Regulation of Microstructure and Mechanical Properties of DC Electrodeposited Copper Foils by Electrolyte Parameters DOI Open Access
Wenwen Ma, Yuehong Zheng, Chong Luo

et al.

Coatings, Journal Year: 2025, Volume and Issue: 15(5), P. 521 - 521

Published: April 27, 2025

Introducing nano-twins into electrolytic copper foil is an effective method to enhance strength and toughness. While pulse electrodeposition enables the easier preparation of high-density nano-twin copper, large-scale industrial production mainly relies on direct current electrodeposition. Therefore, systematically studying effects electroplating parameters microstructure mechanical properties electrodeposited crucial. In this paper, we discuss pH value, CCuSO4, Jk electroplated foils at room temperature. The results show that exhibit stronger (220)Cu preferred orientation M surface than S with changes in Jk. When value 2.5, CCuSO4 between 70 90 g/L, within range 70–90 mA/cm2, prepared has better compactness no obvious pinhole-like defects. Particularly, a 80 mA/cm2 consists equiaxed columnar grains, featuring small grain size, uniform distribution, dense structure, resulting excellent properties.

Language: Английский

Effect of Pulse Electrodeposition Process on the Microstructure and Properties of Electrolytic Copper Foil as Anode Current Collectors DOI

Bao Qin,

Jing Hu,

Zhong Wu

et al.

Electrochimica Acta, Journal Year: 2025, Volume and Issue: unknown, P. 146278 - 146278

Published: April 1, 2025

Language: Английский

Citations

0
Regulation of Microstructure and Mechanical Properties of DC Electrodeposited Copper Foils by Electrolyte Parameters DOI Open Access
Wenwen Ma, Yuehong Zheng, Chong Luo

et al.

Coatings, Journal Year: 2025, Volume and Issue: 15(5), P. 521 - 521

Published: April 27, 2025

Introducing nano-twins into electrolytic copper foil is an effective method to enhance strength and toughness. While pulse electrodeposition enables the easier preparation of high-density nano-twin copper, large-scale industrial production mainly relies on direct current electrodeposition. Therefore, systematically studying effects electroplating parameters microstructure mechanical properties electrodeposited crucial. In this paper, we discuss pH value, CCuSO4, Jk electroplated foils at room temperature. The results show that exhibit stronger (220)Cu preferred orientation M surface than S with changes in Jk. When value 2.5, CCuSO4 between 70 90 g/L, within range 70–90 mA/cm2, prepared has better compactness no obvious pinhole-like defects. Particularly, a 80 mA/cm2 consists equiaxed columnar grains, featuring small grain size, uniform distribution, dense structure, resulting excellent properties.

Language: Английский

Citations

0