Sustainable Electrochemical Mechanical Polishing (ECMP) for 4H-SiC wafer using chemical-free polishing slurry with hydrocarbon-based solid polymer electrolyte

Applied Surface Science, Journal Year: 2024, Volume and Issue: 664, P. 160241 - 160241

Published: May 9, 2024

Large-diameter single-crystal silicon carbide (SiC) wafers with good surface quality are desirable to dramatically improve the performance of SiC-based power electronic devices. However, preparation such using a strong oxidative polishing slurry has limitations low material removal rate (MRR) and high environmental impact. Electrochemical–mechanical (ECMP) initiates by electrochemical oxidation without harsh chemicals, making it an alternative impact conventional polishing. Herein, we propose use polystyrene sulfonic acid (PSS), hydrocarbon-based polymer electrolyte perfluoro compounds, for ECMP. The SiC was effectively oxidized ECMP PSS. effects polyelectrolyte crosslinking treatment on lifetime polyelectrolyte-incorporated nonwoven cloths were investigated. optimum electrolytic mechanical conditions yielded MRRs 37 14 µm/h 2- 4-inch wafers. Moreover, morphologies growth face nonfacet areas discussed. wafer-scale evaluation demonstrated roughness reduction 0.85 nm Sa (average) after 15-min wafer. polishing-induced residual stress investigated microscale Raman mapping. Overall, proposed process offers significant advantages in terms speed, cost-effectiveness,

Language: Английский

Soft Copper Nanoimprinting via Solid-State Electrochemical Etching for Flexible Optoelectronics

ACS Applied Materials & Interfaces, Journal Year: 2025, Volume and Issue: unknown

Published: Feb. 27, 2025

Patterned Cu is widely used for various electronic components, including metal interconnects. In the optoelectronic industry, high-resolution nanopatterning of surfaces commonly performed via photolithography, which requires photoresists and harsh chemicals. this study, we developed a method fabricating nanopatterns based on solid-state electrochemical etching at interface between polymer electrolyte membrane (PEM) Cu. The reaction selectively ionized surface in contact with patterned PEM stamp, allowing direct patterning without using resists or This approach was successfully applied to produce patterns resolutions less than 100 nm hierarchical structures. Such subwavelength scale (several hundred nanometers) enable miniaturization electrical circuits tuning optical transmission/reflection spectra enhance device surfaces. Semitransparent electrodes fabricated nanopatterned poly(ethylene terephthalate) films exhibited good transmission resistance properties. proposed stamp-based technique avoids need liquid electrolytes resists, thereby offering simple, low-cost, environmentally friendly process

Language: Английский