Influence of Grinding Parameters on Surface Roughness and Subsurface Crack Damage Depth of Sapphire Crystal DOI Open Access
Yunfei Hou, Yufei Gao, Chun‐Feng Yang

et al.

Materials, Journal Year: 2025, Volume and Issue: 18(11), P. 2461 - 2461

Published: May 24, 2025

Single sapphire crystals has been widely used in technology such as light emitting diodes, lasers, high-temperature and high-voltage devices, special windows, optical systems, grinding is an important process of their machining. In order to reveal the influence wheel speed, depth, feed rate on ground surface quality crystals, a three-factor five-level orthogonal experiment was designed completed. Variance range analysis conducted experimental results using roughness Ra subsurface crack damage depth (SSD) evaluation indicators, optimized parameter combinations were explored. Furthermore, mathematical prediction models for power regression SSD established based data. The research indicate that within parameters this experiment, did not achieve full ductile removal material. Some material removed brittle mode, forming fractured pits surface, median propagation occurred subsurface, microcrack layer. showed consistent trend, which with greatest impact followed by depth. obtained under combination 0.326 μm 2.86 μm, respectively. provide basis guidance improving during grinding.

Language: Английский

Influence of Grinding Parameters on Surface Roughness and Subsurface Crack Damage Depth of Sapphire Crystal DOI Open Access
Yunfei Hou, Yufei Gao, Chun‐Feng Yang

et al.

Materials, Journal Year: 2025, Volume and Issue: 18(11), P. 2461 - 2461

Published: May 24, 2025

Single sapphire crystals has been widely used in technology such as light emitting diodes, lasers, high-temperature and high-voltage devices, special windows, optical systems, grinding is an important process of their machining. In order to reveal the influence wheel speed, depth, feed rate on ground surface quality crystals, a three-factor five-level orthogonal experiment was designed completed. Variance range analysis conducted experimental results using roughness Ra subsurface crack damage depth (SSD) evaluation indicators, optimized parameter combinations were explored. Furthermore, mathematical prediction models for power regression SSD established based data. The research indicate that within parameters this experiment, did not achieve full ductile removal material. Some material removed brittle mode, forming fractured pits surface, median propagation occurred subsurface, microcrack layer. showed consistent trend, which with greatest impact followed by depth. obtained under combination 0.326 μm 2.86 μm, respectively. provide basis guidance improving during grinding.

Language: Английский

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