Thermal Conductive Polymer Composites: Recent Progress and Applications
Jianfeng Tan,
No information about this author
Yuan Zhang
No information about this author
Molecules,
Journal Year:
2024,
Volume and Issue:
29(15), P. 3572 - 3572
Published: July 29, 2024
As
microelectronics
technology
advances
towards
miniaturization
and
higher
integration,
the
imperative
for
developing
high-performance
thermal
management
materials
has
escalated.
Thermal
conductive
polymer
composites
(TCPCs),
which
leverage
benefits
of
matrices
unique
effects
nano-enhancers,
are
gaining
focus
as
solutions
to
overheating
due
their
low
density,
ease
processing,
cost-effectiveness.
However,
these
often
face
challenges
such
conductivities
that
lower
than
expected,
limiting
application
in
electronic
devices.
Despite
issues,
TCPCs
continue
demonstrate
broad
potential
across
various
industrial
sectors.
This
review
comprehensively
presents
progress
this
field,
detailing
mechanisms
conductivity
(TC)
discussing
factors
influence
performance,
intrinsic
properties
polymers,
interfacial
resistance,
fillers.
Additionally,
it
categorizes
summarizes
methods
enhance
TC
composites.
The
also
highlights
applications
emerging
areas
flexible
devices,
personal
management,
aerospace.
Ultimately,
by
analyzing
current
opportunities,
provides
clear
directions
future
research
development.
Language: Английский
Crosslinking/Spinning Strategies of Nanocellulose Enhances the Performances for Self-Powered Wearable Sensors
Xinke Yu,
No information about this author
Huancheng Huang,
No information about this author
P.G. Zhang
No information about this author
et al.
Nano Energy,
Journal Year:
2025,
Volume and Issue:
unknown, P. 110649 - 110649
Published: Jan. 1, 2025
Language: Английский
Janus membrane with oriented fiber structure for Boosted personal Wet-Thermal management
Chemical Engineering Journal,
Journal Year:
2024,
Volume and Issue:
unknown, P. 157995 - 157995
Published: Nov. 1, 2024
Language: Английский
Flexible Hydrogel Phase Change Composite Materials for Thermal Management of Human Bodies and Electronic Devices
Jiaxue Yu,
No information about this author
Lingling Wang,
No information about this author
Debing Wang
No information about this author
et al.
Published: Jan. 1, 2025
Language: Английский
Resilient ultrafine fiber sponges with thermal bridge structures for high-temperature traffic noise reduction
Yang Li,
No information about this author
Dingding Zong,
No information about this author
Yaning Sun
No information about this author
et al.
Journal of Colloid and Interface Science,
Journal Year:
2025,
Volume and Issue:
693, P. 137634 - 137634
Published: April 17, 2025
Language: Английский
Flexible hydrogel phase change composite materials for thermal management of human bodies and electronic devices
Jiaxue Yu,
No information about this author
Lingling Wang,
No information about this author
Debing Wang
No information about this author
et al.
Journal of Energy Storage,
Journal Year:
2025,
Volume and Issue:
123, P. 116786 - 116786
Published: April 25, 2025
Language: Английский
The patterned moisture-wicking and quick-drying fabric for surface enhanced Raman scattering analysis
Journal of Colloid and Interface Science,
Journal Year:
2025,
Volume and Issue:
unknown, P. 138098 - 138098
Published: June 1, 2025
Language: Английский
Bio-Inspired Thermal Conductive Fibers by Boron Nitride Nanosheet/Boron Nitride Hybrid
Jiajing Zhang,
No information about this author
P Zhang,
No information about this author
Chunhua Zhang
No information about this author
et al.
International Journal of Molecular Sciences,
Journal Year:
2024,
Volume and Issue:
25(20), P. 11156 - 11156
Published: Oct. 17, 2024
With
the
innovation
of
modern
electronics,
heat
dissipation
in
devices
faces
several
problems.
In
our
work,
boron
nitride
(BN)
with
good
thermal
conductivity
(TC)
was
successfully
fabricated
by
constructing
BN
along
axial
direction
and
surface-grafted
hybrid
composite
fibers
via
wet-spinning
hot-pressing
method.
The
unique
inter-outer
inter-interconnected
structure
exhibited
176.47%
enhancement
(TCE),
which
exhibits
TC,
mechanical
resistance,
chemical
resistance.
addition,
depending
on
special
fibers,
it
provides
a
new
strategy
for
fabricating
interface
materials
electronic
device.
Language: Английский