Computational Materials Science, Journal Year: 2024, Volume and Issue: 246, P. 113427 - 113427
Published: Oct. 1, 2024
Language: Английский
Computational Materials Science, Journal Year: 2024, Volume and Issue: 246, P. 113427 - 113427
Published: Oct. 1, 2024
Language: Английский
Powder Technology, Journal Year: 2024, Volume and Issue: 440, P. 119802 - 119802
Published: April 23, 2024
Language: Английский
Citations
4Applied Sciences, Journal Year: 2025, Volume and Issue: 15(1), P. 476 - 476
Published: Jan. 6, 2025
As the density of electronic packaging continues to rise, traditional soldering techniques encounter significant challenges, leading copper–copper direct bonding as a new high-density connection method. The high melting point copper presents difficulties for diffusion under standard conditions, thus making low-temperature focal research. In this study, we examine sintering process at various temperatures by constructing models with multiple nanoparticles and them different conditions. Our findings indicate that 600 K is crucial temperature sintering. Below threshold, predominantly depends on structural adjustments driven residual stresses particle contact. Conversely, above, activation rapid surface atomic motion enables further between nanoparticles, marked decrease in porosity. Mechanical testing sintered samples corroborated changes temperatures, demonstrating dynamic atoms inherent mechanisms significantly affects mechanical properties nanomaterials. These have important implications developing high-performance materials align evolving requirements modern devices.
Language: Английский
Citations
0Applied Surface Science, Journal Year: 2025, Volume and Issue: unknown, P. 162744 - 162744
Published: Feb. 1, 2025
Language: Английский
Citations
0Computational Materials Science, Journal Year: 2024, Volume and Issue: 246, P. 113427 - 113427
Published: Oct. 1, 2024
Language: Английский
Citations
0