Journal of Materials Science Materials in Electronics, Journal Year: 2024, Volume and Issue: 35(35)
Published: Dec. 1, 2024
Language: Английский
Journal of Materials Science Materials in Electronics, Journal Year: 2024, Volume and Issue: 35(35)
Published: Dec. 1, 2024
Language: Английский
Small, Journal Year: 2025, Volume and Issue: unknown
Published: April 1, 2025
Abstract The modulation of transport properties in ceramic‐based semiconductors can be used to optimize the electromagnetic response mechanism and performance. A semiconductor ceramic foam interlayer wall (SCFW) is designed by a physical vapor deposition method. structural SCFW composed semiconductor‐insulator‐semiconductor layers, incorporating composite system SiC, Al 4.8 Si 1.2 O 9.6 , 2 3 . Moreover, hierarchical network structure controlled pyrolysis‐deposition kinetic process. Electrons holes are transported through heterojunctions between SiC achieving effective charge relaxation. matrix provides lightweight (density 0.967 g cm −3 ), while determines excellent wave (EMW) absorption performance SCFW, with an bandwidth up 14.8 GHz under (minimum reflection loss RL min = −50.6 dB). has been proven exhibit corrosion resistance thermal insulation properties, conductivity 0.025 W m −1 K This study valuable insights into design dielectric property optimization nanocomposites, which leads strong polarization loss, opening new avenues for application EMW absorbers, ceramics.
Language: Английский
Citations
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Published: April 1, 2025
Language: Английский
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Published: April 1, 2025
Language: Английский
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Published: April 1, 2025
Language: Английский
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Published: April 1, 2025
Language: Английский
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Published: Sept. 1, 2024
Language: Английский
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Published: March 1, 2025
Language: Английский
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Published: March 1, 2025
Language: Английский
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Published: April 1, 2025
Language: Английский
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Published: April 1, 2025
Language: Английский
Citations
0