Boron Nitride‐Polymer Composites with High Thermal Conductivity: Preparation, Functionalization Strategy and Innovative Structural Regulation

Small, Journal Year: 2025, Volume and Issue: unknown

Published: March 30, 2025

Abstract The escalating thermal challenges posed by increasing power densities in electronic devices emerge as a critical barrier to maintain their sustained and reliable operation. Addressing this issue requires the strategic development of materials with superior conductivity properties facilitate progress high‐power electronics development. Thermal conductive polymer composites incorporating ceramic material renowned for exceptional adjustability, insulating properties, moldability, are emerging promising solution urgent challenge. Hexagonal boron nitride (h‐BN) nanomaterials highly candidates management applications, owing mechanical stability, remarkable coefficients, minimal expansion characteristics, outstanding chemical inertness. In work, ≈10 years on high nitride‐filled is thoroughly summarized. Moreover, strategies h‐BN other nanomaterials‐filled at synthesis, functionalization, innovative structural design discussed detail. main future nitride‐polymer also proposed, which will provide meaningful guidance practical applications materials.

Language: Английский

Effect of Covalent Functionalization on Thermal Transport across Paraffin/Graphene Nanocomposite Interfaces

ACS Omega, Journal Year: 2025, Volume and Issue: unknown

Published: April 15, 2025

Language: Английский