A Cu/Fe3O4@CN tandem catalyst for efficient ammonia electrosynthesis from nitrate reduction DOI

Xuetao Cheng,

Huilin Zhao, Pengfei Liu

et al.

Journal of Colloid and Interface Science, Journal Year: 2024, Volume and Issue: 682, P. 703 - 714

Published: Nov. 29, 2024

Language: Английский

The preparation and performance analysis of high-entropy phosphate high-temperature resistant adhesives DOI

Chenchen Qi,

Xiaojian Ji, Jinɡjinɡ Li

et al.

Journal of the European Ceramic Society, Journal Year: 2025, Volume and Issue: unknown, P. 117356 - 117356

Published: March 1, 2025

Language: Английский

Citations

2

Surface Engineering‐Induced d‐Band Center Down‐Regulation in High‐Entropy Alloy Nanowires for Enhanced Nanozyme Catalysis DOI Creative Commons

Kaiqiang Feng,

Hanting Wang, Song Zhou

et al.

Advanced Science, Journal Year: 2025, Volume and Issue: unknown

Published: April 7, 2025

Abstract High‐entropy alloys (HEAs) have garnered extensive attention owing to their broad compositional tunability and high catalytic activity. However, precisely modulating the enzyme‐like activity of HEAs enhancing biocompatibility for biological applications remain severely challenging. Herein, PtRuFeCoNi HEA nanowires (NWs) are synthesized by adjusting metal composition surface‐engineered with polydopamine (PDA) form NWs@PDA nanozymes (HEzymes@PDA) superior photothermal properties. Density functional theory calculations Sabatier principle reveal that self‐polymerized PDA surface engineering moderately lowers d‐band center HEAs, optimizes charge distribution, enhances adsorption–desorption efficiency substrates. As a proof‐of‐concept, HEzymes@PDA synergistically integrated hydrogels biosensing analysis. This study presents an innovative paradigm designing highly active via demonstrates immense potential in sensing applications.

Language: Английский

Citations

0

A Cu/Fe3O4@CN tandem catalyst for efficient ammonia electrosynthesis from nitrate reduction DOI

Xuetao Cheng,

Huilin Zhao, Pengfei Liu

et al.

Journal of Colloid and Interface Science, Journal Year: 2024, Volume and Issue: 682, P. 703 - 714

Published: Nov. 29, 2024

Language: Английский

Citations

2