Functionalized Aluminum Nitride for Improving Hydrolysis Resistances of Highly Thermally Conductive Polysiloxane Composites

Nano-Micro Letters, Journal Year: 2025, Volume and Issue: 17(1)

Published: Feb. 6, 2025

Abstract A series of divinylphenyl-acryloyl chloride copolymers (PDVB- co -PACl) is synthesized via atom transfer radical polymerization employing tert-butyl acrylate and divinylbenzene as monomers. PDVB- -PACl utilized to graft on the surface spherical aluminum nitride (AlN) prepare functionalized AlN (AlN@PDVB- -PACl). Polymethylhydrosiloxane (PMHS) then used matrix thermally conductive AlN@PDVB- -PACl/PMHS composites with fillers through blending curing. The grafting synchronously enhances hydrolysis resistance its interfacial compatibility PMHS matrix. When molecular weight 5100 g mol −1 density 0.8 wt%, containing 75 wt% exhibit optimal comprehensive performance. thermal conductivity ( λ ) composite 1.14 W m K , which by 20% 420% compared simply physically blended AlN/PMHS pure PMHS, respectively. Meanwhile, display remarkable hydrothermal aging retaining 99.1% after soaking in 90 °C deionized water for 80 h, whereas decreases sharply 93.7%.

Language: Английский

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Stretchable and Leakage‐Free Liquid Metal Networks for Thermal Management

Advanced Functional Materials, Journal Year: 2025, Volume and Issue: unknown

Published: Feb. 19, 2025

Abstract Stretchable thermally conductive materials (TCMs) are highly desirable for efficient thermal management in wearable electronics. However, yielding stretchable TCMs that can simultaneously achieve superior conductivity (TC) and high stretchability remains challenging owing to the contradiction between their mechanical behaviors. Herein, design of a bi‐continuous structure enables creation composites by incorporating liquid metal (LM) within thermoplastic urethane (TPU) framework, is reported. The continuous TPU framework acts as load‐bearing skeleton ensure stretchability, while LM forms 3D network, providing high‐speed channels heat conduction. This innovative endows resultant composite with out‐plane TC (4.16 W (m K) −1 ), outstanding (606%), extremely stable TC, retention 92% at 100% strain after 10 000 stretching‐releasing cycles. also exhibits excellent leakage‐free behavior, without any leakage large 400% under pressure 500 kPa. These remarkable comprehensive properties make it promising TCM

Language: Английский

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Enhanced dielectric breakdown strength and thermal conductivity of silicone gel composites with high-electron-affinity silicon Dioxide/Cationic Polymer/Nano-diamond

Chemical Engineering Journal, Journal Year: 2024, Volume and Issue: 501, P. 157623 - 157623

Published: Nov. 16, 2024

Language: Английский

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Advancements in thermal management solutions for electric vehicle high-power electronics: Innovations, cooling methods, and future perspectives

Journal of Energy Storage, Journal Year: 2025, Volume and Issue: 111, P. 115344 - 115344

Published: Jan. 14, 2025

Language: Английский

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Dynamic-Wetting Liquid Metal Thin Layer Induced via Surface Oxygen-Containing Functional Groups

ACS Nano, Journal Year: 2025, Volume and Issue: unknown

Published: Jan. 22, 2025

Enhancing the wettability of liquid metals (LMs) to address their high surface tensions is crucial for practical applications. However, controlling LMs wetting on various substrates and understanding underlying mechanisms are challenging. Here, we present a facile dynamic-wetting strategy modulate eutectic gallium-indium (EGaIn) via chemical modification, spontaneously forming stable thin (∼18 μm) EGaIn layer. Polymer exhibiting varying behaviors can be categorized by sliding angles adhesion force. X-ray photoelectron spectroscopy results demonstrate that process occurs only surfaces with sufficient oxygen-containing functional groups (content ≥18%) confirm coordination interactions between oxide layer groups. Furthermore, in thermal management systems, heat transfer rate group increased up 20% compared nonwetting group. This work will hasten application flexible circuits management.

Language: Английский

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Crack‐Resistant and Self‐Healable Passive Radiative Cooling Silicone Compounds

Advanced Materials, Journal Year: 2025, Volume and Issue: unknown

Published: Feb. 28, 2025

Abstract Crack damage and expansion are prevalent issues in outdoor materials, which absorb or transmit sunlight to damaged areas, substantially impairing the functionality of passive radiative cooling systems. Herein, a silicone/dielectric compound is introduced that both self‐healing crack‐resistant, developed through synthesis dynamic crack‐resistant polymer/dielectric hydrogen bond network. This network incorporates boron nitride dielectrics, serve as scatterers acceptors, with customized silicone polymer featuring high atmospheric window emissive chain segments UV–vis‐NIR transparent moieties. When cracks form, polymer's mobility allows moieties re‐associate, realizing from micrometers millimeters wide restoring performance ≈100%. The combination rigid sacrificial bonds also enhances materials’ fracture energy 865%, effectively preventing further crack propagation under stress autonomous blunting deflection. These remarkable characteristics make this highly suited for increasingly complex, dynamic, prolonged application environments.

Language: Английский

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Surface-bulged graphene-lamellae networks with ultra-low thermal resistance

Journal of Material Science and Technology, Journal Year: 2025, Volume and Issue: unknown

Published: March 1, 2025

Language: Английский

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Improving the Thermal Performance of Liquid Metal Thermal Interface Materials: The Role of Intermetallic Compounds at the Gallium/Copper Interface

Advanced Materials Interfaces, Journal Year: 2025, Volume and Issue: unknown

Published: April 29, 2025

Abstract Room‐temperature liquid metal has been widely used in electronic packaging due to its high thermal conductivity, but performance is strongly impeded by the dominated boundary resistance between and solid material. Here, first an order‐of‐magnitude reduction of (from 1.11 × 10 −7 (m 2 ·K)/W 6.94 −9 ·K)/W) reported self‐synthesizing intermetallic compound at gallium/solid copper interface. This significant transport improvement attributed conversion heat carriers from phonons electrons, bonding force van der Waals metallic bond, which thoroughly analyzed microscopic phonon electron diffuse mismatch models, complemented molecular dynamic simulations. Chip application demonstrates that brushing assisted can surprisingly obtain equivalent interfacial temperature difference (10.2 °C) InSn solder welding (8.3 °C), much smaller than conventional oxidation method (30.1 °C). study provides a comprehensive understanding electron/phonon Ga/Cu interfaces facilitates giant enhancement interface

Language: Английский

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General Approach to Hydrolysis Resistive Aluminum Nitride and Its High-Performance Thermal Interface Materials

ACS Applied Materials & Interfaces, Journal Year: 2024, Volume and Issue: 16(45), P. 62721 - 62731

Published: Oct. 30, 2024

Aluminum nitride (AlN), noted for its excellent thermal conductivity and exceptional electrical insulation, presents a promising alternative to traditional ceramic particles in interface materials (TIMs). However, broader adoption practical applications is limited by performance degradation due the vulnerability of crystal structure ubiquitous moisture. This study introduces dual solution, utilizing mechanochemical method design dense outer layer Galinstan liquid metal (LM) that simultaneously enhances AlN's resistance hydrolysis improves TIM applications. The high surface free energy LM imparts hydrophobic properties AlN and, combined with oxides, forms dual-layer protective barrier prevents water penetration, significantly enhancing TIM's long-term stability high-humidity conditions. Additionally, at thixotropic interfacial heat transport through bridging effect LM, resulting improved rheological mobility composite material. win–win modification strategy opens opportunities durable application widespread electronic management.

Language: Английский

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Lightweight and highly thermally conductive Ga-based liquid metal hybrid composites filled with hollow glass microspheres

International Journal of Thermal Sciences, Journal Year: 2024, Volume and Issue: 210, P. 109617 - 109617

Published: Dec. 18, 2024

Language: Английский

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