Sustainable lectrochemical rocesses-ontrolled xtraction of aluable etal ons from iquid etal ines DOI

Wanpei Sun,

Jiahao Tang, Qi Dang

et al.

Journal of Water Process Engineering, Journal Year: 2024, Volume and Issue: 69, P. 106632 - 106632

Published: Nov. 30, 2024

Language: Английский

Application Trend of Heavy Metals in Electroplating Wastewater Treatment via Crystallization Technology DOI
Guangfei Qu, Zheng Yuan,

Chenyang Zhao

et al.

Waste and Biomass Valorization, Journal Year: 2024, Volume and Issue: unknown

Published: Nov. 1, 2024

Language: Английский

Citations

1

Effects of copper on hydroxyapatite thin films by pulsed laser deposition on silicon DOI
Leonardo Bohorquez Santiago, Diana Marcela Devia Narváez, Rogelio Ospina

et al.

Journal of the American Ceramic Society, Journal Year: 2024, Volume and Issue: unknown

Published: Oct. 15, 2024

Abstract This study deals with the effect of Cu on hydroxyapatite (HAp) thin films silicon substrates prepared by pulsed laser deposition (PLD) technique for concentrations ranging from 0 to 0.8 wt.%. Fourier transform infrared spectroscopy and Raman provide additional evidence HAp in films, which exhibit characteristic bands such as 960 cm −1 phosphate ion band. The X‐ray diffraction patterns confirm presence HAp, without copper‐related peaks, suggesting that it is not incorporated into lattice, present an amorphous phase. photoelectron confirms possibly related adsorption 2+ surfaces through electrostatic or interactions (PO 4 ) 3− groups. Atomic force microscopy shows roughness varies depending absence copper ions. Finally, density functional theory kinetic Monte Carlo simulations explain effects atomic diffusion clustering. These changes correlate contact angle values, indicating formation hydrophobic due inclusions.

Language: Английский

Citations

0

Sustainable lectrochemical rocesses-ontrolled xtraction of aluable etal ons from iquid etal ines DOI

Wanpei Sun,

Jiahao Tang, Qi Dang

et al.

Journal of Water Process Engineering, Journal Year: 2024, Volume and Issue: 69, P. 106632 - 106632

Published: Nov. 30, 2024

Language: Английский

Citations

0