Preparation and Properties of Low-Dielectric Polyimide Films Containing Tert-Butyl

Polymers, Journal Year: 2024, Volume and Issue: 16(7), P. 984 - 984

Published: April 4, 2024

The design of high-performance polyimide (PI) films and understanding the relationship structure–dielectric property are great significance in field microelectronics industry, but challenging. Herein, we describe first work to construct a series novel tert-butyl PI (denoted as PI-1, PI-2, PI-3, PI-4) based on low-temperature polymerization strategy, which employed tetracarboxylic dianhydride (pyromellitic anhydride, 3,3′,4,4′-biphenyl 4,4′-diphenyl ether dianhydride, 3,3′,4,4′-benzophenone anhydride) 4,4′-diamino-3,5-ditert butyl biphenyl monomers. results indicate that introducing branches main chain PIs can enhance free volume molecular reduce interaction between chains PI, resulting low dielectric constant. Particularly, optimized PI-4 exhibits an excellent comprehensive performance with high (5) wt% loss temperature (454 °C), tensile strength (117.40 MPa), maximum hydrophobic angle (80.16°), constant (2.90), outperforms most reported date.

Language: Английский

Iron nanoparticle engineered N-doped graphitic carbon composite as a binary electrocatalyst for overall water splitting and supercapacitor

International Journal of Hydrogen Energy, Journal Year: 2024, Volume and Issue: 88, P. 163 - 177

Published: Sept. 19, 2024

Language: Английский