Manipulating Thin Film Boiling to Achieve Record-Breaking High Heat Flux DOI
Yuxiang Zhang, Xuan Zhao, Jiahua Li

et al.

Published: Jan. 1, 2023

Language: Английский

A review on the liquid cooling thermal management system of lithium-ion batteries DOI
Chunxia Wu,

Yalong Sun,

Heng Tang

et al.

Applied Energy, Journal Year: 2024, Volume and Issue: 375, P. 124173 - 124173

Published: Aug. 13, 2024

Language: Английский

Citations

36
A Review of Non-Uniform Load Distribution and Solutions in Data Centers: Micro-Scale Liquid Cooling and Large-Scale Air Cooling DOI Creative Commons
Yifan Li,

Congzhe Zhu,

Xiuming Li

et al.

Energies, Journal Year: 2025, Volume and Issue: 18(1), P. 149 - 149

Published: Jan. 2, 2025

Nowadays, the number of transistors on electronic components is increasing exponentially leading to an ultra-high heat flux (106~107 W/m2). The non-uniform load distribution chip and local hot spots in thermal environment are key issues a data center (DC). Microchannel liquid cooling effective method inhibit accumulation chip. Optimizing air crucial approach realizing energy savings. This study summarizes latest research management by microchannel optimization DCs. existing concerning structure universality sink (MCHS), stability flow boiling new coolant, prediction spots, intelligent control system identified. Furthermore, novel strategy multi-scale synergy recommended, which expected suppress heighten temperature uniformity. review provides valuable insights into for It paves way applying innovative technologies artificial intelligence methods promote efficient operation low-carbon retrofit

Language: Английский

Citations

2
Manipulating thin film boiling to achieve record-breaking high heat flux DOI
Yuxiang Zhang, Xuan Zhao, Jiahua Li

et al.

International Journal of Heat and Mass Transfer, Journal Year: 2024, Volume and Issue: 224, P. 125308 - 125308

Published: Feb. 14, 2024

Language: Английский

Citations

7
Microfluidic controllable production and morphology-independent phase-change heat transfer of boehmite nanofluids DOI

Junsheng Hou,

Dongyu Li,

Xiong Zhao

et al.

Chemical Engineering Journal, Journal Year: 2024, Volume and Issue: 488, P. 150605 - 150605

Published: March 29, 2024

Language: Английский

Citations

6
Experimental study of an integrated aluminum flat plate heat pipe for lightweight thermal management in electronic devices DOI
Jingjing Bai, Yiming Li,

Yincai Zhao

et al.

Applied Thermal Engineering, Journal Year: 2024, Volume and Issue: 257, P. 124332 - 124332

Published: Sept. 6, 2024

Language: Английский

Citations

6
Enhanced capillary-driven thin film boiling through superhydrophilic mesh wick structure DOI
Longsheng Lu, Bo Tao, Shu Yang

et al.

International Journal of Thermal Sciences, Journal Year: 2025, Volume and Issue: 212, P. 109782 - 109782

Published: Feb. 10, 2025

Language: Английский

Citations

0
Experimental investigation on the phase change liquid cooling characteristics in the offset grooved microchannel heat sink DOI
Yifan Li,

Congzhe Zhu,

Guodong Xia

et al.

Applied Thermal Engineering, Journal Year: 2025, Volume and Issue: unknown, P. 126032 - 126032

Published: Feb. 1, 2025

Language: Английский

Citations

0
Experimental study on nucleate boiling of liquid nitrogen spray cooling on superhydrophilic microstructured surface DOI
Yiming Fan, Fengmin Su, Liang‐Shih Fan

et al.

International Journal of Thermal Sciences, Journal Year: 2025, Volume and Issue: 213, P. 109800 - 109800

Published: Feb. 26, 2025

Language: Английский

Citations

0
Teardrop-like micro pin fin coated nanotube arrays chip for enhancement of flow boiling electronics cooling DOI
Hongqiang Chen, Quan Gao, Xiang Ma

et al.

International Journal of Thermal Sciences, Journal Year: 2025, Volume and Issue: 214, P. 109854 - 109854

Published: March 8, 2025

Language: Английский

Citations

0
Novel ultrathin vapor chambers with anti-centrifugal wick structures for heat dissipation under high-g loads DOI
Changkun Shao,

Hongjian Leng,

Gong Chen

et al.

Physics of Fluids, Journal Year: 2025, Volume and Issue: 37(4)

Published: April 1, 2025

Ultrathin vapor chamber (UTVC) is considered an ideal solution to the heat dissipation problem of aircraft and spacecraft. However, cooling performance rapidly deteriorates due obstruction liquid return flow under acceleration overload, posing a serious threat safety More seriously, few theoretical models can reveal mechanism transfer centrifugal conditions, resulting in increase design cost difficulty anti-centrifugal ultrathin (ACUTVC). Herein, two novel ACUTVCs based on wicks were proposed, which extensively tested compared with UTVC traditional wick. Results show that effective thermal conductivities exceed 1500 W m−1 K−1 even extreme conditions 6 g acceleration, are about four times copper comparable commercial graphene films, demonstrating reliable management capability high-g conditions. The mechanisms different revealed by model proposed this work, maximum error 26.27% experimental results, showing good agreement. Model results highlight potential optimization approaches wick structures, may guide new directions for ACUTVC.

Language: Английский

Citations

0