Flow boiling in novel radial microchannels for cooling of electronic devices and modules of annular temperature distribution DOI

Biqi Cao,

Junye Li, Zan Wu

et al.

International Journal of Heat and Mass Transfer, Journal Year: 2024, Volume and Issue: 239, P. 126555 - 126555

Published: Dec. 10, 2024

Language: Английский

A Review of Non-Uniform Load Distribution and Solutions in Data Centers: Micro-Scale Liquid Cooling and Large-Scale Air Cooling DOI Creative Commons
Yifan Li,

Congzhe Zhu,

Xiuming Li

et al.

Energies, Journal Year: 2025, Volume and Issue: 18(1), P. 149 - 149

Published: Jan. 2, 2025

Nowadays, the number of transistors on electronic components is increasing exponentially leading to an ultra-high heat flux (106~107 W/m2). The non-uniform load distribution chip and local hot spots in thermal environment are key issues a data center (DC). Microchannel liquid cooling effective method inhibit accumulation chip. Optimizing air crucial approach realizing energy savings. This study summarizes latest research management by microchannel optimization DCs. existing concerning structure universality sink (MCHS), stability flow boiling new coolant, prediction spots, intelligent control system identified. Furthermore, novel strategy multi-scale synergy recommended, which expected suppress heighten temperature uniformity. review provides valuable insights into for It paves way applying innovative technologies artificial intelligence methods promote efficient operation low-carbon retrofit

Language: Английский

Citations

2
Heat transfer analysis of the flat plate heat pipe − like system with ordered porous wick structure: Effect of gravitational orientation DOI
Surendra Singh Rathore,

Balkrishna Mehta,

Pradeep Kumar

et al.

Applied Thermal Engineering, Journal Year: 2025, Volume and Issue: unknown, P. 125612 - 125612

Published: Jan. 1, 2025

Language: Английский

Citations

0
Numerical investigation of the hydrothermal performance in novel cooled panels with flow-guided pin fins and secondary channels for reusable launch vehicles DOI

T.Y. Zhang,

Hanzhong Liu, Qingguo Fei

et al.

Energy, Journal Year: 2025, Volume and Issue: unknown, P. 135991 - 135991

Published: April 1, 2025

Language: Английский

Citations

0
Heat transfer and pressure drop characteristics of microchannel cold plate in commercial CPU-package cooling system DOI
Zi-Xing Wang, Wen‐Quan Tao

International Journal of Heat and Mass Transfer, Journal Year: 2025, Volume and Issue: 246, P. 127060 - 127060

Published: April 10, 2025

Language: Английский

Citations

0
Numerical simulation of a novel composite microchannel for large-scale THz phased array antennas thermal management DOI
Zhengpeng Chen, Bo Yuan, Jie Yang

et al.

International Journal of Thermal Sciences, Journal Year: 2025, Volume and Issue: 214, P. 109924 - 109924

Published: April 15, 2025

Language: Английский

Citations

0
Numerical and experimental analysis of hydraulic and thermal performance in additively manufactured topology-optimized heat sinks with different geometric features DOI
Qidong Sun, Da Geng, Jiajie Guo

et al.

Applied Thermal Engineering, Journal Year: 2025, Volume and Issue: unknown, P. 126619 - 126619

Published: April 1, 2025

Language: Английский

Citations

0
Flow boiling in novel radial microchannels for cooling of electronic devices and modules of annular temperature distribution DOI

Biqi Cao,

Junye Li, Zan Wu

et al.

International Journal of Heat and Mass Transfer, Journal Year: 2024, Volume and Issue: 239, P. 126555 - 126555

Published: Dec. 10, 2024

Language: Английский

Citations

1