Simulation and Assessment of Thermal-Stress Analysis of Welding Materials in IGBT DOI Creative Commons
Yang Yang, Jibing Chen, Bowen Liu

et al.

Micromachines, Journal Year: 2024, Volume and Issue: 15(12), P. 1519 - 1519

Published: Dec. 20, 2024

Insulated gate bipolar transistors (IGBTs), as an important power semiconductor device, are susceptible to thermal stress, fatigue, and mechanical stresses under high-voltage, high-current, high-power conditions. Elevated heat dissipation within the module leads fluctuating rises in temperature that accelerate its own degradation failure, ultimately causing damage a whole posing threat operator safety. Through ANSYS Workbench simulation analysis, it is possible accurately predict distribution, equivalent strain of solder materials actual working conditions, thus revealing changing laws heat–mechanical interaction materials. Simulation analysis results show that, steady-state operating highest point IGBT module’s overall junction occurs center chip. Nanogold exhibited best performance terms stress-strain among five solders studied this paper; defects near edges caused greater harm compared those closer layer’s center. In located edge corners produced larger strains. Crazing joints allows for faster transfer sources away from center; crazing has fewer detrimental effects on integrity through cracks. can model equipment realistic work comparing evaluating different types select most suitable material product design selection. This aids enhancing precision reliability.

Language: Английский

Carbon nanofiber-filled shape-memory epoxy sponge for adjustable microwave shielding DOI
Yongjie Yan, Qing‐Qing Ni

Materials Chemistry and Physics, Journal Year: 2024, Volume and Issue: 315, P. 129053 - 129053

Published: Feb. 13, 2024

Language: Английский

Citations

2

Integrated Thermal Conductive and Electromagnetic Interference Shielding Performance in Polyimide Composite: Impact of Carbon Felt‐Graphene Van der Waals Heterostructure DOI Open Access
Xiaohui Yang, Nan Wang, Xiong Li

et al.

Macromolecular Rapid Communications, Journal Year: 2024, Volume and Issue: 45(22)

Published: Aug. 13, 2024

With the widespread application of highly integrated electronic devices, urgent development multifunctional polymer-based composite materials with high electromagnetic interference shielding effectiveness (EMI SE) and thermal conductivity capabilities is critically essential. Herein, a graphene/carbon felt/polyimide (GCF/PI) prepared through constructing 3D van der Waals heterostructure by heating carbon felt graphene at temperature. The GCF-3/PI exhibits highest through-plane 1.31 W·m

Language: Английский

Citations

2

Nano-layered Double Hydroxides as Efficient Endothermic, Strengthening, and Flame-retardant Agents for Fly Ash/Polyurethane Composite Materials DOI
Sitong Zhang, Ruicheng Feng, Jing Zhang

et al.

Composites Communications, Journal Year: 2024, Volume and Issue: 53, P. 102168 - 102168

Published: Nov. 16, 2024

Language: Английский

Citations

1

Influence of casting-warm pressing process on the thermal conductivity of micro–nano-Al2O3 substrate DOI Creative Commons
Yang Lyu, Guoli Sun,

Xueqiong Ouyang

et al.

Journal of Applied Physics, Journal Year: 2024, Volume and Issue: 136(16)

Published: Oct. 22, 2024

Alumina substrates are increasingly used for high-power integrated circuits due to their high thermal conductivity, low expansion coefficient, and excellent insulation properties. However, pores in the green tape from casting process reduce conductivity permittivity of sintered ceramic substrate. Researchers have attempted minimize porosity with chemical additives or by sintering pure alumina at temperatures above 1650 °C, but these methods often degrade quality substrate evenness. This study proposes a low-cost casting-warm pressing densify using micro–nano-mixed powders relatively temperatures. The results indicate that relative density prepared 1500 °C is 93%, 4.4% improvement over process. Additionally, reaches 15.89 W/(m K), which 1.4 times higher than Microstructure analysis shows micro- nano-multi-scale mixed forms novel conduction enhancement mechanism. Large particles overlap, while small fill spaces between large particles. connected micrometer-sized particle skeletons form net channels substrate, improving heat transfer.

Language: Английский

Citations

0

In-situ growing carbon nanotubes reinforced highly heat dissipative three-dimensional aluminum framework composites DOI
Bin Wang, Yaotian Yan, Bin Qin

et al.

Journal of Colloid and Interface Science, Journal Year: 2024, Volume and Issue: 683, P. 799 - 817

Published: Dec. 18, 2024

Language: Английский

Citations

0

Low‐Temperature Cured and High‐Toughness Epoxy Resin Modified by Triblock Liquid Rubber DOI Open Access
Yiliang Fang,

Lifeng Cai,

Chongqing Deng

et al.

Journal of Applied Polymer Science, Journal Year: 2024, Volume and Issue: 142(11)

Published: Dec. 17, 2024

ABSTRACT Low‐temperature cured epoxy resin (EP) is a suitable system for bonding thermal and temperature‐sensitive devices, which can also reduce energy consumption production costs. In order to further broaden the application range of low‐temperature curing EP systems in amine‐sensitive environments, addition selecting well‐compatible agent, an effective rubber form three‐dimensional network structure with matrix, so as significantly improve toughness EP. this work, two kinds triblock liquid hydroxy‐terminated polypropylene glycol‐polybutadiene‐polypropylene glycol (HTPO‐PB‐PO) polyphenylethylene oxide‐polybutadiene‐polyphenylethylene oxide (HTSO‐PB‐SO) controlled molecular weight are synthesized adopted mechanical properties methyl hexahydro phthalic anhydride (MEHHPA). It found that all rubber‐modified be below 100°C, mechanism similar pure system. Compared original EP, impact resistance modified samples improved, glass transition temperature ( T g ) similar, among best strength reach 16.22 kJ/m 2 , 62.7% higher than sample only slightly reduced decomposition temperature. These results provide material excellent properties, high dimensional accuracy, heat environments while reducing costs due high‐temperature components consumption.

Language: Английский

Citations

0

Simulation and Assessment of Thermal-Stress Analysis of Welding Materials in IGBT DOI Creative Commons
Yang Yang, Jibing Chen, Bowen Liu

et al.

Micromachines, Journal Year: 2024, Volume and Issue: 15(12), P. 1519 - 1519

Published: Dec. 20, 2024

Insulated gate bipolar transistors (IGBTs), as an important power semiconductor device, are susceptible to thermal stress, fatigue, and mechanical stresses under high-voltage, high-current, high-power conditions. Elevated heat dissipation within the module leads fluctuating rises in temperature that accelerate its own degradation failure, ultimately causing damage a whole posing threat operator safety. Through ANSYS Workbench simulation analysis, it is possible accurately predict distribution, equivalent strain of solder materials actual working conditions, thus revealing changing laws heat–mechanical interaction materials. Simulation analysis results show that, steady-state operating highest point IGBT module’s overall junction occurs center chip. Nanogold exhibited best performance terms stress-strain among five solders studied this paper; defects near edges caused greater harm compared those closer layer’s center. In located edge corners produced larger strains. Crazing joints allows for faster transfer sources away from center; crazing has fewer detrimental effects on integrity through cracks. can model equipment realistic work comparing evaluating different types select most suitable material product design selection. This aids enhancing precision reliability.

Language: Английский

Citations

0