Elsevier eBooks, Journal Year: 2024, Volume and Issue: unknown
Published: Jan. 1, 2024
Elsevier eBooks, Journal Year: 2024, Volume and Issue: unknown
Published: Jan. 1, 2024
Polymer science & technology., Journal Year: 2025, Volume and Issue: unknown
Published: Feb. 5, 2025
Language: Английский
Citations
4Sensors, Journal Year: 2025, Volume and Issue: 25(3), P. 964 - 964
Published: Feb. 5, 2025
Flexible tactile sensors are widely used in aerospace, medical and health monitoring, electronic skin, human–computer interaction, other fields due to their unique advantages, thus becoming a research hotspot. The goal is develop flexible sensor characterized by outstanding sensitivity, extensive detection range linearity, elevated spatial resolution, commendable adaptability. Among several strategies like capacitive, piezoresistive, triboelectric sensors, etc., we focus on piezoelectric because of self-powered nature, high quick response time. These can respond wide dynamic mechanical stimuli turn them into measurable electrical signals. This makes it possible accurately detect objects, including shapes textures, for sense touch real work encapsulates current advancements focusing enhanced material properties, optimized structural design, improved fabrication techniques, broadened application domains. We outline the challenges facing provide inspiration guidance future development.
Language: Английский
Citations
2Sensors and Actuators A Physical, Journal Year: 2024, Volume and Issue: 369, P. 115137 - 115137
Published: Feb. 12, 2024
Language: Английский
Citations
4Advanced Materials Technologies, Journal Year: 2024, Volume and Issue: unknown
Published: June 4, 2024
Abstract Flexible hybrid electronics (FHE) is an emerging area that combines printed and ultra‐thin chip (UTC) technology to deliver high performance needed in applications such as wearables, robotics, internet‐of‐things etc. The integration of UTCs on flexible substrates the access devices them requires resolution interconnects, which a challenging task thermal mechanical mismatches do not allow conventional bonding methods work. To address this challenge, resource‐efficient, area‐efficient, low‐cost printing routes for obtaining vertical interconnection accesses (VIAs) are demonstrated here. It how high‐resolution printers (electrohydrodynamic extrusion‐based direct‐ink writing printers) can be used patterning high‐resolution, freeform, conductive structures. transistors UTCs, VIAs, obtained using photolithography plasma etching steps, filled with silver nanoparticle‐based ink/paste printers. Comprehensive studies performed compare benchmark terms of: i) speed throughput printers, ii) electrical vertically connected iii) stability FHE system (interconnects UTCs) under bending conditions. This in‐depth study shows potential use technologies development high‐density 3D integrated systems.
Language: Английский
Citations
4Sensors and Actuators A Physical, Journal Year: 2024, Volume and Issue: 379, P. 115858 - 115858
Published: Sept. 3, 2024
Language: Английский
Citations
4Applied Physics Reviews, Journal Year: 2024, Volume and Issue: 11(4)
Published: Dec. 1, 2024
Electronic skin (e-skin), capable of sensing a physical or chemical stimulus and triggering suitable response, is critical in applications such as healthcare, wearables, robotics, more. With substantial number types sensors over large area, the low-cost fabrication desirable for e-skin. In this regard, printing electronics attract attention it allow efficient use materials, “maskless” fabrication, low-temperature deposition. Additionally, e-skin real-time calls faster computation communication. However, due to limitations widely used materials (e.g., low mobility) tools poor print resolution), printed has been restricted passive devices low-end until recent years. Such are now being addressed through high-mobility highlighted review article, using vehicle. This paper discusses techniques that high-quality electronic layers inorganic nanostructures, their further processing obtain sensors, energy harvesters, transistors. Specifically, contact printing, transfer direct roll discussed along with working mechanisms influence dynamics. For sake completeness, few examples organic semiconductor-based also included. E-skin presents good case 3D integration flexible electronics, therefore, high-resolution connect various on substrate stack discussed. Finally, major challenges hindering scalability methods commercial uptake potential solutions.
Language: Английский
Citations
4Prosthesis, Journal Year: 2025, Volume and Issue: 7(2), P. 26 - 26
Published: March 2, 2025
Background/Objectives: Three-dimensional scanning and printing techniques have gained prominence in the fabrication of upper limb prostheses. This paper provides an overview various studies on current utilization 3D Methods: A scoping review literature was performed following PRISMA-ScR guidelines Scopus, PubMed, Google Scholar, Web Science, with a total 274 papers included. bibliometric analysis conducted, analyzing field via keyword co-occurrence visualized using VOSviewer software. Results: Keyword identified four key areas, “prosthesis design evaluation for people”, control sensing technologies”, “robotics mechanical prostheses design”, “accessibility prosthesis”. Temporal three trends: focus fingers, advancement systems, rise scanning. In addition, qualitative conducted to discuss areas trends that were shown from analysis, highlighting several studies. Conclusions: shows notable success when making prostheses, contents this article informing healthcare professionals general public about field.
Language: Английский
Citations
0ACS Omega, Journal Year: 2025, Volume and Issue: 10(14), P. 14138 - 14149
Published: April 1, 2025
Functional fabrics have broad applications in smart wearables, offering diverse functions, such as sensing, energy harvesting, and actuation. The use of 3D printing to deposit functional materials onto textile has emerged a transformative approach wearable development due the advantages it offers. However, achieving desired functionalities while maintaining fabric's flexibility, wearing comfort, washability, durability printed material remains challenge. In this study, direct ink writing (DIW) technology was employed print polybutylene succinate (PBS) solutions containing carbon nanotubes (CNTs) two types fabrics. Various properties were assessed examine influence solutions, fabric structures, postprinting processes on performance. exhibited excellent electrical conductivity, mechanical strength, gauge factor, stability under repeated strains. These characteristics highlight their potential for devices strain- motion-detecting sensors. Analysis morphologies revealed that factors fiber content, yarn structure, surface roughness substrate fabric, along with rheological tension solution, played key roles determining wetting penetration behaviors solution substrate. solution's ability penetrate bond fibers provided enhanced washability abrasion resistance, demonstrating DIW developing textile-based sensors wearables. Additionally, by using biobased biodegradable nontoxic Cyrene solvent processing, is safer process more environmentally friendly than commonly used toxic solvents PBS.
Language: Английский
Citations
0Chemical Engineering Journal, Journal Year: 2025, Volume and Issue: unknown, P. 163542 - 163542
Published: May 1, 2025
Language: Английский
Citations
0Additive manufacturing, Journal Year: 2025, Volume and Issue: unknown, P. 104799 - 104799
Published: May 1, 2025
Language: Английский
Citations
0