Treatment of an Unconfirmed Quality According to 8D Using the Problem-Solving Tool (PST) System a Case Study in an International Company
Souad Lahmine,
No information about this author
Fatima Bennouna
No information about this author
Journal of Machine Engineering,
Journal Year:
2025,
Volume and Issue:
unknown
Published: March 8, 2025
This
study
presents
a
qualitative
case
analysis
of
global
organization
addressing
non-conformity
in
the
crimping
process
connector
using
8D
methodology
and
digital
Problem-Solving
Tool
(PST).
The
research
demonstrates
how
PST,
Quality
4.0
tool,
enhances
by
streamlining
problem-solving
workflows,
improving
traceability,
facilitating
collaboration.
By
leveraging
technologies,
PST
enables
faster
root
cause
identification,
more
effective
corrective
actions,
better
overall
production
quality.
findings
emphasize
value
integrating
advanced
tools
modern
manufacturing,
highlighting
their
potential
to
overcome
limitations
traditional
quality
methods
resolving
complex
challenges.
underscores
transformative
role
technologies
elevating
control
practices
fostering
continuous
improvement,
offering
practical
insights
for
organizations
seeking
enhance
operational
efficiency
through
innovation.
Language: Английский
Reconfigurable Inverter Based on Ferroelectric-Gating MoS2 Field-Effect Transistors toward In-Memory Logic Operations
Shufang Dong,
No information about this author
Mingjie Li,
No information about this author
Zhongyang Liu
No information about this author
et al.
The Journal of Physical Chemistry Letters,
Journal Year:
2025,
Volume and Issue:
unknown, P. 1847 - 1854
Published: Feb. 14, 2025
With
the
advancement
of
information
technology
in
contemporary
society,
there
is
an
increasing
demand
for
rapid
processing
large
amounts
data.
Concurrently,
traditional
silicon-based
integrated
circuits
have
reached
their
performance
limits
due
to
exacerbation
non-ideal
effects.
This
necessitates
further
multifunctionalities
and
miniaturization
modern
circuits.
In
recent
years,
two-dimensional
(2D)
materials
demonstrated
exceptional
physical
electrical
properties
emerged
as
a
promising
method
development
next-generation
electronic
devices.
Ferroelectric
enable
flexible
adjustment
polarization
states,
thereby
simultaneously
achieving
non-volatile
memory
modulation
carrier
transport.
Moreover,
reconfigurable
logic
allows
dynamic
computational
functions
when
different
tasks
are
executed,
significantly
enhancing
logical
operation
capabilities.
Here,
we
report
inverter
based
on
ferroelectric-gating
MoS2
field-effect
transistors.
Notably,
ferroelectric
transistor
achieves
high
Ion/Ioff
ratio
∼106
window
∼20
V.
Furthermore,
realized
using
two
as-fabricated
transistors
(FeFETs)
can
produce
three
distinct
output
logics
(including
always
"0",
"1",
inverter)
states
under
same
input.
study
provides
strategy
transistors,
offering
potential
functional
block
in-memory
computing.
Language: Английский
Dielectric Integrations and Advanced Interface Engineering for 2D Field‐Effect Transistors
Fuyuan Zhang,
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Junda Song,
No information about this author
Yujia Yan
No information about this author
et al.
Small Methods,
Journal Year:
2025,
Volume and Issue:
unknown
Published: March 17, 2025
Abstract
As
silicon‐based
transistors
approach
their
physical
limits,
the
challenge
of
further
increasing
chip
integration
intensifies.
2D
semiconductors,
with
atomically
thin
thickness,
ultraflat
surfaces,
and
van
der
Waals
(vdW)
capability,
are
seen
as
a
key
candidate
for
sub‐1
nm
nodes
in
post‐Moore
era.
However,
low
dielectric
quality,
including
discontinuity
substantial
leakage
currents
due
to
lack
nucleation
sites
during
deposition,
interfacial
states
causing
serious
charge
scattering,
uncontrolled
threshold
shifts,
bad
uniformity
from
doping
damage,
have
become
critical
barriers
real
applications.
This
review
focuses
on
this
possible
solutions.
The
functions
materials
criteria
devices
first
elucidated.
methods
high‐quality
channels,
such
surface
pretreatment,
using
native
oxides,
buffer
layer
insertion,
vdW
transfer,
new
materials,
then
reviewed.
Additionally,
advanced
3D
is
also
discussed.
Finally,
paper
concluded
comparative
summary
outlook,
highlighting
importance
state
control,
p‐type
compatibility
silicon
processes.
Language: Английский