Tailored binder-free ternary metal chalcogenide anchored on Ni foam as a new positrode for ultra-high energy density asymmetric supercapacitors

Journal of Energy Storage, Journal Year: 2024, Volume and Issue: 82, P. 110423 - 110423

Published: Jan. 21, 2024

Language: Английский

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Sintering of inkjet-printed silver nanoparticles by large-area atmospheric pressure nitrogen plasma

Applied Physics A, Journal Year: 2025, Volume and Issue: 131(2)

Published: Jan. 8, 2025

Abstract Silver nanoparticles were sintered at atmospheric pressure using nitrogen plasma generated by diffuse coplanar surface barrier discharge (DCSBD). Compared to the standard thermal sintering of 1 h 140 °C only 8 min nonthermal treatment 50 necessary sufficiently anneal silver nanoparticle film. Electrical resistivity as low 9 × 10 –6 Ω cm was achieved, i.e., 17% bulk conductivity silver. X-ray photoelectron spectroscopy used study removal organic moieties from inkjet-printed layers. Scanning electron microscopy revealed in detail process formation interconnection between nanoparticles. Our findings pave way for implementing low-cost and eco-friendly DCSBD into continuous roll-to-roll processing future annealing on substrates that cannot tolerate high temperatures.

Language: Английский

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Insulating Electrets Converted from Organic Semiconductor for High‐Performance Transistors, Memories, and Artificial Synapses

Advanced Functional Materials, Journal Year: 2023, Volume and Issue: 33(45)

Published: Aug. 7, 2023

Abstract Electrets are commonly used charged insulators that generate a quasi‐permanent electric field. However, when conventional electrets come into direct contact with semiconductors, the energy level mismatch at interface results in low memory speed and high consumption of electret devices due to both charge injection storage being non‐conducive. To address this, n‐type semiconductor N,N′‐dioctyl‐3,4,9,10‐perylene tetracarboxylic diimide (C 8 ‐PTCDI) is converted C ‐PTCDI (D) via oxygen degradation. The resulting electrets, using an field and/or light, retain semiconductors facilitate trapping. They also exhibit deeper trap levels increased density, thereby enhancing sheet density (7.47 × 10 12 cm −2 ). As result, based on demonstrate lower operation voltage (2 V) transistors, (20 memories, (3.5 fJ per spike) artificial synapses compared those without electrets.

Language: Английский

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Comparative investigations of electronic, mechanical and optical responses of Ra-doping in Barium Titanate for optoelectronic applications: A computational insight

Heliyon, Journal Year: 2024, Volume and Issue: 10(2), P. e24607 - e24607

Published: Jan. 1, 2024

This unique study examined the theoretical pure BaTiO3 and doped Ra (Ba1-xRaxTiO3) impact on electronic, mechanical optical responses were using Heydscuseria-Ernzerhof screened hybrid functional (HSE06) generalized gradient approximation (GGA-PBE) with norm-converging pseudopotential approaches in density theory. Computed lattice constant bond lengths for (BaTiO3) atoms as well explored changes of consequences responses. The calculated values indicate is an indirect characteristic optically inactive nature. low energy state also conduction band crystal structure to transform direction narrows electronic gap. bandgap continually reduced which shifts Fermi level Eg. When increasing doping impurities (x) (Ra) BaTiO3, gap from (X-G) direct (X-X) nature become active. elastic are essential suitable material ensuring structural integrity predicting a ductile behavior. Kleinman coefficient (ξ), it clear that (Ra)-doped materials shows slightly large resistance bending angle distortion compare BaTiO3. Optical characteristics both core spectra thoroughly investigated. coefficients obtained scale start 0 20 eV. Moreover, results properties show excellent influence so this can be employed UV filter region optoelectronics devices.

Language: Английский

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All-Solution-Processed Electronics with Sub-Microscale Resolution and Nanoscale Fidelity Fabricated Via a Humidity-Controlled, Surface Energy-Directed Assembly Process

ACS Nano, Journal Year: 2024, Volume and Issue: 18(31), P. 20493 - 20503

Published: July 13, 2024

Solution-based processes have received considerable attention in the fabrication of electronics and sensors owing to their merits being low-cost, vacuum-free, simple equipment. However, current solution-based either lack patterning capability or low resolution (tens micrometers) pattern fidelity terms line edge roughness (LER, several micrometers). Here, we present a surface energy-directed assembly (SEDA) process fabricate metal oxide patterns with up 2 orders magnitude improvement (800 nm) LER (16 nm). Experiment results show that high can be achieved only at relative humidities below 30%. The reason for this phenomenon lies negligible water condensation on solution droplet. Employing SEDA process, all-solution-processed thin film transistors (TFTs) are fabricated by using indium as channel layers, tin source/drain electrodes gate electrodes, aluminum dielectrics. TFT-based logic circuits, including NOT, NOR, NAND, AND well, demonstrating applicability fabricating large area functional electronics.

Language: Английский

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On‐Demand Sintering of Gold Nanoparticles via Controlled Removal of o‐Nitrobenzyl Thiol Ligands Under Record‐Low Power for Conductive Patterns

Advanced Science, Journal Year: 2025, Volume and Issue: unknown

Published: Jan. 31, 2025

Metal nanoparticles-based nanoinks have shown potential for fabricating metallic components essential to the realization of innovative 3D-printed electronic devices. However, patterns on flexible, heat-sensitive substrates remains challenging due high temperature and energy sources, such as intense pulsed light (IPL), involved in sintering process. Here an efficient method is presented using ultralow power UV by leveraging photocleavable ligand, o-nitrobenzyl thiol (NT), - functionalized gold nanoparticles (AuNPs). The controlled removal NT ligands upon irradiation enhances absorption reducing filling factor voids printed layer, increasing layer temperature, facilitating further ligand desorption. This positive feedback mechanism accelerates nanoparticle at several orders magnitude lower than IPL, achieving electrical conductivity 7.0 × 106 S m-1. nanoink promises parallel printing multimaterial through photonic multifunctional

Language: Английский

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High‐Performance Flexible Electronics Fabricated Using a Surface Energy‐Directed Assembly Process on Ultrathin Polyimide Substrates

Small, Journal Year: 2025, Volume and Issue: unknown

Published: Feb. 3, 2025

Abstract Solution‐based processes are emerging in the fabrication of flexible electronics owing to their cost‐effectiveness, low‐temperature processing capabilities, and vacuum‐free operations. Currently, printing techniques, as most widely used solution‐based processes, suffer from low resolution poor pattern fidelity. Although surface energy‐directed assembly (SEDA) process enables unparalleled fidelity, multilayer application on substrates rarely attempted. Here, a SEDA is for fabricating metal oxide thin film transistors (TFTs) ultrathin polyimide (PI) with thickness ≈35 µm. Comprehensive procedures render PI hydrophobic well homogenize hydrophobicity as‐assembled layers developed. All‐solution‐processed TFTs constructed by assembling indium semiconducting channels, tin source/drain electrodes, aluminum gate dielectric layers, electrodes ordinally. The exhibit excellent electrical properties an average mobility 22.01 cm 2 V −1 s stable operation under mechanical strain. Flexible inverters high voltage gain 78 dynamic frequency up 1 kHz also constructed, representing new opportunities next‐generation electronics.

Language: Английский

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Combinatorial Optimization and Large‐Scale Integration of Organic, Low‐Energy, and Fully‐Printed Flexible Ribbon Photosensors

Advanced Electronic Materials, Journal Year: 2025, Volume and Issue: unknown

Published: Feb. 14, 2025

Abstract The development and optimization of flexible electronics has allowed technology to be better integrated in applications environments where the physically rigid nature is previously a limiting factor. Printing techniques contribute lowering fabrication costs making manufacturing‐on‐demand viable. use user interface domain been explored with solution‐processed optical photodetectors created feasibility using sensors demonstrated augmented paper applications. In this work, low‐cost are developed scalable printing techniques, their electrical performance analyzed, stability over time studied both air vacuum, structure optimized through combinatorial experiment, integration method for creating larger, addressable arrays detectors. This demonstration how methods allow easy, cost‐effective, low‐energy manufacturing uniform stable photosensors.

Language: Английский

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In-situ alleviation of surface modifier passivation effects in silver nanoparticle laser sintering process

Journal of Manufacturing Processes, Journal Year: 2025, Volume and Issue: 139, P. 239 - 249

Published: Feb. 20, 2025

Language: Английский

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EXPLORING QUANTUM WELLS IN OLED TECHNOLOGIES: A COMPREHENSIVE REVIEW OF APPLICATIONS AND ADVANCEMENTS

Ukrainian Journal of Physical Optics, Journal Year: 2025, Volume and Issue: 26(2), P. 02001 - 02047

Published: Jan. 1, 2025

Language: Английский

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