Electronics,
Journal Year:
2024,
Volume and Issue:
13(21), P. 4287 - 4287
Published: Oct. 31, 2024
In
high-power
electronic
devices,
the
rapid
accumulation
of
heat
presents
significant
thermal
management
challenges
that
necessitate
development
advanced
interface
materials
(TIMs)
to
ensure
performance
and
reliability
devices.
TIMs
are
employed
facilitate
an
effective
stable
dissipation
pathway
between
heat-generating
components
sinks.
recent
years,
anisotropic
one-dimensional
two-dimensional
materials,
including
carbon
fibers,
graphene,
boron
nitride,
have
been
introduced
as
fillers
in
polymer-based
due
their
high
conductivity
specific
directions.
The
orientation
polymer
matrix
has
become
important
issue
a
new
generation
high-performance
TIMs.
To
provide
systematic
understanding
this
field,
paper
mainly
discusses
advances
oriented
with
(>10
W/(m·K)).
For
each
filler,
its
preparation
strategies
enhancement
mechanisms
analyzed
separately,
focus
on
construction
structures.
Notably,
there
few
reviews
related
fiber
TIMs,
details
research
results
field.
Finally,
challenges,
prospects,
future
directions
summarized
hope
stimulating
efforts.
SusMat,
Journal Year:
2024,
Volume and Issue:
unknown
Published: Sept. 23, 2024
Abstract
The
miniaturization,
integration,
and
high
data
throughput
of
electronic
chips
present
challenging
demands
on
thermal
management,
especially
concerning
heat
dissipation
at
interfaces,
which
is
a
fundamental
scientific
question
as
well
an
engineering
problem—a
death
problem
called
in
semiconductor
industry.
A
comprehensive
examination
interfacial
resistance
has
been
given
from
physics
perspective
2022
Review
Modern
Physics
.
Here,
we
provide
detailed
overview
materials
perspective,
focusing
the
optimization
structure
compositions
interface
(TIMs)
interact/contact
with
source
sink.
First,
discuss
impact
conductivity,
bond
line
thickness,
contact
TIMs.
Second,
it
pointed
out
that
there
are
two
major
routes
to
improve
transfer
through
interface.
One
reduce
TIM's
(
R
TIM
)
TIMs
strategies
like
incorporating
conductive
fillers,
enhancing
treatment
techniques.
other
c
by
improving
effective
contact,
strengthening
bonding,
utilizing
mass
gradient
alleviate
vibrational
mismatch
between
source/sink.
Finally,
such
challenges
theories,
potential
developments
sustainable
TIMs,
application
AI
design
also
explored.
ACS Nano,
Journal Year:
2024,
Volume and Issue:
18(34), P. 23468 - 23476
Published: Aug. 16, 2024
Highly
thermally
conductive
and
flexible
thermal
interface
materials
(TIMs)
are
desirable
for
heat
dissipation
in
modern
electronic
devices.
Here,
we
fabricated
a
high-crystalline
aligned
graphene
lamella
framework
(AGLF)
with
precisely
controlled
thickness,
pore
structure,
excellent
intergraphene
contact
by
manipulating
the
expansion
behavior
of
scanning
centrifugal
casted
oxide
films.
The
rational
design
AGLF
balances
trade-off
between
conductivity
flexibility
TIMs.
AGLF-based
TIM
(AGLF-TIM)
shows
record
196.3
W
m
Advanced Functional Materials,
Journal Year:
2024,
Volume and Issue:
unknown
Published: Nov. 9, 2024
Abstract
Lightweight,
flexible,
and
thermostable
thermally
conductive
materials
are
essential
for
enhancing
heat
dissipation
efficiency
in
advanced
electronics.
The
development
of
intrinsic
polymers
is
the
key
to
expanding
space
improving
thermal
conductivity
polymer‐based
management
materials.
In
order
balance
mechanical
performance
bulk
polymers,
aramid
nanofiber
(ANF)
films
assembled
by
manipulating
proton‐donating
ability
solvents.
Compared
water
as
a
conventional
proton
donor,
ethanol‐induced
multi‐scale
structures
composed
dense
hydrogen
bonding
interaction,
large
grain
size,
uniform
fiber
topology
endow
resulting
ANF
with
enhanced
up
5.05
W
m
−1
K
34%
increase,
salient
tensile
strength
181.4
MPa,
exceptional
stability
higher
than
500
°C.
These
outstanding
properties
provide
many
possibilities
preparation
Advanced Functional Materials,
Journal Year:
2024,
Volume and Issue:
unknown
Published: Dec. 23, 2024
Abstract
Environmental
heat
influx
often
limits
the
effectiveness
of
radiative
cooling
materials,
particularly
in
wearable
applications
where
thermal
comfort
is
paramount.
This
study
introduces
an
innovative
solution
for
personal
management
through
phase
change
(RC‐PC)
fiber
membranes.
Fabricated
by
coaxial
electrospinning,
these
membranes
combine
a
poly(3‐hydroxybutyrate‐co‐3‐hydroxyvalerate)
(PHBV)
and
tetraethyl
orthosilicate
(TEOS)
composite
shell,
encapsulating
n
‐octadecane
as
core
material.
The
demonstrate
exceptional
optical
performance,
with
solar
reflectivity
95.0%
emissivity
88.6%
within
atmospheric
window,
effectively
minimizing
ambient
absorption.
‐octadecane‐infused
fibers
(0.3
mL
h
−1
C18@TEOS/PHBV)
exhibit
enthalpy
88.3
J
g
,
reducing
heating
rates
improving
≈1
°C
at
dawn.
Under
typical
radiation
(939.5
W
m
−2
),
provide
average
power
89.0
peaking
95.3
.
Notably,
they
achieve
reduction
5.1
under
550.2
maintaining
temperatures
significantly
lower
than
conventional
fabrics,
differential
4.4
compared
to
medical
protective
clothing.
These
findings
underscore
potential
RC‐PC
sustainable,
efficient
management.
ACS Nano,
Journal Year:
2025,
Volume and Issue:
unknown
Published: April 14, 2025
Innovative
thermal
management
fiber
materials
have
emerged
as
a
solution
to
address
challenges
across
diverse
fields,
ranging
from
personal
comfort
and
electronic
device
cooling
aerospace
engineering.
While
graphene
is
known
for
its
higher
conductivity
over
conventional
carbon
fiber,
boron
nitride
(BN)
has
received
much
less
attention
in
one-dimensional
form,
despite
combined
high
notable
insulating
properties.
Previous
studies
mainly
focused
on
composite
fibers
with
BN
nanosheets
embedded
polymer
matrix.
In
contrast,
pure
consequent
investigations
single-fiber
level
barely
been
reported.
this
study,
we
report
the
fabrication
of
continuous,
via
polymer-derived
ceramic
approach
thermally
conductive
fillers.
Comprehensive
structural
characterizations
confirm
fibers'
quality
purity
without
apparent
contamination.
With
big-MEMS
method
developed,
single
precisely
measured
reaches
an
impressive
54
W
m-1
K-1.
Furthermore,
using
stacking-cutting
method,
resulting
vertically
aligned
fiber-reinforced
epoxy
demonstrates
24
K-1,
showing
immense
potential
usage
interface
material.
This
work
explores
electrically
applications.