Journal of Physics Condensed Matter,
Journal Year:
2024,
Volume and Issue:
36(46), P. 463002 - 463002
Published: Aug. 16, 2024
Effective
thermal
management
is
crucial
for
the
performance
and
stability
of
modern
electronics,
emphasizing
demand
high
conductivity
(κ).
This
review
summarizes
latest
development
in
highκ,
discussing
emerging
theories,
innovative
materials
practical
applications
interfacial
heat
dissipation.
Unique
phononic
transport
behaviors
are
discussed,
including
four
phonon-phonon
scattering,
hydrodynamic
phonons,
surface
phonon-polaritons,
more.
The
also
highlights
with
such
as
two-dimensional
pentagonal
structures,
boron
carbon
nitrogen
hexagonal
arsenide
Nano-Micro Letters,
Journal Year:
2025,
Volume and Issue:
17(1)
Published: Feb. 7, 2025
Abstract
The
microstructure
design
for
thermal
conduction
pathways
in
polymeric
electrical
encapsulation
materials
is
essential
to
meet
the
stringent
requirements
efficient
management
and
runaway
safety
modern
electronic
devices.
Hence,
a
composite
with
three-dimensional
network
(Ho/U-BNNS/WPU)
developed
by
simultaneously
incorporating
magnetically
modified
boron
nitride
nanosheets
(M@BNNS)
non-magnetic
organo-grafted
BNNS
(U-BNNS)
into
waterborne
polyurethane
(WPU)
synchronous
molding
under
horizontal
magnetic
field.
results
indicate
that
continuous
in-plane
formed
M@BNNS
aligned
along
field
direction,
combined
bridging
structure
established
U-BNNS,
enable
Ho/U-BNNS/WPU
exhibit
exceptional
(
λ
//
)
through-plane
conductivities
⊥
).
In
particular,
addition
of
30
wt%
5
composites
reach
11.47
2.88
W
m
−1
K
,
respectively,
which
representing
194.2%
improvement
compared
single
orientation
M@BNNS.
Meanwhile,
exhibits
distinguished
capabilities
as
interface
LED
chips.
also
demonstrate
excellent
flame
retardancy,
peak
heat
release
total
reduced
58.9%
36.9%,
WPU.
Thus,
this
work
offers
new
insights
thermally
conductive
structural
flame-retardant
systems
polymer
composites,
presenting
broad
application
potential
packaging
fields.
ACS Applied Materials & Interfaces,
Journal Year:
2024,
Volume and Issue:
16(6), P. 7883 - 7893
Published: Feb. 1, 2024
Effective
heat
dissipation
and
real-time
temperature
monitoring
are
crucial
for
ensuring
the
long-term
stable
operation
of
modern,
high-performance
electronic
products.
This
study
proposes
a
silicon
rubber
polydimethylsiloxane
(PDMS)-based
nanocomposite
with
rapid
thermal
response
high
conductivity.
enables
both
The
reported
material
primarily
consists
thermally
conductive
layer
(Al2O3/PDMS
composites)
reversible
thermochromic
(organic
material,
graphene
oxide,
PDMS
nanocoating;
OTM-GO/PDMS).
conductivity
OTM-GO/Al2O3/PDMS
nanocomposites
reached
4.14
W
m–1
K–1,
reflecting
an
increase
2200%
relative
to
that
pure
PDMS.
When
operating
35,
45,
65
°C,
surface
turned
green,
yellow,
red,
respectively,
time
was
only
30
s.
also
exhibited
outstanding
repeatability
maintained
excellent
color
stability
over
20
repeated
applications.
SusMat,
Journal Year:
2024,
Volume and Issue:
unknown
Published: Sept. 23, 2024
Abstract
The
miniaturization,
integration,
and
high
data
throughput
of
electronic
chips
present
challenging
demands
on
thermal
management,
especially
concerning
heat
dissipation
at
interfaces,
which
is
a
fundamental
scientific
question
as
well
an
engineering
problem—a
death
problem
called
in
semiconductor
industry.
A
comprehensive
examination
interfacial
resistance
has
been
given
from
physics
perspective
2022
Review
Modern
Physics
.
Here,
we
provide
detailed
overview
materials
perspective,
focusing
the
optimization
structure
compositions
interface
(TIMs)
interact/contact
with
source
sink.
First,
discuss
impact
conductivity,
bond
line
thickness,
contact
TIMs.
Second,
it
pointed
out
that
there
are
two
major
routes
to
improve
transfer
through
interface.
One
reduce
TIM's
(
R
TIM
)
TIMs
strategies
like
incorporating
conductive
fillers,
enhancing
treatment
techniques.
other
c
by
improving
effective
contact,
strengthening
bonding,
utilizing
mass
gradient
alleviate
vibrational
mismatch
between
source/sink.
Finally,
such
challenges
theories,
potential
developments
sustainable
TIMs,
application
AI
design
also
explored.
ACS Applied Materials & Interfaces,
Journal Year:
2024,
Volume and Issue:
16(26), P. 34367 - 34376
Published: June 19, 2024
The
rising
concern
over
the
usage
of
electronic
devices
and
operating
environment
requires
efficient
thermal
interface
materials
(TIMs)
to
take
away
excess
heat
generated
from
hotspots.
TIMs
are
crucial
in
dissipating
undesired
by
transferring
energy
source
sink.
Silicone
oil
(SO)-based
composites
most
used
due
their
strong
bonding
oxidation
resistance.
However,
grease
performance
is
unreliable
aging
effects,
toxic
chemicals,
a
higher
percentage
fillers.
In
this
work,
prepared
using
exfoliated
hexagonal
boron
nitride
nanosheets
(h-BNNS)
as
nanofiller,
they
were
functionalized
ecofriendly
natural
biopolymer
soy
protein
isolate
(SPI).
h-BNNS
has
an
average
lateral
size
∼266
nm.
h-BNNS/SPI
fillers
SO
matrix,
solution
mixing.
Hydrogen
present
between
organic
chain/oxygen
silicone
polymer,
evident
FTIR
measurements.
conductivity
h-BNNS/SPI/SO
was
measured
modified
transient
plane
(MTPS)
method.
At
room
temperature,
maximum
1.162
Wm–1K–1
(833%
enhancement)
at
50
wt
%
3:1
ratio
h-BNNS:SPI,
resistance
(TR)
composite
5.249
×
106
K/W
which
calculated
Foygel
nonlinear
model.
management
application
demonstrated
applying
TIM
on
10
W
LED
bulb.
It
found
that
during
heating,
decreases
surface
temperature
∼6
°C
compared
with
pure
SO-based
after
min
ON
condition.
During
cooling,
reduces
∼8
under
OFF
conditions
within
1
min.
results
indicate
polymers
can
effectively
stabilize
link
layered
materials,
enhancing
efficiency
for
cooling
electronics
LEDs.
