Microchannel heat sinks with nanofluids for cooling electronic components: Performance enhancement, challenges, and limitations

Thermal Science and Engineering Progress, Journal Year: 2022, Volume and Issue: 37, P. 101608 - 101608

Published: Dec. 8, 2022

Language: Английский

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Characteristics of pulsating heat pipe with variation of tube diameter, filling ratio, and SiO2 nanoparticles: Biomedical and engineering implications

Case Studies in Thermal Engineering, Journal Year: 2024, Volume and Issue: 55, P. 104065 - 104065

Published: Feb. 10, 2024

Pulsating heat pipe (PHP) is an implicit technique through a passive two-stage transfer system. This paper presents the experimentations on PHP contrived using copper with different inner tube diameters of 1, 1.5, 2, and 2.5 mm, respectively. The accused acetone as functional liquid filling proportions varying from 50 to 90% its volume increment 10%. effects proportion diameter thermal performance were investigated. evaporator zone electrically heated mica heater in range 20–80 W, condenser area kept cool by water circulation method. results show that 2 mm performs best compared other diameters, lower rate resistance 0.49 K/W. Also, enhanced at 60% for all diameters. Further, CFD analysis was carried out ratios constant input 80 it revealed test outcomes line results. deviation between experimental numerical studies Considering optimized parameters, i.e., ratio, work extended adding SiO2 nanoparticles base fluid 1–5 % mass concentration. showed value 0.3 W/K higher coefficient 828.64 W/m2 °K obtained 2% concentration SiO2. proportional rise 60 W 11.46, 17, 14, 4.15, 1.94% 3, 4, 5% nanoparticles, Hence, operates better ratio nanoparticles.

Language: Английский

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A critical review on renewable battery thermal management system using heat pipes

Journal of Thermal Analysis and Calorimetry, Journal Year: 2023, Volume and Issue: 148(16), P. 8403 - 8442

Published: May 2, 2023

Language: Английский

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A comprehensive review on heat pipe-assisted hybrid battery thermal management strategies: Opportunities, challenges and its future aspects

Journal of Energy Storage, Journal Year: 2025, Volume and Issue: 112, P. 115475 - 115475

Published: Jan. 24, 2025

Language: Английский

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Low-temperature heat transfer mediums for cryogenic applications

Journal of the Taiwan Institute of Chemical Engineers, Journal Year: 2023, Volume and Issue: 148, P. 104709 - 104709

Published: Feb. 1, 2023

Researchers and industrialists have grown interested in cryogenic technologies over the years. Cryogenic heat transfer has enabled new applications due to material properties behaviour at very low temperatures. This domain is still underdeveloped unfamiliar various applications. work discusses recent progress on mediums their respective use different After identifying what commonly designated as a medium, i.e., those with boiling point below -150 °C, characteristics features of such are critically discussed. Liquid He N2 were found be most used mediums, mainly temperature attained by liquid He, closest absolute zero, along cost high availability N2. The liquid-phase single-phase state was common application method. Two-phase medium for pipe, which both latent sensible utilized. essential critical niche aerospace, superconductivity, advanced machining manufacturing methods, more many healthcare scientific research.

Language: Английский

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Numerical study on side cooling technology of battery with a flat confined loop heat pipe

Applied Thermal Engineering, Journal Year: 2023, Volume and Issue: 236, P. 121490 - 121490

Published: Sept. 4, 2023

Language: Английский

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A comprehensive assessment of emerging trends in battery thermal management systems

Journal of the Brazilian Society of Mechanical Sciences and Engineering, Journal Year: 2024, Volume and Issue: 46(3)

Published: Feb. 21, 2024

Language: Английский

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A computational search for the optimal microelectronic heat sink using ANSYS Icepak

International Journal of Thermofluids, Journal Year: 2024, Volume and Issue: 23, P. 100759 - 100759

Published: July 8, 2024

The efficient thermal management of microelectronic devices is crucial for their reliability and performance. Heat sinks, particularly those with inline staggered fin arrangements, are vital in achieving this goal. This study leverages the advancements computational fluid dynamics (CFD) software to explore optimal heat sink design devices. While prior research has extensively investigated design, work offers novelty by employing ANSYS Icepak simulations. approach enables a comprehensive performance pressure drop analysis two distinct cross-sections. investigates assemblies housed within confined space, simulating realistic operating environment designed cool single source (chip) mounted on substrate board. In paper, types sections, circular conical, studied configurations, (IA) (SA), which analysed 36 fins each case. Each constructed from aluminium specified dimensions. Air serves as cooling cabinet, dissipating generated chip. When comparing pin cone at same power mass flow rate, results indicated that maximum temperature 0.46% fins, they have higher drop, especially arrangements. Moreover, arrangements lower than configurations factor up 1.17% 2.035% respectively. article focuses deep understanding systems. It aims continuously improve efficiency maintaining minimum limits space obtaining configuration dissipation.

Language: Английский

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An intense review on the performance of PCM-based lithium-ion battery cooling with aging effect in Indian climate conditions

Inorganic Chemistry Communications, Journal Year: 2024, Volume and Issue: 169, P. 113032 - 113032

Published: Aug. 29, 2024

Language: Английский

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Analysis and design of air-heat pipe composite cooling of high power density motor

Applied Thermal Engineering, Journal Year: 2023, Volume and Issue: 236, P. 121495 - 121495

Published: Sept. 7, 2023

Language: Английский

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