamic PI based few existing documents shared. main forms dielectric application process first introduced, initial strategies schemes these problems proposed. Fundamentally, bottleneck issues faced by development PIs indicated, relationship between various universality method is evaluated. potential mechanism deal with highlighted several feasible prospective address discussed. This study concluded presenting short outlook improvements systems, challenges, solutions insulation. summary theory practice should encourage policy favoring energy conservation environmental protection promoting sustainability.

Language: Английский

Citations

Fluorinated polyimide with triphenyl pyridine structure for 5G communications: Low dielectric, highly hydrophobic, and highly transparent DOI

Hong Li, Feng Bao,

Xiaoqian Lan

et al.

European Polymer Journal, Journal Year: 2023, Volume and Issue: 197, P. 112327 - 112327

Published: July 28, 2023

Language: Английский

Citations

Versatile Landscape of Low-k Polyimide: Theories, Synthesis, Synergistic Properties, and Industrial Integration DOI

Xiaodi Dong,

Baoquan Wan, Jun‐Wei Zha

et al.

Chemical Reviews, Journal Year: 2024, Volume and Issue: 124(12), P. 7674 - 7711

Published: June 7, 2024

The development of microelectronics and large-scale intelligence nowadays promotes the integration, miniaturization, multifunctionality electronic devices but also leads to increment signal transmission delays, crosstalk, energy consumption. exploitation materials with low permittivity (low-

Language: Английский

Citations

Engineering the Dielectric Constants of Polymers: From Molecular to Mesoscopic Scales DOI

Jie Chen,

Zhantao Pei,

Bin Chai

et al.

Advanced Materials, Journal Year: 2023, Volume and Issue: unknown

Published: Dec. 15, 2023

Polymers are essential components of modern-day materials and widely used in various fields. The dielectric constant, a key physical parameter, plays fundamental role the light-, electricity-, magnetism-related applications polymers, such as electrical insulation, battery photovoltaic fabrication, sensing contact, signal transmission communication. Over past few decades, numerous efforts have been devoted to engineering intrinsic constant particularly by tailoring induced orientational polarization modes ferroelectric domain engineering. Investigations into these methods guided rational design on-demand preparation polymers with desired constants. This review article exhaustively summarizes from molecular mesoscopic scales, emphasis on application-driven polymer synthesis rooted chemistry principles. Additionally, it explores that can benefit regulation outlines future prospects this field.

Language: Английский

Citations

Recyclable, reprocessable, self-healing elastomer-like epoxy vitrimer with low dielectric permittivity and its closed-loop recyclable carbon fiber reinforced composite DOI

Mingfeng Chen,

Wenhui Luo,

Shufeng Lin

et al.

Composites Part B Engineering, Journal Year: 2023, Volume and Issue: 257, P. 110666 - 110666

Published: March 16, 2023

Language: Английский

Citations

A systematic study of the relationship between the high-frequency dielectric dissipation factor and water adsorption of polyimide films DOI

Runxin Bei,

Kaijin Chen, Yanwei He

et al.

Journal of Materials Chemistry C, Journal Year: 2023, Volume and Issue: 11(30), P. 10274 - 10281

Published: Jan. 1, 2023

The dissipation factor of a PI film at high-frequencies is mainly determined by its water adsorption, and the dielectric loss has linear relationship with slope 0.74.

Language: Английский

Citations

Tröger’s Base (TB)-Based Polyimides as Promising Heat-Insulating and Low-K Dielectric Materials DOI

Jian Lu,

Yu Zhang, Jing Li

et al.

Macromolecules, Journal Year: 2023, Volume and Issue: 56(5), P. 2164 - 2174

Published: Feb. 23, 2023

The correlations between the molecular structures of four Tröger's base (TB)-based polyimides (PIs) and two non-TB containing analogues physical properties including thermal conductivity (λ) dielectric both at low high frequencies were investigated in detail. TB-based PI films exhibited constants (Dk = 2.25–2.80) 10 GHz. They possessed much lower λ values (0.035–0.145 W/mK) compared to commercial Kapton (0.240 W/mK). influences incorporating TB units into chain backbones on aggregation PIs identified. Incorporating effectively reduced degree orientation increased fractional free volume, leading Dk for resulting films. Also, introducing enhanced weights, toughness, glass-transition temperature (Tg) PIs. Therefore, can be promising heat-insulating low-k materials.

Language: Английский

Citations

Polyimide/crown ether composite film with low dielectric constant and low dielectric loss for high signal transmission DOI

Heming Li, Xinming Wang,

Yuze Gong

et al.

RSC Advances, Journal Year: 2023, Volume and Issue: 13(11), P. 7585 - 7596

Published: Jan. 1, 2023

Dielectric properties of polyimide (PI) are constrained by its inherent molecular structure and inter-chain packing capacities. The compromised dielectric PI, however, could be rescued introducing trifluoromethyl forming a host-guest inclusion complex with the introduction crown ethers (CEs). Herein, we report PI/crown ether composite films as communication substrate that applied under high frequency circumstances. In this work, three kinds bisphenol A-containing diamine (2,2'-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(2-methyl-4-aminophenoxy)phenyl]propane, 2,2-bis[4-(2-trifluoro methyl-4-aminophenoxy)phenyl]propane) synthesized polymerized 4,4'-(hexafluoroisopropylidene)diphthalic anhydride to prepare low-dielectric PI means thermal imidization. Crown introduced into different mass fractions obtain series films. Following combination chain loss modified can effectively reduced. these materials (especially properties) thoroughly explored addition. results show addition process offer increased free volume matrix, thus allowing them generate special necklace-like supramolecular structure, which makes disperse more uniformly in resulting improved properties. Importantly, constant at frequencies remarkably reduced 2.33 0.00337, respectively. Therefore, expected find extensive use 5G future.

Language: Английский

Citations

Colorless polyimides derived from rigid trifluoromethyl-substituted triphenylenediamines DOI

Feng Bao, Huanyu Lei,

Bingyu Zou

et al.

Polymer, Journal Year: 2023, Volume and Issue: 273, P. 125883 - 125883

Published: March 22, 2023

Language: Английский

Citations