Lignin‐Based Vitrimer for High‐Resolution and Full‐Component Rapidly Recycled Liquid Metal Printed Circuit DOI

Yanfan Yang,

Yan Li, Yong Zheng

et al.

Advanced Functional Materials, Journal Year: 2025, Volume and Issue: unknown

Published: April 14, 2025

Abstract Room‐temperature liquid metals (RTLMs) exhibit inherent fluidity, metallic conductivity, remarkable stability, and recyclability, which indicate significant potential for applications in improving the efficiency of electronics recycling reducing costs. However, low viscosity RTLMs their poor interfacial adhesion to substrates typically necessitate utilization intricate fabrication processes. Here, a viscosity‐tunable, photothermal repairable, full‐component recyclable eutectic gallium–indium/epoxy‐modified lignin/polyethylene glycol diacid/ethylene vitrimer (EGaIn‐LPEv) is presented printed circuits. The system displays good stability tunable at room temperature because ultra‐high reactive site content modified lignin dual dynamic bonding by introduction ethylene glycol. EGaIn‐LPEv‐based circuit exhibits high resolution full component recovery up 7.6 µm 98.3 wt.%, respectively. As principal component, not only enhances system's green credentials but also endows it with an efficient repairable capability. reconnection damaged can be achieved 15 s through 808 nm infrared activation. This study opens new avenue development manufacturing processes sustainable application advanced, high‐resolution, fully recycled electronic devices.

Language: Английский

Lignin‐Based Vitrimer for High‐Resolution and Full‐Component Rapidly Recycled Liquid Metal Printed Circuit DOI

Yanfan Yang,

Yan Li, Yong Zheng

et al.

Advanced Functional Materials, Journal Year: 2025, Volume and Issue: unknown

Published: April 14, 2025

Abstract Room‐temperature liquid metals (RTLMs) exhibit inherent fluidity, metallic conductivity, remarkable stability, and recyclability, which indicate significant potential for applications in improving the efficiency of electronics recycling reducing costs. However, low viscosity RTLMs their poor interfacial adhesion to substrates typically necessitate utilization intricate fabrication processes. Here, a viscosity‐tunable, photothermal repairable, full‐component recyclable eutectic gallium–indium/epoxy‐modified lignin/polyethylene glycol diacid/ethylene vitrimer (EGaIn‐LPEv) is presented printed circuits. The system displays good stability tunable at room temperature because ultra‐high reactive site content modified lignin dual dynamic bonding by introduction ethylene glycol. EGaIn‐LPEv‐based circuit exhibits high resolution full component recovery up 7.6 µm 98.3 wt.%, respectively. As principal component, not only enhances system's green credentials but also endows it with an efficient repairable capability. reconnection damaged can be achieved 15 s through 808 nm infrared activation. This study opens new avenue development manufacturing processes sustainable application advanced, high‐resolution, fully recycled electronic devices.

Language: Английский

Citations

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