Advanced Functional Materials, Journal Year: 2024, Volume and Issue: unknown

Published: Dec. 30, 2024

Abstract Epoxy resins, by showing outstanding performances, stand out as the most applied materials in thermoset products. However, their excellent properties, associated with covalently cross‐linked structures, come at expense of recyclability, thus posing environmental and regulatory challenges. Herein, starting from recently explored reversibility robust poly(β‐amino amide)s, dynamic curing agents are synthesized a one‐pot procedure for use preparation epoxy‐derived networks. The obtained retain desirable properties while being fully (re)processable, high temperature‐dependent viscoelasticity (activation energy (E ) ≈230 to 270 kJ mol −1 ). Moreover, this new generation epoxy shows resistance hydrolysis creep elevated temperatures (up 120 °C). As an entry point further applications, reversible implemented adhesive formulations, showcasing lap shear strengths that comparable commercial hardeners 9 MPa). β‐amino amide groups provide adhesives additional functionality heat‐triggered deconstruction (130 150 °C), re‐bonding capacity up 80% recovery lap‐shear strength. To encourage industrial adoption, cost‐effective, drop‐in synthesis protocol is developed using only bulk chemicals, hence facilitating practical implementation.

Language: Английский