Advanced Composites and Hybrid Materials, Journal Year: 2022, Volume and Issue: 5(3), P. 2066 - 2077
Published: Sept. 1, 2022
Language: Английский
Advanced Composites and Hybrid Materials, Journal Year: 2022, Volume and Issue: 5(3), P. 2066 - 2077
Published: Sept. 1, 2022
Language: Английский
Advanced Composites and Hybrid Materials, Journal Year: 2022, Volume and Issue: 5(2), P. 704 - 754
Published: June 1, 2022
Language: Английский
Citations
253Advanced Composites and Hybrid Materials, Journal Year: 2022, Volume and Issue: 5(2), P. 1054 - 1066
Published: May 25, 2022
Language: Английский
Citations
203Advanced Composites and Hybrid Materials, Journal Year: 2022, Volume and Issue: 5(2), P. 606 - 626
Published: June 1, 2022
Language: Английский
Citations
198Angewandte Chemie International Edition, Journal Year: 2022, Volume and Issue: 62(5)
Published: Nov. 22, 2022
Thermal conduction for electronic equipment has grown in importance light of the burgeoning 5G communication. It is imperatively desired to design highly thermally conductive fillers and polymer composite films with prominent Joule heating characteristics extensive mechanical properties. In this work, "solvothermal & situ growth" method carried out prepare "Fungal tree"-like hetero-structured silver nanowires@boron nitride nanosheet (AgNWs@BNNS) fillers. The AgNWs@BNNS/ANF are obtained by "suction filtration self-assembly hot-pressing". When mass fraction AgNWs@BNNS 50 wt%, film presents optimal thermal conductivity coefficient 9.44 W/(m ⋅ K) excellent tensile strength 136.6 MPa, good temperature-voltage response characteristics, superior electrical stability reliability, which promise a wide application potential devices.
Language: Английский
Citations
198Advanced Composites and Hybrid Materials, Journal Year: 2022, Volume and Issue: 5(3), P. 1939 - 1950
Published: July 19, 2022
Language: Английский
Citations
187Advanced Functional Materials, Journal Year: 2023, Volume and Issue: 33(36)
Published: June 15, 2023
Abstract Recently, the need for miniaturization and high integration have steered a strong technical wave in developing (micro‐)electronic devices. However, excessive amounts of heat may be generated during operation/charging, severely affecting device performance leading to life/property loss. Benefiting from their low density, easy processing manufacturing cost, thermally conductive polymer composites become research hotspot mitigate disadvantage heat, with potential applications 5G communication, electronic packaging energy transmission. By far, reported thermal conductivity coefficient (λ) composite is far expectation. Deeper understanding transfer mechanism desired next generation composites. This review holistically scopes current advances this field, while giving special attention critical factors that affect as well conduction mechanisms on how enhance λ value. covers such interfacial resistance, chain structure polymer, intrinsic value different fillers, orientation/configuration nanoparticles, 3D interconnected networks, technology, etc. The devices are summarized. existing problems also discussed, new challenges opportunities prospected.
Language: Английский
Citations
185Chemical Engineering Journal, Journal Year: 2022, Volume and Issue: 448, P. 137742 - 137742
Published: June 23, 2022
Language: Английский
Citations
155Advanced Composites and Hybrid Materials, Journal Year: 2022, Volume and Issue: 5(3), P. 2021 - 2030
Published: Aug. 26, 2022
Language: Английский
Citations
152Advanced Composites and Hybrid Materials, Journal Year: 2023, Volume and Issue: 6(2)
Published: Feb. 20, 2023
Language: Английский
Citations
126Angewandte Chemie, Journal Year: 2022, Volume and Issue: 135(5)
Published: Nov. 22, 2022
Abstract Thermal conduction for electronic equipment has grown in importance light of the burgeoning 5G communication. It is imperatively desired to design highly thermally conductive fillers and polymer composite films with prominent Joule heating characteristics extensive mechanical properties. In this work, “solvothermal & situ growth” method carried out prepare “Fungal tree”‐like hetero‐structured silver nanowires@boron nitride nanosheet (AgNWs@BNNS) fillers. The AgNWs@BNNS/ANF are obtained by “suction filtration self‐assembly hot‐pressing”. When mass fraction AgNWs@BNNS 50 wt%, film presents optimal thermal conductivity coefficient 9.44 W/(m ⋅ K) excellent tensile strength 136.6 MPa, good temperature‐voltage response characteristics, superior electrical stability reliability, which promise a wide application potential devices.
Language: Английский
Citations
117