Innovative Fluorinated Polyimides with Superior Thermal, Mechanical, and Dielectric Properties for Advanced Soft Electronics DOI Open Access
Yuwei Chen, Yidong Liu, Yonggang Min

et al.

Polymers, Journal Year: 2025, Volume and Issue: 17(3), P. 339 - 339

Published: Jan. 26, 2025

This study addresses the limitations of traditional polyimides (PIs) in high-frequency and high-temperature soft electronic applications, then introducing trifluoromethylbenzene (TFMB) into molecular structure employing various diamines as connecting components to solve bottleneck. The innovative design enhances thermal, mechanical, dielectric properties, overcoming challenges balancing these performances. optimized fluorinated PI (TPPI50) exhibits exceptional including a glass transition temperature 402 °C, thermal decomposition 563 tensile strength 232.73 MPa, elongation at break 26.26%, constant 2.312 1 MHz with loss low 0.00676. These improvements are attributed unique synergy between TFMB’s groups, which reduce polarization, biphenyl structure, reinforces chain stability. Compared conventional PIs, TPPI50 demonstrates superior comprehensive performance, making it highly suitable for circuits, signal transmission, advanced applications such wearable devices biosensors. provides robust framework industrial offering path next-generation electronics enhanced reliability performance.

Language: Английский

Innovative Fluorinated Polyimides with Superior Thermal, Mechanical, and Dielectric Properties for Advanced Soft Electronics DOI Open Access
Yuwei Chen, Yidong Liu, Yonggang Min

et al.

Polymers, Journal Year: 2025, Volume and Issue: 17(3), P. 339 - 339

Published: Jan. 26, 2025

This study addresses the limitations of traditional polyimides (PIs) in high-frequency and high-temperature soft electronic applications, then introducing trifluoromethylbenzene (TFMB) into molecular structure employing various diamines as connecting components to solve bottleneck. The innovative design enhances thermal, mechanical, dielectric properties, overcoming challenges balancing these performances. optimized fluorinated PI (TPPI50) exhibits exceptional including a glass transition temperature 402 °C, thermal decomposition 563 tensile strength 232.73 MPa, elongation at break 26.26%, constant 2.312 1 MHz with loss low 0.00676. These improvements are attributed unique synergy between TFMB’s groups, which reduce polarization, biphenyl structure, reinforces chain stability. Compared conventional PIs, TPPI50 demonstrates superior comprehensive performance, making it highly suitable for circuits, signal transmission, advanced applications such wearable devices biosensors. provides robust framework industrial offering path next-generation electronics enhanced reliability performance.

Language: Английский

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