A Review of Advanced Thermal Interface Materials with Oriented Structures for Electronic Devices DOI Open Access
Yuan Tu, Bin Liu, Gang Yao

et al.

Electronics, Journal Year: 2024, Volume and Issue: 13(21), P. 4287 - 4287

Published: Oct. 31, 2024

In high-power electronic devices, the rapid accumulation of heat presents significant thermal management challenges that necessitate development advanced interface materials (TIMs) to ensure performance and reliability devices. TIMs are employed facilitate an effective stable dissipation pathway between heat-generating components sinks. recent years, anisotropic one-dimensional two-dimensional materials, including carbon fibers, graphene, boron nitride, have been introduced as fillers in polymer-based due their high conductivity specific directions. The orientation polymer matrix has become important issue a new generation high-performance TIMs. To provide systematic understanding this field, paper mainly discusses advances oriented with (>10 W/(m·K)). For each filler, its preparation strategies enhancement mechanisms analyzed separately, focus on construction structures. Notably, there few reviews related fiber TIMs, details research results field. Finally, challenges, prospects, future directions summarized hope stimulating efforts.

Language: Английский

Emerging trends and challenges in thermal interface materials: A comprehensive perspective from fundamentals to applications DOI
Akbar Bashir, Muhammad Maqbool, Ali Usman

et al.

Materials Science and Engineering R Reports, Journal Year: 2025, Volume and Issue: 164, P. 100968 - 100968

Published: March 10, 2025

Language: Английский

Citations

3

Thermal interface materials: From fundamental research to applications DOI Creative Commons
Baojie Wei,

Wenmei Luo,

Jianying Du

et al.

SusMat, Journal Year: 2024, Volume and Issue: unknown

Published: Sept. 23, 2024

Abstract The miniaturization, integration, and high data throughput of electronic chips present challenging demands on thermal management, especially concerning heat dissipation at interfaces, which is a fundamental scientific question as well an engineering problem—a death problem called in semiconductor industry. A comprehensive examination interfacial resistance has been given from physics perspective 2022 Review Modern Physics . Here, we provide detailed overview materials perspective, focusing the optimization structure compositions interface (TIMs) interact/contact with source sink. First, discuss impact conductivity, bond line thickness, contact TIMs. Second, it pointed out that there are two major routes to improve transfer through interface. One reduce TIM's ( R TIM ) TIMs strategies like incorporating conductive fillers, enhancing treatment techniques. other c by improving effective contact, strengthening bonding, utilizing mass gradient alleviate vibrational mismatch between source/sink. Finally, such challenges theories, potential developments sustainable TIMs, application AI design also explored.

Language: Английский

Citations

14

Highly Thermally Conductive and Flexible Thermal Interface Materials with Aligned Graphene Lamella Frameworks DOI
Kun Huang, Songfeng Pei,

Qinwei Wei

et al.

ACS Nano, Journal Year: 2024, Volume and Issue: 18(34), P. 23468 - 23476

Published: Aug. 16, 2024

Highly thermally conductive and flexible thermal interface materials (TIMs) are desirable for heat dissipation in modern electronic devices. Here, we fabricated a high-crystalline aligned graphene lamella framework (AGLF) with precisely controlled thickness, pore structure, excellent intergraphene contact by manipulating the expansion behavior of scanning centrifugal casted oxide films. The rational design AGLF balances trade-off between conductivity flexibility TIMs. AGLF-based TIM (AGLF-TIM) shows record 196.3 W m

Language: Английский

Citations

10

Surface-Metallized Diamond/Liquid Metal Composites Through Diamond Size Engineering as High-Performance Thermal Interface Materials DOI

Ningbo Si,

Qingwei Yan, Haotong Zhang

et al.

Surfaces and Interfaces, Journal Year: 2025, Volume and Issue: unknown, P. 105989 - 105989

Published: Feb. 1, 2025

Language: Английский

Citations

1

Highly Intrinsic Thermal Conductivity of Aramid Nanofiber Films by Manipulating Intermolecular Hydrogen Bonding Interactions DOI

Niu Jiang,

Yajing Song, Lu‐Ning Wang

et al.

Advanced Functional Materials, Journal Year: 2024, Volume and Issue: unknown

Published: Nov. 9, 2024

Abstract Lightweight, flexible, and thermostable thermally conductive materials are essential for enhancing heat dissipation efficiency in advanced electronics. The development of intrinsic polymers is the key to expanding space improving thermal conductivity polymer‐based management materials. In order balance mechanical performance bulk polymers, aramid nanofiber (ANF) films assembled by manipulating proton‐donating ability solvents. Compared water as a conventional proton donor, ethanol‐induced multi‐scale structures composed dense hydrogen bonding interaction, large grain size, uniform fiber topology endow resulting ANF with enhanced up 5.05 W m −1 K 34% increase, salient tensile strength 181.4 MPa, exceptional stability higher than 500 °C. These outstanding properties provide many possibilities preparation

Language: Английский

Citations

5

Highly Integrated Phase Change and Radiative Cooling Fiber Membrane for Adaptive Personal Thermal Regulation DOI Open Access
Zhiguang Zhu, Akbar Bashir, Xiaohong Wu

et al.

Advanced Functional Materials, Journal Year: 2024, Volume and Issue: unknown

Published: Dec. 23, 2024

Abstract Environmental heat influx often limits the effectiveness of radiative cooling materials, particularly in wearable applications where thermal comfort is paramount. This study introduces an innovative solution for personal management through phase change (RC‐PC) fiber membranes. Fabricated by coaxial electrospinning, these membranes combine a poly(3‐hydroxybutyrate‐co‐3‐hydroxyvalerate) (PHBV) and tetraethyl orthosilicate (TEOS) composite shell, encapsulating n ‐octadecane as core material. The demonstrate exceptional optical performance, with solar reflectivity 95.0% emissivity 88.6% within atmospheric window, effectively minimizing ambient absorption. ‐octadecane‐infused fibers (0.3 mL h −1 C18@TEOS/PHBV) exhibit enthalpy 88.3 J g , reducing heating rates improving ≈1 °C at dawn. Under typical radiation (939.5 W m −2 ), provide average power 89.0 peaking 95.3 . Notably, they achieve reduction 5.1 under 550.2 maintaining temperatures significantly lower than conventional fabrics, differential 4.4 compared to medical protective clothing. These findings underscore potential RC‐PC sustainable, efficient management.

Language: Английский

Citations

4

High-Efficiency Heat Dissipation Coating Implemented with a Stepwise Thermally Conductive Pathway Using a Parylene-Nanocoated Thermal Filler DOI
Jisu Park,

Dashdendev Tsogbayar,

Minseob Lim

et al.

ACS Applied Polymer Materials, Journal Year: 2025, Volume and Issue: unknown

Published: Jan. 18, 2025

Language: Английский

Citations

0

Highly Thermally Conductive Boron Nitride Fiber DOI

PeiChi Liao,

Haiyu He, Haichang Guo

et al.

ACS Nano, Journal Year: 2025, Volume and Issue: unknown

Published: April 14, 2025

Innovative thermal management fiber materials have emerged as a solution to address challenges across diverse fields, ranging from personal comfort and electronic device cooling aerospace engineering. While graphene is known for its higher conductivity over conventional carbon fiber, boron nitride (BN) has received much less attention in one-dimensional form, despite combined high notable insulating properties. Previous studies mainly focused on composite fibers with BN nanosheets embedded polymer matrix. In contrast, pure consequent investigations single-fiber level barely been reported. this study, we report the fabrication of continuous, via polymer-derived ceramic approach thermally conductive fillers. Comprehensive structural characterizations confirm fibers' quality purity without apparent contamination. With big-MEMS method developed, single precisely measured reaches an impressive 54 W m-1 K-1. Furthermore, using stacking-cutting method, resulting vertically aligned fiber-reinforced epoxy demonstrates 24 K-1, showing immense potential usage interface material. This work explores electrically applications.

Language: Английский

Citations

0

The vertically oriented CFs@Al2O3 filled silicone rubber elastomer material to construct effective electromagnetic wave absorption network and high thermal conductivity path DOI

Kaiwen Hou,

Nizao Kong,

Min Huang

et al.

Diamond and Related Materials, Journal Year: 2025, Volume and Issue: 153, P. 112021 - 112021

Published: Jan. 25, 2025

Language: Английский

Citations

0

Conformal Al2O3 coating layer improves electrical insulation of the oriented carbon fibers arrays for highly thermally conductive interface materials DOI
Min Huang,

Ruibang Xie,

Zhiqian Wang

et al.

Composites Science and Technology, Journal Year: 2025, Volume and Issue: unknown, P. 111128 - 111128

Published: Feb. 1, 2025

Language: Английский

Citations

0