Self‐Assembly and 3D Printing of SiCw@MXene/SiOC Metastructure Toward Simultaneously Excellent Terahertz Electromagnetic Interference (EMI) Shielding and Electron‐to‐Thermal Conversion Properties DOI

Ruyue Su,

Pingan Liu,

Jingyi Chen

et al.

Advanced Functional Materials, Journal Year: 2025, Volume and Issue: unknown

Published: Feb. 24, 2025

Abstract The great application potential of terahertz (THz) waves in communication, imaging, and other cutting‐edge fields makes them vulnerable to harsh environments. THz electromagnetic interference (EMI) shielding materials that are applicable capable with standing environments critically important for ensuring the reliable operation electronic devices urgently needed. Herein, UV light‐cured SiC whisker (SiC w )@MXene/SiOC composites different :MXene mass ratios developed through electrostatic self‐assembly. influence MXene exfoliation routes on EMI performance @MXene/SiOC investigated deep. results indicated @HF‐MXene/SiOC ratio 1:1 exhibited best performance, abundant heterointerfaces formed between enhanced wave attenuation. Subsequently, Gyroid triple periodic minimal surface (TPMS) metastructures fabricated by vat photopolymerization (VPP) 3D printing. All obtained a thickness 1.3–2.7 mm superior properties an average efficiency (SE) 58.6–66.4 dB 0.2–1.6 THz. Moreover, Gyroid‐2.5 metastructure even low thermal conductivity electron‐to‐thermal conversion properties. facilitates development next‐generation

Language: Английский

Research progress in chemical vapor deposition for high-temperature anti-oxidation/ablation coatings on thermal structural composites DOI
Jian Zhang, Yulei Zhang, Yanqin Fu

et al.

Composites Part B Engineering, Journal Year: 2024, Volume and Issue: unknown, P. 112015 - 112015

Published: Nov. 1, 2024

Language: Английский

Citations

5
Self‐Assembly and 3D Printing of SiCw@MXene/SiOC Metastructure Toward Simultaneously Excellent Terahertz Electromagnetic Interference (EMI) Shielding and Electron‐to‐Thermal Conversion Properties DOI

Ruyue Su,

Pingan Liu,

Jingyi Chen

et al.

Advanced Functional Materials, Journal Year: 2025, Volume and Issue: unknown

Published: Feb. 24, 2025

Abstract The great application potential of terahertz (THz) waves in communication, imaging, and other cutting‐edge fields makes them vulnerable to harsh environments. THz electromagnetic interference (EMI) shielding materials that are applicable capable with standing environments critically important for ensuring the reliable operation electronic devices urgently needed. Herein, UV light‐cured SiC whisker (SiC w )@MXene/SiOC composites different :MXene mass ratios developed through electrostatic self‐assembly. influence MXene exfoliation routes on EMI performance @MXene/SiOC investigated deep. results indicated @HF‐MXene/SiOC ratio 1:1 exhibited best performance, abundant heterointerfaces formed between enhanced wave attenuation. Subsequently, Gyroid triple periodic minimal surface (TPMS) metastructures fabricated by vat photopolymerization (VPP) 3D printing. All obtained a thickness 1.3–2.7 mm superior properties an average efficiency (SE) 58.6–66.4 dB 0.2–1.6 THz. Moreover, Gyroid‐2.5 metastructure even low thermal conductivity electron‐to‐thermal conversion properties. facilitates development next‐generation

Language: Английский

Citations

0