The effect of temperature on the mechanisms of Cu nanoparticle sintering: A molecular dynamic study

Powder Technology, Год журнала: 2024, Номер 440, С. 119802 - 119802

Опубликована: Апрель 23, 2024

Язык: Английский

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Exploring Surface-Driven Mechanisms for Low-Temperature Sintering of Nanoscale Copper

Applied Sciences, Год журнала: 2025, Номер 15(1), С. 476 - 476

Опубликована: Янв. 6, 2025

As the density of electronic packaging continues to rise, traditional soldering techniques encounter significant challenges, leading copper–copper direct bonding as a new high-density connection method. The high melting point copper presents difficulties for diffusion under standard conditions, thus making low-temperature focal research. In this study, we examine sintering process at various temperatures by constructing models with multiple nanoparticles and them different conditions. Our findings indicate that 600 K is crucial temperature sintering. Below threshold, predominantly depends on structural adjustments driven residual stresses particle contact. Conversely, above, activation rapid surface atomic motion enables further between nanoparticles, marked decrease in porosity. Mechanical testing sintered samples corroborated changes temperatures, demonstrating dynamic atoms inherent mechanisms significantly affects mechanical properties nanomaterials. These have important implications developing high-performance materials align evolving requirements modern devices.

Язык: Английский

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Effect of substrate surface roughness and parameters on the behavior of Cu nanoparticles sintering: A study by molecular dynamics simulation

Applied Surface Science, Год журнала: 2025, Номер unknown, С. 162744 - 162744

Опубликована: Фев. 1, 2025

Язык: Английский

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Ab initio molecular dynamics simulations on the combustion mechanism of Al/Fe2O3 nanothermite at various temperatures

Computational Materials Science, Год журнала: 2024, Номер 246, С. 113427 - 113427

Опубликована: Окт. 1, 2024

Язык: Английский

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