Applications and Recent Advances of Low-Temperature Multicomponent Solders in Electronic Packaging: A Review DOI Creative Commons
Guodong Wu, Jingfang Shen, Ding Zhou

et al.

Micromachines, Journal Year: 2025, Volume and Issue: 16(3), P. 300 - 300

Published: March 3, 2025

Flexible wearable devices and solar flexible units often use thermally sensitive organic materials as substrates, which are prone to thermal damage during the bonding process in 3D packaging, leading chip deformation or failure. Multicomponent solders, with well-designed multicomponent metallic elements, exhibit unique low-melting-point characteristics. The application of low-temperature solders electronic packaging can significantly reduce temperatures minimize chips. This paper reviews wettability preparation methods concludes effect different elements on solders. Additionally, this discusses research interfacial reactions, mechanical properties solder joints, providing valuable insights for future development field.

Language: Английский

A Review on Recent Advances in Flexible Perovskite Solar Cells DOI Open Access
Guanqi Tang, Lijun Chen, Xiaolong Cao

et al.

Solar RRL, Journal Year: 2025, Volume and Issue: unknown

Published: Jan. 26, 2025

Flexible perovskite solar cells (FPSCs), featured with lightweight, high efficiency, and low cost, have attracted much attention anticipating in applications on wearable electronics, near‐space vehicles, internet of things. High efficiency mechanical stability are two main factors the study FPSCs toward practical applications. In recent few years, many breakthroughs materials modification device innovation make power conversion reach over 25%. A comprehensive review thus is conducted to elucidate critical issues including flexible substrates, transparent electrodes, charge transport layers, films, modifications for enhancement FPSCs, which expected promote future development FPSCs.

Language: Английский

Citations

1

Progress in Flexible Perovskite Solar Cells: Paving the Way for Scalable Manufacturing DOI Creative Commons
Dimitar I. Kutsarov, Ehsan Rezaee, J. D.B. Lambert

et al.

Advanced Materials Technologies, Journal Year: 2025, Volume and Issue: unknown

Published: Feb. 20, 2025

Abstract The urgency for a sustainable mitigation of the environmental impacts caused by climate change highlights importance renewable energy technologies to fight this challenge. Perovskite solar cells (PSCs) emerge as promising alternative traditional photovoltaic (PV) due their unprecedented increase in efficiency (currently peaking at 26.95%) and long‐term stability proven successful completion industry relevant International Electrotechnical Commission (IEC) testing standards. Flexible PSCs (f‐PSCs) offer significant advantages such lightweight high power‐per‐weight ratio, mechanical flexibility, throughput roll‐to‐roll (R2R) manufacturing. These make f‐PSCs ideal implementation various applications areas, wearable electronics, portable devices, space PV, building‐ or automotive‐integrated PVs, more. Notably, efficiencies over 23% now mark milestone f‐PSCs, demonstrating competitiveness with rigid panels. This review explores breakthroughs focusing on flexible substrates, electrode materials, perovskite inks, encapsulation strategies. It also covers recent advancements studies fabricated scalable deposition methods emphasizes interfacial engineering enhancing durability. concludes summary key findings, remaining challenges, perspectives market uptake f‐PSCs.

Language: Английский

Citations

1

A critical review on the progress of emerging active and substrate materials for organic solar cells and device level fabrication techniques by solution process method DOI
Jagannath Majhi, Samaresh Ghosh,

Kumari Priya

et al.

Next Materials, Journal Year: 2025, Volume and Issue: 8, P. 100595 - 100595

Published: March 22, 2025

Language: Английский

Citations

0

Applications and Recent Advances of Low-Temperature Multicomponent Solders in Electronic Packaging: A Review DOI Creative Commons
Guodong Wu, Jingfang Shen, Ding Zhou

et al.

Micromachines, Journal Year: 2025, Volume and Issue: 16(3), P. 300 - 300

Published: March 3, 2025

Flexible wearable devices and solar flexible units often use thermally sensitive organic materials as substrates, which are prone to thermal damage during the bonding process in 3D packaging, leading chip deformation or failure. Multicomponent solders, with well-designed multicomponent metallic elements, exhibit unique low-melting-point characteristics. The application of low-temperature solders electronic packaging can significantly reduce temperatures minimize chips. This paper reviews wettability preparation methods concludes effect different elements on solders. Additionally, this discusses research interfacial reactions, mechanical properties solder joints, providing valuable insights for future development field.

Language: Английский

Citations

0