Optimized design of thermal conductivity characteristics of contact interface for enhanced thermal contact properties DOI
Chen Wang, Kaiyang Yin, Jun Hong

et al.

International Journal of Heat and Mass Transfer, Journal Year: 2024, Volume and Issue: 240, P. 126635 - 126635

Published: Dec. 31, 2024

Language: Английский

Thermal interface materials: From fundamental research to applications DOI Creative Commons
Baojie Wei,

Wenmei Luo,

Jianying Du

et al.

SusMat, Journal Year: 2024, Volume and Issue: unknown

Published: Sept. 23, 2024

Abstract The miniaturization, integration, and high data throughput of electronic chips present challenging demands on thermal management, especially concerning heat dissipation at interfaces, which is a fundamental scientific question as well an engineering problem—a death problem called in semiconductor industry. A comprehensive examination interfacial resistance has been given from physics perspective 2022 Review Modern Physics . Here, we provide detailed overview materials perspective, focusing the optimization structure compositions interface (TIMs) interact/contact with source sink. First, discuss impact conductivity, bond line thickness, contact TIMs. Second, it pointed out that there are two major routes to improve transfer through interface. One reduce TIM's ( R TIM ) TIMs strategies like incorporating conductive fillers, enhancing treatment techniques. other c by improving effective contact, strengthening bonding, utilizing mass gradient alleviate vibrational mismatch between source/sink. Finally, such challenges theories, potential developments sustainable TIMs, application AI design also explored.

Language: Английский

Citations

11
Dynamic host–guest/π–π multiple bonds of alginate-based super-amphiphiles reinforced the mechanical stability and foliar deposition of jammed emulsion droplet DOI
Shujuan Yang,

Furui He,

Keyang Mai

et al.

Chemical Engineering Journal, Journal Year: 2025, Volume and Issue: 505, P. 159377 - 159377

Published: Jan. 9, 2025

Language: Английский

Citations

0
Thermodynamic coupling in micro-nanocavity graphene/paraffin phase change energy storage materials under impact loading DOI
Yuhao Wang, Junhong Yu,

Wentian Huang

et al.

Applied Physics Letters, Journal Year: 2025, Volume and Issue: 126(8)

Published: Feb. 24, 2025

Micro-nanocavity graphene/paraffin nanocomposites (MNGPNs) are emerging as promising phase change materials for passive thermal management in electronics, utilizing the superior conductivity of graphene conjunction with excellent heat storage capacity paraffin. However, current assessments MNGPNs performance primarily conducted under laboratory static conditions, which do not fully represent complex overload environments encountered practical applications. In this study, we strain freezing experiments using a split Hopkinson pressure bar and performed recovery analysis to investigate influence dynamic loading on behavior through postmortem microstructural characterizations. Our findings reveal significant thermodynamic coupling effects in-plane direction, while out-of-plane direction were less apparent. Specifically, increase internal resistance impact loading, due cracking, shedding, directional changes structure, diminishes transfer direction. Alternations interfacial caused by layer compression shedding affect capacity. Furthermore, was validated dissipation experiments. This work provides valuable insights applications MNGPNs, highlighting their from perspective.

Language: Английский

Citations

0
Photothermal and Robust Supramolecular Soft Material Cross-Linked by Dinuclear Heterodentate Coordination DOI
Huijuan Lu,

Haohan Tong,

Bingbing Gao

et al.

Materials Horizons, Journal Year: 2025, Volume and Issue: unknown

Published: Jan. 1, 2025

Efficient, green, and intrinsic solar-photothermal conversion elastomers are crucial for sustainable energy solutions.

Language: Английский

Citations

0
Reactive extrusion for efficient preparation of high temperature resistant PA6T/66/BN composites with great thermal management and mechanical properties DOI

Zejun Cao,

S. G. Zhang,

Chen Wang

et al.

Composites Communications, Journal Year: 2024, Volume and Issue: 52, P. 102121 - 102121

Published: Oct. 11, 2024

Language: Английский

Citations

2
Optimized design of thermal conductivity characteristics of contact interface for enhanced thermal contact properties DOI
Chen Wang, Kaiyang Yin, Jun Hong

et al.

International Journal of Heat and Mass Transfer, Journal Year: 2024, Volume and Issue: 240, P. 126635 - 126635

Published: Dec. 31, 2024

Language: Английский

Citations

0