Texturization and Dense Dislocations Boost Elastic Bendability of Metallic Thermoelectric Generator DOI Creative Commons
Xinyi Shen, Wenjun Ding,

Zimin Fan

et al.

Energy & environment materials, Journal Year: 2025, Volume and Issue: unknown

Published: May 19, 2025

Elastic strain constitutes a decisive factor in determining the recoverable deformability of thermoelectric materials. Plastic deformation for microstructure engineering has been demonstrated as viable approach to enhance elastic strain. However, this is highly dependent on material's plasticity, which rather limited by rigidity majority inorganic semiconducting Thermocouple materials, metallic possess favorable motivating work focus bendability generator that composed K‐type thermocouple components, namely p‐type Ni 90 Cr 10 and n‐type 95 Al 2 Mn Si. The cold‐rolling process enables large modulus high yield strength, thanks texturized direction along <111>, dense dislocations refined grains, respectively, eventually resulting 400% increase Such superior elasticity ensures preservation initial transport properties rolled films even after being bent 100 000 times within radius ~8 mm. A power output ~414 μW achieved ten‐leg flexible device, suggesting its substantial potential powering wearable electronics.

Language: Английский

Sandwich Engineering Advances Ductile Thermoelectrics DOI Creative Commons
Hao Wu, Xiao‐Lei Shi,

Meng Li

et al.

Advanced Materials, Journal Year: 2025, Volume and Issue: unknown

Published: May 13, 2025

Abstract Flexible thermoelectrics offer the possibility of utilizing human body heat to generate electricity, enabling self‐powered wearable electronics. Ductile and plastic semiconductors are promising materials for flexible due their inherent ductility tunable electrical properties. However, balancing with high thermoelectric performance remains challenging, especially n‐type materials. Here, a novel ductile Ag 2 (S, Se)‐Ag Se sandwich‐like film is designed different functional layers, where Se) core layer provides deformation ability low thermal conductivity, while epitaxially grown highly oriented shell layers ensure superior transport performance. This architecture achieves record figure‐of‐merit near room‐temperature range, 0.91 at 323 K, among preserving excellent flexibility. Additionally, in‐plane device fabricated from this material delivers an exceptional power density 26.5 W m −2 temperature difference 50 demonstrating its great application potential Importantly, such sandwich engineering can pave way alleviate compromise between in inorganic semiconductors.

Language: Английский

Citations

1
Advances and challenges in inorganic bulk-based flexible thermoelectric devices DOI Creative Commons

Qing-Yi Liu,

Xiao‐Lei Shi, Tianyi Cao

et al.

Progress in Materials Science, Journal Year: 2024, Volume and Issue: unknown, P. 101420 - 101420

Published: Dec. 1, 2024

Language: Английский

Citations

3
Solvothermally optimizing Ag2Te/Ag2S composites with high thermoelectric performance and plasticity DOI
Min Zhu, Xiao‐Lei Shi, Meng Li

et al.

Materials Horizons, Journal Year: 2025, Volume and Issue: unknown

Published: Jan. 1, 2025

The Ag 2 Te/Ag S composites were fabricated for the first time using a facile solvothermal method practical applications, and ZT values of ∼0.42 at 373 K ∼0.38 298 achieved, both exceeding those pure Te.

Language: Английский

Citations

0
Exceptional room-temperature processability of Ag2(S,Te) by iterative sublattice amorphization DOI
Yumeng Wang, Pengfei Qiu, Shiqi Yang

et al.

Science China Materials, Journal Year: 2025, Volume and Issue: unknown

Published: April 24, 2025

Language: Английский

Citations

0
Texturization and Dense Dislocations Boost Elastic Bendability of Metallic Thermoelectric Generator DOI Creative Commons
Xinyi Shen, Wenjun Ding,

Zimin Fan

et al.

Energy & environment materials, Journal Year: 2025, Volume and Issue: unknown

Published: May 19, 2025

Elastic strain constitutes a decisive factor in determining the recoverable deformability of thermoelectric materials. Plastic deformation for microstructure engineering has been demonstrated as viable approach to enhance elastic strain. However, this is highly dependent on material's plasticity, which rather limited by rigidity majority inorganic semiconducting Thermocouple materials, metallic possess favorable motivating work focus bendability generator that composed K‐type thermocouple components, namely p‐type Ni 90 Cr 10 and n‐type 95 Al 2 Mn Si. The cold‐rolling process enables large modulus high yield strength, thanks texturized direction along <111>, dense dislocations refined grains, respectively, eventually resulting 400% increase Such superior elasticity ensures preservation initial transport properties rolled films even after being bent 100 000 times within radius ~8 mm. A power output ~414 μW achieved ten‐leg flexible device, suggesting its substantial potential powering wearable electronics.

Language: Английский

Citations

0