Branching a benzoxazole-g-PBO fiber/cyanate ester resin composite with excellent wave transmission at high temperatures DOI
Jingyu Jiang, Yijia Zhou, Chao Liu

et al.

Chemical Engineering Journal, Journal Year: 2024, Volume and Issue: unknown, P. 158840 - 158840

Published: Dec. 1, 2024

Language: Английский

Low dielectric constant and ultra-low dielectric loss poly(arylene ether nitrile)/octaphenyl-POSS composite films with dual cross-linked networks DOI
Zhixuan Zhang, Tong Cao,

Hanrong Wu

et al.

Composites Communications, Journal Year: 2025, Volume and Issue: unknown, P. 102268 - 102268

Published: Jan. 1, 2025

Language: Английский

Citations

1

Inverse design of material, structure, and process for dielectric properties of additively manufactured PLA/BaTiO3 polymer composites DOI
Quanjin Ma, Ke Dong,

Feirui Li

et al.

Composites Communications, Journal Year: 2025, Volume and Issue: unknown, P. 102314 - 102314

Published: Feb. 1, 2025

Language: Английский

Citations

1

Material performance, manufacturing methods, and engineering applications in aviation of Carbon fiber reinforced polymers: A comprehensive review DOI
Xiangyu Xu,

Gongqiu Peng,

Baoyan Zhang

et al.

Thin-Walled Structures, Journal Year: 2024, Volume and Issue: unknown, P. 112899 - 112899

Published: Dec. 1, 2024

Language: Английский

Citations

8

Bio-inspired PEI/BNNS composite film via hydrogen bond self-assembly for efficiently enhancing high-temperature dielectric energy storage DOI

Zhaotian Ba,

Lili Ma,

Hui Liu

et al.

Composites Communications, Journal Year: 2025, Volume and Issue: unknown, P. 102266 - 102266

Published: Jan. 1, 2025

Language: Английский

Citations

0

Evaluation of hole quality in drilling CF/BMI composite via machine learning: Multi-defects analysis and fatigue life prediction DOI
Shengguo Zhang, Wenhu Wang,

Tianren Zhang

et al.

Thin-Walled Structures, Journal Year: 2025, Volume and Issue: 212, P. 113189 - 113189

Published: March 17, 2025

Language: Английский

Citations

0

Highly improved mechanical and thermal properties of bismaleimide via a novel thermoplastic isoindolinone polyether sulfone DOI

Meixin Wang,

Lixin Song, Zhipeng Wang

et al.

Polymer Engineering and Science, Journal Year: 2025, Volume and Issue: unknown

Published: April 13, 2025

Abstract To improve the mechanical and thermal properties of thermosetting bismaleimide resins, a novel thermoplastic isoindolinone‐based polyether sulfone (PES‐In) resin was synthesized as toughening agent for N , ′‐(4,4′‐methylenediphenyl)bismaleimide/2,2′‐diallylbisphenol A (BDM/DABPA) system. The incorporation this not only enhanced material's overall toughness but also significantly improved its performance. effects PES‐In's viscosity dosage on efficiency were systematically studied, leading to identification optimal conditions. Specifically, 7.5 phr PES‐In with 0.4 dL/g resulted in remarkable increase impact strength PES‐In/BDM/DABPA system 37.20 kJ/m 2 representing 497% improvement over base BDM (6.23 ). Thermal properties, assessed by dynamic thermomechanical analysis thermogravimetric analysis, showed significant enhancements, T d5% g reaching 425 267°C, respectively, storage modulus rising from 2.0 2.5 GPa. Scanning electron microscope revealed typical “sea‐island” structure multiple crack deflections fracture surface. introduction thus broadens application potential higher‐temperature‐resistant structural materials. Highlights Novel synthesized. Toughness networks improved. performance PES‐In/ /DABPA Relative mechanism clearly elucidated.

Language: Английский

Citations

0

Role of fluorine polyetherimide molecular weight in regulating toughness, phase separation and thermal stability of bismaleimide resins DOI
Jiajie Lyu,

Beibei Ji,

Jiao Liu

et al.

Journal of Materials Science, Journal Year: 2025, Volume and Issue: unknown

Published: April 17, 2025

Language: Английский

Citations

0

DTAB-functionalized MXene nanofillers for enhancing dielectric properties of TPU-based composites DOI
Yajing Liu, Yan Jia, Weiwei He

et al.

Composites Communications, Journal Year: 2025, Volume and Issue: 57, P. 102426 - 102426

Published: April 30, 2025

Language: Английский

Citations

0

Molecular design and application of low dielectric bismaleimide resin DOI

Shaolin Lü,

Qianyi He,

Xiangxing Zeng

et al.

Polymer Engineering and Science, Journal Year: 2024, Volume and Issue: unknown

Published: Sept. 24, 2024

Abstract With the development of communications technology, copper‐clad laminate (CCL) for integrated circuits (IC) pointed to direction high‐frequency and high‐speed development, that is, a lower dielectric constant loss requirements. Bismaleimide (BMI) resins feature stable properties excellent thermal stability over wide temperature range, widely used in manufacture CCL substrates. However, comprehensive performance BMI resin itself, including properties, still cannot fully meet needs ever‐changing industry, so molecular design modification enhance is currently one key research directions circuit CCL. This paper reviews their applications, focusing on main methods formulation optimization, allyl, diamine, internal chain‐extended, chemical/physical blending modification. Finally, low its application are summarized prospected. Future include synthesis multi‐component copolymers further realize balance between performance, as well exploring possibility novel composite modifications provide more competitive high‐performance materials IC field. Highlights The bismaleimide applications reviewed. monomers' chemical reaction summarized. modified

Language: Английский

Citations

3

Branching a benzoxazole-g-PBO fiber/cyanate ester resin composite with excellent wave transmission at high temperatures DOI
Jingyu Jiang, Yijia Zhou, Chao Liu

et al.

Chemical Engineering Journal, Journal Year: 2024, Volume and Issue: unknown, P. 158840 - 158840

Published: Dec. 1, 2024

Language: Английский

Citations

0