Thermal interface materials: From fundamental research to applications
SusMat,
Год журнала:
2024,
Номер
unknown
Опубликована: Сен. 23, 2024
Abstract
The
miniaturization,
integration,
and
high
data
throughput
of
electronic
chips
present
challenging
demands
on
thermal
management,
especially
concerning
heat
dissipation
at
interfaces,
which
is
a
fundamental
scientific
question
as
well
an
engineering
problem—a
death
problem
called
in
semiconductor
industry.
A
comprehensive
examination
interfacial
resistance
has
been
given
from
physics
perspective
2022
Review
Modern
Physics
.
Here,
we
provide
detailed
overview
materials
perspective,
focusing
the
optimization
structure
compositions
interface
(TIMs)
interact/contact
with
source
sink.
First,
discuss
impact
conductivity,
bond
line
thickness,
contact
TIMs.
Second,
it
pointed
out
that
there
are
two
major
routes
to
improve
transfer
through
interface.
One
reduce
TIM's
(
R
TIM
)
TIMs
strategies
like
incorporating
conductive
fillers,
enhancing
treatment
techniques.
other
c
by
improving
effective
contact,
strengthening
bonding,
utilizing
mass
gradient
alleviate
vibrational
mismatch
between
source/sink.
Finally,
such
challenges
theories,
potential
developments
sustainable
TIMs,
application
AI
design
also
explored.
Язык: Английский
Design of Thermal Interface Materials with Excellent Interfacial Heat/Force Transfer Ability via Hierarchical Energy Dissipation
Advanced Functional Materials,
Год журнала:
2024,
Номер
unknown
Опубликована: Июнь 19, 2024
Abstract
Interfaces
play
an
important
role
in
the
heat
and
stress
transfer
within
applications
such
as
electronic
cooling.
The
coexistence
of
apparently
contradictory
properties
between
dissipation
adhesion
at
interfaces
poses
a
constant
challenge
for
existing
interface
materials.
Herein,
thermal
material
is
reported,
consisting
epoxy‐functionalized
polydimethylsiloxane
aluminum
fillers
with
excellent
interfacial
heat/force
ability.
This
optimizes
combination
conductivity
3.46
W
m
−1
K
energy
1.17
kJ
−2
.
Using
two
viscoelastic
models,
force
ability
attributed
to
hierarchical
via
introduction
borate
ester
bonds
filler
networks.
A
simple
kinetic
bond
model
demonstrates
that
increase
molecular
chain
segment
mobility,
allowing
full
extension
debonding
dispersion
efficient
dissipation.
networks
not
only
facilitate
transfer,
but
also
dissipate
mechanical
during
network
destruction
due
breakage
fillers.
dispassion
stability
are
further
demonstrated
when
this
used
flexible
light
emitting
diodes
high‐power
chips.
work
provides
new
strategy
balancing
transfer.
Язык: Английский
Design of Soft/Hard Interface with High Adhesion Energy and Low Interfacial Thermal Resistance via Regulation of Interfacial Hydrogen Bonding Interaction
Nano Letters,
Год журнала:
2024,
Номер
24(21), С. 6386 - 6394
Опубликована: Май 14, 2024
Adhesion
ability
and
interfacial
thermal
transfer
capacity
at
soft/hard
interfaces
are
of
critical
importance
to
a
wide
variety
applications,
ranging
from
electronic
packaging
soft
electronics
batteries.
However,
these
two
properties
difficult
obtain
simultaneously
due
their
conflicting
nature
interfaces.
Herein,
we
report
polyurethane/silicon
interface
with
both
high
adhesion
energy
(13535
J
m
Язык: Английский