Applied Thermal Engineering, Journal Year: 2024, Volume and Issue: unknown, P. 125234 - 125234
Published: Dec. 1, 2024
Language: Английский
Applied Thermal Engineering, Journal Year: 2024, Volume and Issue: unknown, P. 125234 - 125234
Published: Dec. 1, 2024
Language: Английский
International Journal of Heat and Fluid Flow, Journal Year: 2024, Volume and Issue: 109, P. 109510 - 109510
Published: July 26, 2024
Language: Английский
Citations
0International Journal of Heat and Mass Transfer, Journal Year: 2024, Volume and Issue: 238, P. 126449 - 126449
Published: Nov. 22, 2024
Language: Английский
Citations
0International Journal of Heat and Fluid Flow, Journal Year: 2024, Volume and Issue: 111, P. 109669 - 109669
Published: Nov. 22, 2024
Language: Английский
Citations
0Journal of Advanced Research in Numerical Heat Transfer, Journal Year: 2024, Volume and Issue: 26(1), P. 84 - 98
Published: Nov. 30, 2024
The increasing miniaturization of technology has intensified thermal challenges, particularly concerning the cooling small components like ICs and CPUs. Microchannel heat sinks offer a common solution, but optimizing their configurations remains subject interest. This study addresses multiple enhancing factors that is position inlet outlet integrating pin-fin configurations. objectives are to improve uniformity sink analyse performance across different geometry using Ansys. parameters focused on this maximum temperature pressure drop. results gathered hexagon shaped pin fin yield better as compared other it shows lowest temperature, resistance proves significance selection for affected microchannel with cross flow effects.
Language: Английский
Citations
0Applied Thermal Engineering, Journal Year: 2024, Volume and Issue: unknown, P. 125234 - 125234
Published: Dec. 1, 2024
Language: Английский
Citations
0