Thermally Conductive Polydimethylsiloxane-Based Composite with Vertically Aligned Hexagonal Boron Nitride DOI Open Access
HaoSen Lin,

Genghao Xu,

Zihao Chen

и другие.

Polymers, Год журнала: 2024, Номер 16(22), С. 3126 - 3126

Опубликована: Ноя. 8, 2024

The considerable heat generated in electronic devices, resulting from their high-power consumption and dense component integration, underscores the importance of developing effective thermal interface materials. While composite materials are ideal for this application, random distribution filling leads to numerous interfaces, limiting improvements transfer capabilities. An method improve conductivity composites is alignment anisotropic fillers, such as hexagonal boron nitride (BN). In study, repeat blade coating was employed horizontally align BN within a polydimethylsiloxane (PDMS) matrix, followed by flipping cutting prepare BN/PDMS with vertically aligned (V-BP). V-BP 30 wt.% exhibited an enhanced out-of-plane up 1.24 W/mK. Compared PDMS, outstanding dissipation capacities. addition, its low density exceptional electrical insulation properties showcase potential being used devices. impact velocity on performance further studied through computational fluid dynamics simulation. results showed that increasing approximately 40% compared those prepared at slower velocities. This study provides promising approach producing large scale effectively dissipate accumulated densely integrated

Язык: Английский

Enhancing thermal conductivity in polysiloxane composites through synergistic design of liquid crystals and boron nitride nanosheets DOI

Xiao Ma,

Haitian Zhang,

Yongqiang Guo

и другие.

Journal of Material Science and Technology, Год журнала: 2025, Номер unknown

Опубликована: Фев. 1, 2025

Язык: Английский

Процитировано

2

Macro/Micro Synergistic Thermal Conductivity Enhancement in Liquid Metal-Based Phase Change Composites for Thermal Management in Electronic Devices DOI
Guangyin Liu, Kun Shang,

Shiqi Chen

и другие.

Composites Science and Technology, Год журнала: 2025, Номер unknown, С. 111120 - 111120

Опубликована: Фев. 1, 2025

Язык: Английский

Процитировано

1

Boron Nitride‐Polymer Composites with High Thermal Conductivity: Preparation, Functionalization Strategy and Innovative Structural Regulation DOI Open Access
Mengsha Li,

Seong-Ryeol Han,

Chengyi Dan

и другие.

Small, Год журнала: 2025, Номер unknown

Опубликована: Март 30, 2025

Abstract The escalating thermal challenges posed by increasing power densities in electronic devices emerge as a critical barrier to maintain their sustained and reliable operation. Addressing this issue requires the strategic development of materials with superior conductivity properties facilitate progress high‐power electronics development. Thermal conductive polymer composites incorporating ceramic material renowned for exceptional adjustability, insulating properties, moldability, are emerging promising solution urgent challenge. Hexagonal boron nitride (h‐BN) nanomaterials highly candidates management applications, owing mechanical stability, remarkable coefficients, minimal expansion characteristics, outstanding chemical inertness. In work, ≈10 years on high nitride‐filled is thoroughly summarized. Moreover, strategies h‐BN other nanomaterials‐filled at synthesis, functionalization, innovative structural design discussed detail. main future nitride‐polymer also proposed, which will provide meaningful guidance practical applications materials.

Язык: Английский

Процитировано

0

Highly Thermally Conductive Boron Nitride Fiber DOI

PeiChi Liao,

Haiyu He, Haichang Guo

и другие.

ACS Nano, Год журнала: 2025, Номер unknown

Опубликована: Апрель 14, 2025

Innovative thermal management fiber materials have emerged as a solution to address challenges across diverse fields, ranging from personal comfort and electronic device cooling aerospace engineering. While graphene is known for its higher conductivity over conventional carbon fiber, boron nitride (BN) has received much less attention in one-dimensional form, despite combined high notable insulating properties. Previous studies mainly focused on composite fibers with BN nanosheets embedded polymer matrix. In contrast, pure consequent investigations single-fiber level barely been reported. this study, we report the fabrication of continuous, via polymer-derived ceramic approach thermally conductive fillers. Comprehensive structural characterizations confirm fibers' quality purity without apparent contamination. With big-MEMS method developed, single precisely measured reaches an impressive 54 W m-1 K-1. Furthermore, using stacking-cutting method, resulting vertically aligned fiber-reinforced epoxy demonstrates 24 K-1, showing immense potential usage interface material. This work explores electrically applications.

Язык: Английский

Процитировано

0

Reactive extrusion for efficient preparation of high temperature resistant PA6T/66/BN composites with great thermal management and mechanical properties DOI

Zejun Cao,

S. G. Zhang,

Chen Wang

и другие.

Composites Communications, Год журнала: 2024, Номер 52, С. 102121 - 102121

Опубликована: Окт. 11, 2024

Язык: Английский

Процитировано

2

Highly Intrinsic Thermal Conductivity of Aramid Nanofiber Films by Manipulating Intermolecular Hydrogen Bonding Interactions DOI

Niu Jiang,

Yajing Song, Lu‐Ning Wang

и другие.

Advanced Functional Materials, Год журнала: 2024, Номер unknown

Опубликована: Ноя. 9, 2024

Abstract Lightweight, flexible, and thermostable thermally conductive materials are essential for enhancing heat dissipation efficiency in advanced electronics. The development of intrinsic polymers is the key to expanding space improving thermal conductivity polymer‐based management materials. In order balance mechanical performance bulk polymers, aramid nanofiber (ANF) films assembled by manipulating proton‐donating ability solvents. Compared water as a conventional proton donor, ethanol‐induced multi‐scale structures composed dense hydrogen bonding interaction, large grain size, uniform fiber topology endow resulting ANF with enhanced up 5.05 W m −1 K 34% increase, salient tensile strength 181.4 MPa, exceptional stability higher than 500 °C. These outstanding properties provide many possibilities preparation

Язык: Английский

Процитировано

2

Thermally Conductive Polydimethylsiloxane-Based Composite with Vertically Aligned Hexagonal Boron Nitride DOI Open Access
HaoSen Lin,

Genghao Xu,

Zihao Chen

и другие.

Polymers, Год журнала: 2024, Номер 16(22), С. 3126 - 3126

Опубликована: Ноя. 8, 2024

The considerable heat generated in electronic devices, resulting from their high-power consumption and dense component integration, underscores the importance of developing effective thermal interface materials. While composite materials are ideal for this application, random distribution filling leads to numerous interfaces, limiting improvements transfer capabilities. An method improve conductivity composites is alignment anisotropic fillers, such as hexagonal boron nitride (BN). In study, repeat blade coating was employed horizontally align BN within a polydimethylsiloxane (PDMS) matrix, followed by flipping cutting prepare BN/PDMS with vertically aligned (V-BP). V-BP 30 wt.% exhibited an enhanced out-of-plane up 1.24 W/mK. Compared PDMS, outstanding dissipation capacities. addition, its low density exceptional electrical insulation properties showcase potential being used devices. impact velocity on performance further studied through computational fluid dynamics simulation. results showed that increasing approximately 40% compared those prepared at slower velocities. This study provides promising approach producing large scale effectively dissipate accumulated densely integrated

Язык: Английский

Процитировано

1