Enhancing thermal conductivity in polysiloxane composites through synergistic design of liquid crystals and boron nitride nanosheets
Xiao Ma,
No information about this author
Haitian Zhang,
No information about this author
Yongqiang Guo
No information about this author
et al.
Journal of Material Science and Technology,
Journal Year:
2025,
Volume and Issue:
unknown
Published: Feb. 1, 2025
Language: Английский
Macro/Micro Synergistic Thermal Conductivity Enhancement in Liquid Metal-Based Phase Change Composites for Thermal Management in Electronic Devices
Guangyin Liu,
No information about this author
Kun Shang,
No information about this author
Shiqi Chen
No information about this author
et al.
Composites Science and Technology,
Journal Year:
2025,
Volume and Issue:
unknown, P. 111120 - 111120
Published: Feb. 1, 2025
Language: Английский
Boron Nitride‐Polymer Composites with High Thermal Conductivity: Preparation, Functionalization Strategy and Innovative Structural Regulation
Mengsha Li,
No information about this author
Seong-Ryeol Han,
No information about this author
Chengyi Dan
No information about this author
et al.
Small,
Journal Year:
2025,
Volume and Issue:
unknown
Published: March 30, 2025
Abstract
The
escalating
thermal
challenges
posed
by
increasing
power
densities
in
electronic
devices
emerge
as
a
critical
barrier
to
maintain
their
sustained
and
reliable
operation.
Addressing
this
issue
requires
the
strategic
development
of
materials
with
superior
conductivity
properties
facilitate
progress
high‐power
electronics
development.
Thermal
conductive
polymer
composites
incorporating
ceramic
material
renowned
for
exceptional
adjustability,
insulating
properties,
moldability,
are
emerging
promising
solution
urgent
challenge.
Hexagonal
boron
nitride
(h‐BN)
nanomaterials
highly
candidates
management
applications,
owing
mechanical
stability,
remarkable
coefficients,
minimal
expansion
characteristics,
outstanding
chemical
inertness.
In
work,
≈10
years
on
high
nitride‐filled
is
thoroughly
summarized.
Moreover,
strategies
h‐BN
other
nanomaterials‐filled
at
synthesis,
functionalization,
innovative
structural
design
discussed
detail.
main
future
nitride‐polymer
also
proposed,
which
will
provide
meaningful
guidance
practical
applications
materials.
Language: Английский
Highly Thermally Conductive Boron Nitride Fiber
PeiChi Liao,
No information about this author
Haiyu He,
No information about this author
Haichang Guo
No information about this author
et al.
ACS Nano,
Journal Year:
2025,
Volume and Issue:
unknown
Published: April 14, 2025
Innovative
thermal
management
fiber
materials
have
emerged
as
a
solution
to
address
challenges
across
diverse
fields,
ranging
from
personal
comfort
and
electronic
device
cooling
aerospace
engineering.
While
graphene
is
known
for
its
higher
conductivity
over
conventional
carbon
fiber,
boron
nitride
(BN)
has
received
much
less
attention
in
one-dimensional
form,
despite
combined
high
notable
insulating
properties.
Previous
studies
mainly
focused
on
composite
fibers
with
BN
nanosheets
embedded
polymer
matrix.
In
contrast,
pure
consequent
investigations
single-fiber
level
barely
been
reported.
this
study,
we
report
the
fabrication
of
continuous,
via
polymer-derived
ceramic
approach
thermally
conductive
fillers.
Comprehensive
structural
characterizations
confirm
fibers'
quality
purity
without
apparent
contamination.
With
big-MEMS
method
developed,
single
precisely
measured
reaches
an
impressive
54
W
m-1
K-1.
Furthermore,
using
stacking-cutting
method,
resulting
vertically
aligned
fiber-reinforced
epoxy
demonstrates
24
K-1,
showing
immense
potential
usage
interface
material.
This
work
explores
electrically
applications.
Language: Английский
Reactive extrusion for efficient preparation of high temperature resistant PA6T/66/BN composites with great thermal management and mechanical properties
Zejun Cao,
No information about this author
S. G. Zhang,
No information about this author
Chen Wang
No information about this author
et al.
Composites Communications,
Journal Year:
2024,
Volume and Issue:
52, P. 102121 - 102121
Published: Oct. 11, 2024
Language: Английский
Highly Intrinsic Thermal Conductivity of Aramid Nanofiber Films by Manipulating Intermolecular Hydrogen Bonding Interactions
Niu Jiang,
No information about this author
Yajing Song,
No information about this author
Lu‐Ning Wang
No information about this author
et al.
Advanced Functional Materials,
Journal Year:
2024,
Volume and Issue:
unknown
Published: Nov. 9, 2024
Abstract
Lightweight,
flexible,
and
thermostable
thermally
conductive
materials
are
essential
for
enhancing
heat
dissipation
efficiency
in
advanced
electronics.
The
development
of
intrinsic
polymers
is
the
key
to
expanding
space
improving
thermal
conductivity
polymer‐based
management
materials.
In
order
balance
mechanical
performance
bulk
polymers,
aramid
nanofiber
(ANF)
films
assembled
by
manipulating
proton‐donating
ability
solvents.
Compared
water
as
a
conventional
proton
donor,
ethanol‐induced
multi‐scale
structures
composed
dense
hydrogen
bonding
interaction,
large
grain
size,
uniform
fiber
topology
endow
resulting
ANF
with
enhanced
up
5.05
W
m
−1
K
34%
increase,
salient
tensile
strength
181.4
MPa,
exceptional
stability
higher
than
500
°C.
These
outstanding
properties
provide
many
possibilities
preparation
Language: Английский
Thermally Conductive Polydimethylsiloxane-Based Composite with Vertically Aligned Hexagonal Boron Nitride
HaoSen Lin,
No information about this author
Genghao Xu,
No information about this author
Zihao Chen
No information about this author
et al.
Polymers,
Journal Year:
2024,
Volume and Issue:
16(22), P. 3126 - 3126
Published: Nov. 8, 2024
The
considerable
heat
generated
in
electronic
devices,
resulting
from
their
high-power
consumption
and
dense
component
integration,
underscores
the
importance
of
developing
effective
thermal
interface
materials.
While
composite
materials
are
ideal
for
this
application,
random
distribution
filling
leads
to
numerous
interfaces,
limiting
improvements
transfer
capabilities.
An
method
improve
conductivity
composites
is
alignment
anisotropic
fillers,
such
as
hexagonal
boron
nitride
(BN).
In
study,
repeat
blade
coating
was
employed
horizontally
align
BN
within
a
polydimethylsiloxane
(PDMS)
matrix,
followed
by
flipping
cutting
prepare
BN/PDMS
with
vertically
aligned
(V-BP).
V-BP
30
wt.%
exhibited
an
enhanced
out-of-plane
up
1.24
W/mK.
Compared
PDMS,
outstanding
dissipation
capacities.
addition,
its
low
density
exceptional
electrical
insulation
properties
showcase
potential
being
used
devices.
impact
velocity
on
performance
further
studied
through
computational
fluid
dynamics
simulation.
results
showed
that
increasing
approximately
40%
compared
those
prepared
at
slower
velocities.
This
study
provides
promising
approach
producing
large
scale
effectively
dissipate
accumulated
densely
integrated
Language: Английский