Designing
bio-based
adhesives
with
multiple
crosslinking
networks
has
significant
implications
for
the
green
and
sustainable
development
of
forestry
industry.
A
sawdust
based
network
adhesive
system
was
constructed
by
a
small
molecule
covalent
bridge
hydrogen
bond
grafting
chain
thioctic
acid
(TA)
supramolecule
oxidized
(OS)
as
carrier
first
second
network,
which
realized
toughening
strengthening
sawdust/thioctic
(OSTA)
adhesive.
Furthermore,
wood
interface
regulated
3-glycidyl
ether
oxy
propyl
trimethoxysilane,
introduced
active
epoxy
groups
to
interface.
Then,
third
interfacial
reaction
carboxyl
group,
hydroxyl
amino
group
in
OSTA
system.
The
dry
bonding
strength
OSTA-modified
can
reach
2.09
MPa,
is
75.6%
50.4%
higher
than
that
OS
TA
adhesives,
respectively,
water
resistance
increased
from
0
MPa
1.25
1.71
MPa.
In
addition,
not
only
shows
adhesion
performance
but
also
manifests
excellently
on
various
surface
energy
substrates,
such
skin,
glass,
ceramics,
plants,
rubber,
stainless
steel,
etc.,
multi-functional
properties.
This
work
broadens
prospects
applications
scenarios.
Chemistry of Materials,
Journal Year:
2023,
Volume and Issue:
35(18), P. 7730 - 7740
Published: Sept. 12, 2023
Adhesives
with
ultrastrong
adhesion
performance
and
environmental
tolerance
under
extreme
conditions,
such
as
low
temperatures
or
immersion
in
organic
solvents,
are
of
critical
need
aerospace,
aircraft,
energy,
chemical
industries
but
rare.
Herein,
a
solvent-free
highly
cross-linked
nonisocyanate
polyurethane
(NIPU)
adhesive
interfacial
adhesion,
superior
substrate
versatility,
excellent
to
conditions
is
reported.
The
fabricated
by
one-step
strategy
combining
sol–gel
chemistry
cyclic
carbonate–amine
polyaddition.
former
results
an
amine-terminated
hyperbranched
siloxane,
which
can
promote
the
polyaddition
reaction
enhance
cross-linking
density,
latter
yields
NIPU
high-density
polar
groups.
exhibits
ultrahigh
strength
up
20.67
MPa
ascribed
tough
cohesion
hydrogen
bonds
established
on
interface.
Moreover,
versatility
different
substrates,
including
ceramic,
steel,
aluminum
alloy,
copper
poly(methyl
methacrylate),
polyethylene,
glass,
wood.
Furthermore,
be
cured
at
ultralow
temperature
(−196
°C)
solvents.
novel
has
promising
potential
for
applications
specific
industries.
