Flexible Mushroom-Like Cross-Scale Surface with Extreme Pressure Resistance for Telecommunication Lines Anti-Icing/Deicing DOI
Xiaopeng Wang, Yi Yang,

Sensen Xuan

et al.

ACS Applied Materials & Interfaces, Journal Year: 2025, Volume and Issue: unknown

Published: Jan. 7, 2025

Ice accretion caused by freezing rain or snowstorms is a common phenomenon in cold climates that seriously threatens the safety and reliability of telecommunication lines other overhead networks. Various anti-icing strategies have been demonstrated through surface engineering to delay ice formation. However, existing surfaces still encounter several challenges; for example, are prone ice-pinning formation due impact supercooled droplets, which leads loss effectiveness. In this study, mushroom-like cross-scale (MCS) with extreme pressure resistance superior anti-ice-pinning property was reported. Specifically, designed MCS, featuring multiscale microfeatures, re-entrant structure, heterogeneous sidewalls, nanoscale particles, exhibits excellent properties. determined occur process involving liquid penetration, condensation, icing, frost filling. By establishing an anti-ice -pinning model bubble column model, relationship between structural characteristics performance clarified. The MCS demonstrates static repellency (contact angle >167°) robust dynamic (water Weber number ≥300). Furthermore, it ultralow adhesion strength 0.46 kPa. Notably, remains below 5 kPa even after 15 deicing cycles. mechanism icephobicity induced micromorphologies provide valuable insights effective prospects line areas field information communication technology.

Language: Английский

Flexible Mushroom-Like Cross-Scale Surface with Extreme Pressure Resistance for Telecommunication Lines Anti-Icing/Deicing DOI
Xiaopeng Wang, Yi Yang,

Sensen Xuan

et al.

ACS Applied Materials & Interfaces, Journal Year: 2025, Volume and Issue: unknown

Published: Jan. 7, 2025

Ice accretion caused by freezing rain or snowstorms is a common phenomenon in cold climates that seriously threatens the safety and reliability of telecommunication lines other overhead networks. Various anti-icing strategies have been demonstrated through surface engineering to delay ice formation. However, existing surfaces still encounter several challenges; for example, are prone ice-pinning formation due impact supercooled droplets, which leads loss effectiveness. In this study, mushroom-like cross-scale (MCS) with extreme pressure resistance superior anti-ice-pinning property was reported. Specifically, designed MCS, featuring multiscale microfeatures, re-entrant structure, heterogeneous sidewalls, nanoscale particles, exhibits excellent properties. determined occur process involving liquid penetration, condensation, icing, frost filling. By establishing an anti-ice -pinning model bubble column model, relationship between structural characteristics performance clarified. The MCS demonstrates static repellency (contact angle >167°) robust dynamic (water Weber number ≥300). Furthermore, it ultralow adhesion strength 0.46 kPa. Notably, remains below 5 kPa even after 15 deicing cycles. mechanism icephobicity induced micromorphologies provide valuable insights effective prospects line areas field information communication technology.

Language: Английский

Citations

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