Materials, Journal Year: 2025, Volume and Issue: 18(8), P. 1783 - 1783

Published: April 14, 2025

Micro Light Emitting Diode (Micro-LED) technology, characterized by exceptional brightness, low power consumption, fast response, and long lifespan, holds significant potential for next-generation displays, yet its commercialization hinges on resolving challenges in high-density interconnect fabrication, particularly micrometer-scale bump formation. Traditional fabrication approaches such as evaporation enable precise control but face scalability cost limitations, while electroplating offers lower costs higher throughput suffers from substrate conductivity requirements uneven current density distributions that compromise bump-height uniformity. Emerging alternatives include electroless plating, which achieves uniform metal deposition non-conductive substrates through autocatalytic reactions albeit with slower rates; ball mounting dip soldering, streamline processes via automated solder jetting or alloy immersion struggle miniaturization yield; photosensitive conductive polymers simplify photolithography-patterned composites lack validated long-term stability. Persistent achieving uniformity, thermomechanical stability, environmental compatibility underscore the need integrated hybrid processes, eco-friendly manufacturing protocols, novel material innovations to ultra-high-resolution flexible Micro-LED implementations. This review systematically compares conventional emerging methodologies, identifies critical technological bottlenecks, proposes strategic guidelines industrial-scale production of displays.

Language: Английский