Liquid Metal Enabled Thermoelectric Effects: Fundamental and Application DOI Open Access
Tangzhen Guan, Jianye Gao, Weiqiu Chen

et al.

Advanced Functional Materials, Journal Year: 2025, Volume and Issue: unknown

Published: March 20, 2025

Abstract The thermoelectric (TE) effect, capable of directly converting heat into electrical energy, has catalyzed the development numerous next‐generation functional devices. However, traditional TE generators (TEGs), predominantly composed rigid materials, are unable to maintain synchronous deformation under bending, twisting, or stretching, thereby limiting their application potential. Liquid metal (LM), with its exceptional conductivity, flexibility, thermal self‐healing properties, and unique effects, presents a compelling alternative as conductive heat‐transfer material. By integrating LM TEGs can achieve stretchability, capabilities, enhance conductivity encapsulating materials (ECMs), reduce interfacial contact resistance, improve overall performance. This article provides comprehensive review cutting‐edge intersection between encompassing applications in interconnects (INCs), heat‐conductive fabrication legs. Subsequently, effects at liquid–liquid interfaces gallium commonly used LMs reviewed. Additionally, emerging process fabricating (TEMs) using LM‐printed semiconductors is explored. Finally, based on an evaluation latest advancements this field, challenges promising directions for future research discussed.

Language: Английский

Liquid Metal Enabled Thermoelectric Effects: Fundamental and Application DOI Open Access
Tangzhen Guan, Jianye Gao, Weiqiu Chen

et al.

Advanced Functional Materials, Journal Year: 2025, Volume and Issue: unknown

Published: March 20, 2025

Abstract The thermoelectric (TE) effect, capable of directly converting heat into electrical energy, has catalyzed the development numerous next‐generation functional devices. However, traditional TE generators (TEGs), predominantly composed rigid materials, are unable to maintain synchronous deformation under bending, twisting, or stretching, thereby limiting their application potential. Liquid metal (LM), with its exceptional conductivity, flexibility, thermal self‐healing properties, and unique effects, presents a compelling alternative as conductive heat‐transfer material. By integrating LM TEGs can achieve stretchability, capabilities, enhance conductivity encapsulating materials (ECMs), reduce interfacial contact resistance, improve overall performance. This article provides comprehensive review cutting‐edge intersection between encompassing applications in interconnects (INCs), heat‐conductive fabrication legs. Subsequently, effects at liquid–liquid interfaces gallium commonly used LMs reviewed. Additionally, emerging process fabricating (TEMs) using LM‐printed semiconductors is explored. Finally, based on an evaluation latest advancements this field, challenges promising directions for future research discussed.

Language: Английский

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