Design, progress and challenges of 3D carbon-based thermally conductive networks DOI
Yuan Jing, Hanqing Liu, Feng Zhou

et al.

New Carbon Materials, Journal Year: 2024, Volume and Issue: 39(5), P. 844 - 871

Published: Oct. 1, 2024

Language: Английский

Thermal interface materials: From fundamental research to applications DOI Creative Commons
Baojie Wei,

Wenmei Luo,

Jianying Du

et al.

SusMat, Journal Year: 2024, Volume and Issue: unknown

Published: Sept. 23, 2024

Abstract The miniaturization, integration, and high data throughput of electronic chips present challenging demands on thermal management, especially concerning heat dissipation at interfaces, which is a fundamental scientific question as well an engineering problem—a death problem called in semiconductor industry. A comprehensive examination interfacial resistance has been given from physics perspective 2022 Review Modern Physics . Here, we provide detailed overview materials perspective, focusing the optimization structure compositions interface (TIMs) interact/contact with source sink. First, discuss impact conductivity, bond line thickness, contact TIMs. Second, it pointed out that there are two major routes to improve transfer through interface. One reduce TIM's ( R TIM ) TIMs strategies like incorporating conductive fillers, enhancing treatment techniques. other c by improving effective contact, strengthening bonding, utilizing mass gradient alleviate vibrational mismatch between source/sink. Finally, such challenges theories, potential developments sustainable TIMs, application AI design also explored.

Language: Английский

Citations

11
Orientation of macro/microscopic structures in anisotropic materials through 3D printing: Rheological behavior, processing, and properties DOI
Xinyu Guo,

Huan Jiao,

Xuyang Guo

et al.

Composites Part A Applied Science and Manufacturing, Journal Year: 2025, Volume and Issue: 192, P. 108767 - 108767

Published: Feb. 2, 2025

Language: Английский

Citations

1
Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics DOI Creative Commons
Ercan M. Dede, Feng Zhou, Yuqing Zhou

et al.

Journal of Electronic Packaging, Journal Year: 2025, Volume and Issue: 147(2)

Published: Jan. 18, 2025

Abstract Heterogeneous integration of electronics is critical to the next wave applications ranging from extremely power dense energy conversion systems advanced chiplet and copackaged optics architectures for next-generation computing. Enhanced functionality operation are essential goals in heterogeneous integration. In all applications, effective thermal management both active passive electronic devices required support these goals. Additive manufacturing (AM) opens new avenues electronics. This article thus provides a review AM methods specific context solutions Three-dimensional printing methods, associated materials (e.g., metal, polymer, ceramic, composite), package approaches, or conceptual fabrication workflows, outlined cold plates, heat sinks, fluid flow manifolds, interface (TIMs) plus composites The current status design optimization also covered. Future challenges research directions further stimulate development novel techniques, unique capabilities solutions.

Language: Английский

Citations

0
A highly stretchable and thermally conductive capacitive strain sensor based on rGO-PDMS composite for motion monitoring: A paradigm shifts towards sustainable electronics DOI
Animesh Maji, Chinmoy Kuila, Debasish Mondal

et al.

Materials Chemistry and Physics, Journal Year: 2025, Volume and Issue: unknown, P. 130811 - 130811

Published: March 1, 2025

Language: Английский

Citations

0
Bio-Inspired Thermal Conductive Fibers by Boron Nitride Nanosheet/Boron Nitride Hybrid DOI Open Access
Jiajing Zhang,

P Zhang,

Chunhua Zhang

et al.

International Journal of Molecular Sciences, Journal Year: 2024, Volume and Issue: 25(20), P. 11156 - 11156

Published: Oct. 17, 2024

With the innovation of modern electronics, heat dissipation in devices faces several problems. In our work, boron nitride (BN) with good thermal conductivity (TC) was successfully fabricated by constructing BN along axial direction and surface-grafted hybrid composite fibers via wet-spinning hot-pressing method. The unique inter-outer inter-interconnected structure exhibited 176.47% enhancement (TCE), which exhibits TC, mechanical resistance, chemical resistance. addition, depending on special fibers, it provides a new strategy for fabricating interface materials electronic device.

Language: Английский

Citations

1
Design, progress and challenges of 3D carbon-based thermally conductive networks DOI
Yuan Jing, Hanqing Liu, Feng Zhou

et al.

New Carbon Materials, Journal Year: 2024, Volume and Issue: 39(5), P. 844 - 871

Published: Oct. 1, 2024

Language: Английский

Citations

1