Study the Effect of Silicon Nanofluid on the Heat Transfer Enhancement of Triangular-Shaped Open Microchannel Heat Sinks DOI
Mohammed Anees Sheik, N. Beemkumar, Arun Gupta

et al.

Silicon, Journal Year: 2023, Volume and Issue: 16(1), P. 277 - 293

Published: Sept. 19, 2023

Language: Английский

Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management DOI
Ziyong Li,

Hailiang Luo,

Yuguang Jiang

et al.

Applied Thermal Engineering, Journal Year: 2024, Volume and Issue: 251, P. 123612 - 123612

Published: June 6, 2024

Language: Английский

Citations

44
Thermal management enhancement of electronic chips based on novel technologies DOI
Haopeng Chen, Tianshi Zhang,

Qing Gao

et al.

Energy, Journal Year: 2025, Volume and Issue: unknown, P. 134575 - 134575

Published: Jan. 1, 2025

Language: Английский

Citations

3
Numerical analysis of heat transfer and fluid flow characteristics of microchannel heat sinks with streamwise variation of fin height DOI
Rohit Kumar, Manmohan Pandey

International Communications in Heat and Mass Transfer, Journal Year: 2025, Volume and Issue: 163, P. 108706 - 108706

Published: Feb. 12, 2025

Language: Английский

Citations

2
A review on design alteration in microchannel heat sink for augmented thermohydraulic performance DOI Creative Commons
Prabhakar Bhandari, Kamal Singh Rawat, Yogesh K. Prajapati

et al.

Ain Shams Engineering Journal, Journal Year: 2023, Volume and Issue: 15(2), P. 102417 - 102417

Published: Aug. 4, 2023

The present trend of miniaturization in various electronic devices has caused higher heat generation per unit area. Dissipation highly concentrated from these is essentially required to ensure their safe and prolonged use. Therefore, consistent efforts are made upgrade the cooling technology meet current requirements. microchannel sink (MCHS) gained much attention due its inherent property a surface area-to-volume ratio. thermo-hydraulic performance MCHS been further improved by several methods including active passive techniques. In this work, comprehensive review literature presented discuss prominent design modifications done enhance dissipation capacity using single-phase fluid flow. It was commonly observed that transfer enhancement usually occurs at cost pressure drop penalty other flow complications; therefore, relevant parameters have discussed evaluate design's efficacy.

Language: Английский

Citations

26
Numerical study on the anisotropy in thermo-fluid behavior of triply periodic minimal surfaces (TPMS) DOI
Tao Zhang, Fei Liu, Kaifei Zhang

et al.

International Journal of Heat and Mass Transfer, Journal Year: 2023, Volume and Issue: 215, P. 124541 - 124541

Published: July 28, 2023

Language: Английский

Citations

25
Constructal design of a rectangular parallel phase change microchannel in a three-dimensional electronic device DOI

JiWen Zhang,

Huijun Feng,

Lingen Chen

et al.

Science China Technological Sciences, Journal Year: 2023, Volume and Issue: 67(5), P. 1381 - 1390

Published: Dec. 8, 2023

Language: Английский

Citations

25
Characterization of MEMS heat sinks having straight microchannels integrating square pin-fins for liquid cooling of microelectronic chips DOI
Anas Alkhazaleh, Fadi Alnaimat, Bobby Mathew

et al.

Thermal Science and Engineering Progress, Journal Year: 2023, Volume and Issue: 45, P. 102154 - 102154

Published: Sept. 26, 2023

Language: Английский

Citations

24
A novel microchannel-twisted pinfin hybrid heat sink for hotspot mitigation DOI
Wasim Raza, Danish Ansari, Ji Hwan Jeong

et al.

Applied Thermal Engineering, Journal Year: 2024, Volume and Issue: 241, P. 122454 - 122454

Published: Jan. 16, 2024

Language: Английский

Citations

14
Constructal design of a hybrid heat sink with rectangular microchannel and porous fin in a 3D electronic device with artificial neural-network, NSGA-II and different decision-making methods DOI
Bowen Wu, Huijun Feng, Lingen Chen

et al.

International Communications in Heat and Mass Transfer, Journal Year: 2024, Volume and Issue: 158, P. 107954 - 107954

Published: Aug. 20, 2024

Language: Английский

Citations

13
Heat dissipation and fluid flow in micro-channel heat sink equipped with semi-elliptical pin-fin structures: A numerical study DOI
Naushad Ali,

Shivam Srivastava,

Injamamul Haque

et al.

International Communications in Heat and Mass Transfer, Journal Year: 2024, Volume and Issue: 155, P. 107492 - 107492

Published: April 17, 2024

Language: Английский

Citations

12