Ultra-fine quantitative removal of silicon materials by femtosecond laser DOI Creative Commons
Tong Chen, Jiang Li, Pengna Wei

et al.

AIP Advances, Journal Year: 2024, Volume and Issue: 14(12)

Published: Dec. 1, 2024

The development of miniaturized electronic devices is highly dependent on precision manufacturing techniques. To achieve device miniaturization, material removal and processing accuracy down to the submicrometer or even nanometer level are required. machining mass block, a key component silicon micro-gyroscope, taken as reference. positioning function at certain position Si-based block must be precisely controlled. Therefore, ultra-fine quantitative process materials studied. A femtosecond laser system constructed, evolution micro–nanostructure etching depth surface explored. An developed different depths surface. experimental results show that minimum thickness can 0.502 µm. index requirement for less than 0.001 mm has been fulfilled. It critical resolve issue high-quality silicon-based devices.

Language: Английский

Minor Cu modification endows inactive industrial FeSiBNbCu metallic glass with robust azo dye degradation activity DOI

Jiajia Si,

Lu Shuang,

Hengwei Luan

et al.

Applied Surface Science, Journal Year: 2025, Volume and Issue: unknown, P. 162511 - 162511

Published: Jan. 1, 2025

Language: Английский

Citations

3
Investigation of electrical-assisted micro-pattern forming process on Zircaloy-4 alloy surface DOI
Tong Niu, Yuanxin Luo, Yang Luo

et al.

Journal of Manufacturing Processes, Journal Year: 2025, Volume and Issue: 134, P. 452 - 465

Published: Jan. 1, 2025

Language: Английский

Citations

0
Laser-based additive manufacturing of bulk metallic glasses: A review on principle, microstructure and performance DOI Creative Commons

Jiapeng Ren,

Dongsheng Wang,

Xuehua Wu

et al.

Materials & Design, Journal Year: 2025, Volume and Issue: unknown, P. 113750 - 113750

Published: Feb. 1, 2025

Language: Английский

Citations

0
Molecular dynamics study on the atomic configuration evolution and suppression of shear bands for Zr-based metallic glass during cutting processing DOI
Yin Liu, Cuiping Li, Fei Pan

et al.

Applied Physics A, Journal Year: 2025, Volume and Issue: 131(4)

Published: March 21, 2025

Language: Английский

Citations

0
A review on Mg-based metallic glasses for biomedical scaffolds: experimental and computational modeling DOI Open Access
Chijioke Raphael Onyeagba, Tuquabo Tesfamichael

Microstructures, Journal Year: 2025, Volume and Issue: 5(2)

Published: March 24, 2025

Magnesium (Mg)-based metallic glasses have emerged as a promising class of biomaterials for various biomedical applications due to their unique properties, such high strength-to-weight ratio, good biocompatibility and biodegradability. The development Mg-based glass scaffolds is particular interest tissue engineering regenerative medicine applications. However, the rate biodegradability materials not well controlled requires extensive research efficient tissue/bone regeneration. This review provides comprehensive overview recent advancements in tuneable with different compositions thin film coatings. It discusses structural biological mechanical biodegradation behavior, fabrication techniques employed produce bulk scaffolds. Furthermore, explores surface modification permanent implants biodegradable simulate regeneration on implants. Optimization scaffold design increase growth healing by understanding complex interactions between tissues predicting long-term implant behavior using computational models are reviewed. challenges future directions this field also discussed, providing insights into potential applications, including bone engineering, wound healing, cardiovascular

Language: Английский

Citations

0
Modulation of cell proliferation and differentiation on implantable biomaterials using femtosecond laser micro/nano-patterning technology DOI
Jiayi Xu,

Chaoyang Jiang,

Lizhong Wang

et al.

Journal of Manufacturing Processes, Journal Year: 2025, Volume and Issue: 146, P. 225 - 235

Published: May 5, 2025

Language: Английский

Citations

0
Review on Principal and Applications of Temporal and Spatial Beam Shaping for Ultrafast Pulsed Laser DOI Creative Commons
Jong-Hyun Kim, Hae-Woon Choi

Photonics, Journal Year: 2024, Volume and Issue: 11(12), P. 1140 - 1140

Published: Dec. 4, 2024

Ultrafast or ultrashort pulsed lasers have become integral in numerous industrial applications due to their high precision, non-thermal interaction with materials, and ability induce nonlinear absorption. These characteristics expanded use microfabrication, semiconductor processing, automotive engineering, biomedical fields. Temporal pulse shaping reduces laser durations, often shorter timescales than many physical chemical processes, enabling greater control. Meanwhile, spatial improves efficiency precision micro- nanofabrication applications. Advances optical parametric amplifiers (OPAs) chirped-pulse (CPAs) allowed for more refined temporal shaping, ensuring the preservation of peak power while achieving durations. Additionally, light modulators (SLMs) facilitated sophisticated beam which, when combined ultrafast lasers, supports like computer-generated holography nanoscale fabrication. developments underscore growing utility versatility both research contexts.

Language: Английский

Citations

1
Ultra-fine quantitative removal of silicon materials by femtosecond laser DOI Creative Commons
Tong Chen, Jiang Li, Pengna Wei

et al.

AIP Advances, Journal Year: 2024, Volume and Issue: 14(12)

Published: Dec. 1, 2024

The development of miniaturized electronic devices is highly dependent on precision manufacturing techniques. To achieve device miniaturization, material removal and processing accuracy down to the submicrometer or even nanometer level are required. machining mass block, a key component silicon micro-gyroscope, taken as reference. positioning function at certain position Si-based block must be precisely controlled. Therefore, ultra-fine quantitative process materials studied. A femtosecond laser system constructed, evolution micro–nanostructure etching depth surface explored. An developed different depths surface. experimental results show that minimum thickness can 0.502 µm. index requirement for less than 0.001 mm has been fulfilled. It critical resolve issue high-quality silicon-based devices.

Language: Английский

Citations

0