Ultra-fine quantitative removal of silicon materials by femtosecond laser DOI Creative Commons
Tong Chen, Jiang Li, Pengna Wei

и другие.

AIP Advances, Год журнала: 2024, Номер 14(12)

Опубликована: Дек. 1, 2024

The development of miniaturized electronic devices is highly dependent on precision manufacturing techniques. To achieve device miniaturization, material removal and processing accuracy down to the submicrometer or even nanometer level are required. machining mass block, a key component silicon micro-gyroscope, taken as reference. positioning function at certain position Si-based block must be precisely controlled. Therefore, ultra-fine quantitative process materials studied. A femtosecond laser system constructed, evolution micro–nanostructure etching depth surface explored. An developed different depths surface. experimental results show that minimum thickness can 0.502 µm. index requirement for less than 0.001 mm has been fulfilled. It critical resolve issue high-quality silicon-based devices.

Язык: Английский

Minor Cu modification endows inactive industrial FeSiBNbCu metallic glass with robust azo dye degradation activity DOI

Jiajia Si,

Lu Shuang,

Hengwei Luan

и другие.

Applied Surface Science, Год журнала: 2025, Номер unknown, С. 162511 - 162511

Опубликована: Янв. 1, 2025

Язык: Английский

Процитировано

3

Investigation of electrical-assisted micro-pattern forming process on Zircaloy-4 alloy surface DOI
Tong Niu, Yuanxin Luo, Yang Luo

и другие.

Journal of Manufacturing Processes, Год журнала: 2025, Номер 134, С. 452 - 465

Опубликована: Янв. 1, 2025

Язык: Английский

Процитировано

0

Laser-based additive manufacturing of bulk metallic glasses: A review on principle, microstructure and performance DOI Creative Commons

Jiapeng Ren,

Dongsheng Wang,

Xuehua Wu

и другие.

Materials & Design, Год журнала: 2025, Номер unknown, С. 113750 - 113750

Опубликована: Фев. 1, 2025

Язык: Английский

Процитировано

0

Molecular dynamics study on the atomic configuration evolution and suppression of shear bands for Zr-based metallic glass during cutting processing DOI
Yin Liu, Cuiping Li, Fei Pan

и другие.

Applied Physics A, Год журнала: 2025, Номер 131(4)

Опубликована: Март 21, 2025

Язык: Английский

Процитировано

0

A review on Mg-based metallic glasses for biomedical scaffolds: experimental and computational modeling DOI Open Access
Chijioke Raphael Onyeagba, Tuquabo Tesfamichael

Microstructures, Год журнала: 2025, Номер 5(2)

Опубликована: Март 24, 2025

Magnesium (Mg)-based metallic glasses have emerged as a promising class of biomaterials for various biomedical applications due to their unique properties, such high strength-to-weight ratio, good biocompatibility and biodegradability. The development Mg-based glass scaffolds is particular interest tissue engineering regenerative medicine applications. However, the rate biodegradability materials not well controlled requires extensive research efficient tissue/bone regeneration. This review provides comprehensive overview recent advancements in tuneable with different compositions thin film coatings. It discusses structural biological mechanical biodegradation behavior, fabrication techniques employed produce bulk scaffolds. Furthermore, explores surface modification permanent implants biodegradable simulate regeneration on implants. Optimization scaffold design increase growth healing by understanding complex interactions between tissues predicting long-term implant behavior using computational models are reviewed. challenges future directions this field also discussed, providing insights into potential applications, including bone engineering, wound healing, cardiovascular

Язык: Английский

Процитировано

0

Modulation of cell proliferation and differentiation on implantable biomaterials using femtosecond laser micro/nano-patterning technology DOI
Jiayi Xu,

Chaoyang Jiang,

Lizhong Wang

и другие.

Journal of Manufacturing Processes, Год журнала: 2025, Номер 146, С. 225 - 235

Опубликована: Май 5, 2025

Язык: Английский

Процитировано

0

Review on Principal and Applications of Temporal and Spatial Beam Shaping for Ultrafast Pulsed Laser DOI Creative Commons
Jong-Hyun Kim, Hae-Woon Choi

Photonics, Год журнала: 2024, Номер 11(12), С. 1140 - 1140

Опубликована: Дек. 4, 2024

Ultrafast or ultrashort pulsed lasers have become integral in numerous industrial applications due to their high precision, non-thermal interaction with materials, and ability induce nonlinear absorption. These characteristics expanded use microfabrication, semiconductor processing, automotive engineering, biomedical fields. Temporal pulse shaping reduces laser durations, often shorter timescales than many physical chemical processes, enabling greater control. Meanwhile, spatial improves efficiency precision micro- nanofabrication applications. Advances optical parametric amplifiers (OPAs) chirped-pulse (CPAs) allowed for more refined temporal shaping, ensuring the preservation of peak power while achieving durations. Additionally, light modulators (SLMs) facilitated sophisticated beam which, when combined ultrafast lasers, supports like computer-generated holography nanoscale fabrication. developments underscore growing utility versatility both research contexts.

Язык: Английский

Процитировано

1

Ultra-fine quantitative removal of silicon materials by femtosecond laser DOI Creative Commons
Tong Chen, Jiang Li, Pengna Wei

и другие.

AIP Advances, Год журнала: 2024, Номер 14(12)

Опубликована: Дек. 1, 2024

The development of miniaturized electronic devices is highly dependent on precision manufacturing techniques. To achieve device miniaturization, material removal and processing accuracy down to the submicrometer or even nanometer level are required. machining mass block, a key component silicon micro-gyroscope, taken as reference. positioning function at certain position Si-based block must be precisely controlled. Therefore, ultra-fine quantitative process materials studied. A femtosecond laser system constructed, evolution micro–nanostructure etching depth surface explored. An developed different depths surface. experimental results show that minimum thickness can 0.502 µm. index requirement for less than 0.001 mm has been fulfilled. It critical resolve issue high-quality silicon-based devices.

Язык: Английский

Процитировано

0