Process-induced influences on epoxy-based encapsulated reliability of high power modules DOI
Chang‐Chun Lee,

Meng-Tse Chen,

Jui‐Chang Chuang

et al.

International Journal of Mechanical Sciences, Journal Year: 2025, Volume and Issue: unknown, P. 110394 - 110394

Published: May 1, 2025

Language: Английский

Process-induced influences on epoxy-based encapsulated reliability of high power modules DOI
Chang‐Chun Lee,

Meng-Tse Chen,

Jui‐Chang Chuang

et al.

International Journal of Mechanical Sciences, Journal Year: 2025, Volume and Issue: unknown, P. 110394 - 110394

Published: May 1, 2025

Language: Английский

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