Enhancing the thermal conductivity of epoxy molding compounds by adding SiO2-embedded carbon nanofibers for semiconductor packaging applications DOI

Yeon-Ryong Chu,

Zambaga Otgonbayar,

Gyu-Sik Park

et al.

Macromolecular Research, Journal Year: 2024, Volume and Issue: unknown

Published: Oct. 23, 2024

Language: Английский

Effects of Electrospinning Parameters on Polycaprolactone Membrane Diameter: An Investigation Utilizing Central Composite Design and Characterization DOI Creative Commons
Muhammad Rama Almafie, Ahmad Fudholi,

Rahma Dani

et al.

Results in Engineering, Journal Year: 2025, Volume and Issue: unknown, P. 104002 - 104002

Published: Jan. 1, 2025

Language: Английский

Citations

0
Enhancing the thermal conductivity of epoxy molding compounds by adding SiO2-embedded carbon nanofibers for semiconductor packaging applications DOI

Yeon-Ryong Chu,

Zambaga Otgonbayar,

Gyu-Sik Park

et al.

Macromolecular Research, Journal Year: 2024, Volume and Issue: unknown

Published: Oct. 23, 2024

Language: Английский

Citations

0