Construction and properties of epoxy resin‐based conductive and thermally conductive composites with electromagnetic shielding function

Polymer Composites, Journal Year: 2025, Volume and Issue: unknown

Published: March 28, 2025

Abstract The construction of 3D networks enhanced filler utilization in conductive composites, but heat‐induced liquefaction solid epoxy resins hindered internal structure formation. This study prepared semi‐cured particles (S‐E12‐RGs) by mixing and pre‐curing E12 with a curing agent. S‐E12‐RGs were combined liquid E51, additives, ethylenediamine‐modified nickel‐coated graphite (ENCG), then hot‐pressed into composites. crosslinking prevented ENCG's inward migration, which promoted its selective dispersion the E51 phase. With only 15 wt% (NCG), conductivity increased 7 orders magnitude compared to direct filling. At 25 ENCG, composites achieved 23.81 S/m, thermal 0.557 W/(m K), an EMI shielding 35 dB. Furthermore, DMA‐digital multimeter analysis showed that ΔR/R 0 was less than 0.27 from 70°C at 0.1–50 Hz, demonstrated excellent operational stability. Highlights A network formed thermosetting matrix via specific methods. cross‐linked composite exhibited high electrical low content. material maintained stability within temperature frequency range.

Language: Английский

Preparation and properties of flexible dual-network high-performance epoxy composites

Polymer, Journal Year: 2024, Volume and Issue: unknown, P. 127621 - 127621

Published: Sept. 1, 2024

Language: Английский