Nano-Micro Letters,
Journal Year:
2021,
Volume and Issue:
13(1)
Published: Aug. 18, 2021
Abstract
With
the
widespread
application
of
electronic
communication
technology,
resulting
electromagnetic
radiation
pollution
has
been
significantly
increased.
Metal
matrix
interference
(EMI)
shielding
materials
have
disadvantages
such
as
high
density,
easy
corrosion,
difficult
processing
and
price,
etc.
Polymer
EMI
composites
possess
light
weight,
corrosion
resistance
processing.
However,
current
polymer
present
relatively
low
electrical
conductivity
poor
performance.
This
review
firstly
discusses
key
concept,
loss
mechanism
test
method
shielding.
Then
development
status
is
summarized,
research
progress
with
different
structures
illustrated,
especially
for
their
preparation
methods
evaluation.
Finally,
corresponding
scientific
technical
problems
are
proposed,
trend
also
prospected.
"Image
missing"
Nano-Micro Letters,
Journal Year:
2022,
Volume and Issue:
14(1)
Published: March 25, 2022
With
rapid
development
of
5G
communication
technologies,
electromagnetic
interference
(EMI)
shielding
for
electronic
devices
has
become
an
urgent
demand
in
recent
years,
where
the
corresponding
EMI
materials
against
detrimental
radiation
plays
essential
role.
Meanwhile,
with
high
flexibility
and
functional
integrity
are
highly
demanded
emerging
applications.
Hitherto,
a
variety
flexible
lightweight
multifunctionalities
have
been
developed.
In
this
review,
we
not
only
introduce
materials,
but
also
elaborate
mechanisms
index
"green
shielding"
performance.
addition,
construction
strategies
sophisticated
summarized.
Finally,
propose
several
possible
research
directions
near
future,
which
could
be
inspirational
to
fast-growing
next-generation
reliable
multipurpose
protections
as
offered
by
materials.
Angewandte Chemie International Edition,
Journal Year:
2022,
Volume and Issue:
62(5)
Published: Nov. 22, 2022
Thermal
conduction
for
electronic
equipment
has
grown
in
importance
light
of
the
burgeoning
5G
communication.
It
is
imperatively
desired
to
design
highly
thermally
conductive
fillers
and
polymer
composite
films
with
prominent
Joule
heating
characteristics
extensive
mechanical
properties.
In
this
work,
"solvothermal
&
situ
growth"
method
carried
out
prepare
"Fungal
tree"-like
hetero-structured
silver
nanowires@boron
nitride
nanosheet
(AgNWs@BNNS)
fillers.
The
AgNWs@BNNS/ANF
are
obtained
by
"suction
filtration
self-assembly
hot-pressing".
When
mass
fraction
AgNWs@BNNS
50
wt%,
film
presents
optimal
thermal
conductivity
coefficient
9.44
W/(m
⋅
K)
excellent
tensile
strength
136.6
MPa,
good
temperature-voltage
response
characteristics,
superior
electrical
stability
reliability,
which
promise
a
wide
application
potential
devices.
