Monomer ratio‐controlled polyimides with enhanced dielectric properties and thermal stabilities through crosslinking network DOI
Yung‐Jen Huang,

Jin‐Wei Lin,

Yueh‐Hsing Lee

et al.

Journal of Polymer Science, Journal Year: 2023, Volume and Issue: 62(6), P. 1145 - 1155

Published: Dec. 10, 2023

Abstract Polyimides (PI) are considered as one of the most used materials for flexible printed circuit board substrates because their excellent thermal stabilities, outstanding mechanical properties, and great dielectric properties. Dielectric constants ( D k ) common commercial PIs, however, still above 3.0 (at 10 GHz), which is substandard high‐frequency applications. In this study, we develop thermally stable PIs with enhanced properties by structural design crosslinking. Stiff aromatic 2,2′‐bis(trifluoromethyl)benzidine (TFMB) soft aliphatic dimer diamines (DDA, priamine), including priamine 1074 (DDA‐1) 1071 (DDA‐2), diamines, cyclobutanetetracarboxylic dianhydride (CBDA) dianhydride. By adjusting ratio a series (PI‐1–PI‐5) high stabilities low‐ values synthesized. Among these PI‐4 synthesized TFMB:DDA‐1:DDA‐2 = 85:10:5, possesses relatively good performances. Therefore, further chosen to be crosslinked. changing contents crosslinker, triallyl isocyanurate (TAIC), crosslinked (CPIs) The resulting CPIs have significant improvement in strengths. Especially, CPI‐4‐30, 30% TAIC used, glass transition temperature T g increases 20°C, decreases from 2.62 2.41, ultimate tensile strength boosts 91.65 115.16 MPa. low may potential substrate broad applications, such microelectronics integrated packages.

Language: Английский

Fluorinated polyimide with triphenyl pyridine structure for 5G communications: Low dielectric, highly hydrophobic, and highly transparent DOI
Hong Li, Feng Bao,

Xiaoqian Lan

et al.

European Polymer Journal, Journal Year: 2023, Volume and Issue: 197, P. 112327 - 112327

Published: July 28, 2023

Language: Английский

Citations

43
Fluorine atom substituted aromatic polyimides: Unlocking extraordinary dielectric performance and comprehensive advantages DOI Creative Commons

Weifeng Peng,

Huanyu Lei,

Bingyu Zou

et al.

Giant, Journal Year: 2024, Volume and Issue: 18, P. 100262 - 100262

Published: April 4, 2024

Low-dielectric polymers face prominent development challenges at high frequency. Particularly, the relationship between high-frequency dielectric loss and polymer structures remains not clear enough. Besides, strategies for achieving low usually have to scarify other important materials properties, e.g. heat resistance or dimensional stability. Herein, fluorine-containing aromatic polyimides were systematically investigated. Among them, simple fluorine atom (-F) substituted exhibit remarkable frequency (10 GHz) as well comprehensive advantages, including near-zero thermal expansion coefficient, extremely decomposition stability, optical transmittance excellent mechanical properties. The fundamental mechanisms of are fully discussed. Benefiting from unique electric effect compact size -F group, display dipolar density strongly restricted motion, contributing a reduced permanent polarization loss. Moreover, concept induced was introduced illustrate nontrivial impact F-substituted on conjugated electron cloud in system. This work only provides valuable insights understanding mechanism polymers, but also opens up broader application possibilities microelectronic wireless communications industries.

Language: Английский

Citations

10
Recyclable Low Dielectric Polymers with High Thermal Conductivity for Copper‐Clad Laminated Film for High‐Frequency Applications DOI Open Access

Hyeyoon Ko,

Youngjae Wi,

Jahyeon Koo

et al.

Advanced Functional Materials, Journal Year: 2025, Volume and Issue: unknown

Published: Jan. 31, 2025

Abstract With the rapid increase in demand for next‐generation communication, development of advanced dielectric materials has become imperative. To enhance performance and reliability miniaturized electronic devices, must exhibit high thermal conductivity (λ) while simultaneously fulfilling crucial criteria such as low permittivity ( D k ) loss f ). The synthesis novel polymers (LDPs) is newly reported by integrating fused aromatic mesogens siloxane functions with silane linkers. Fused mesogenic building blocks undergo crosslinking via hydrosilylation octavinylsilsesquioxane (OVS). resulting LDPs excellent properties 1.79 a 0.004) along λ (0.89 W m −1 K cold crystallization governs their molecular packing structure, which controls electron alignment phonon transfer. A comprehensive understanding interplay between structure allows precise tuning signal transmission heat conduction polymers. Furthermore, reprocessable recyclable nature highlights potential highly effective environmentally sustainable applications.

Language: Английский

Citations

1
Increasing Twist Rigidity to Prepare Polyimides with Low Dielectric Constants and Dissipation Factors over a Wide Temperature Range DOI
Yan Chen, Xinyu Chen, Yi Wang

et al.

Macromolecules, Journal Year: 2023, Volume and Issue: 56(23), P. 9379 - 9388

Published: Nov. 23, 2023

To ensure the stable performance and extended service life of high-integrity high-power electronic devices, it is imperative for dielectric materials to consistently exhibit a low constant (Dk) dissipation factor (Df) across wide temperature range. Here, we have undertaken synthesis two distinct polyimides (PIs), namely, 6FDA-GA 6FDA-GB, featuring varying biphenyl side groups. These selected groups been intentionally incorporated impede interchain stacking PI macromolecules enhance twist rigidity mainchain. It was substantiated that smaller side-chain in 6FDA-GB are notably effective constraining rotation imide ring within main chain owing their closer proximity. This constraint has unequivocally resulted substantial increase chain. Thus, resulting film endowed wtih an expanded free volume concurrently curtailed dipole motion. combined effects led reduction both Dk Df. The exhibits value 2.70 Df 0.0022 at 10 kHz room temperature. Remarkably, even elevated temperatures up 200 °C, remains stable, with only slight (0.00386). contribution holds promise advancing comprehensive PIs understanding stability properties high temperatures.

Language: Английский

Citations

16
High-frequency 5G substrate: Low dielectric biphenyl polyimide with low CTE and high thermal stability DOI Creative Commons
Heming Li,

Panpeng Wei,

Yongqi Wang

et al.

Materials Today Advances, Journal Year: 2024, Volume and Issue: 23, P. 100514 - 100514

Published: July 23, 2024

Polyimide (PI) faces new challenges in meeting the requirements of low coefficient thermal expansion (CTE), dielectric content/loss, and high stability to be utilized effectively as a substrate for flexible electronic materials. At present research, CTE PI films can reduced around 5 ppm/K, with Tg > 420 °C. However, it is difficult balance at same time, reducing performance even more difficult. This study focused on synthesizing four types (using BPDA dianhydride) by employing biphenyl structure diamines (PDA, BZD, DPT, DMP) an increasing number benzene rings. The improvement CTE, properties, was observed increase rings decrease imine horizontal structure. Tetraphenylene PI-DMP exhibited values ε tanθ 3.31 4.73 ‰ respectively under 10 GHz. Additionally, demonstrated commendable (Tg = 442°C), outstanding mechanical properties (elastic modulus GPa), (2 ppm/K within temperature range 50–300 °C, close 3.6 monocrystalline silicon). stability, that 5G materials need qualified are simultaneously reflected this study. MS theoretical calculations were used analyze results. excellent consistency experimental results promote feasibility theory high-frequency (10 Ghz). innovative approach anticipated provide foldable chip fields intrinsic possessing dielectric, stability.

Language: Английский

Citations

7
Curing Behavior and Properties of Active Ester Cured Cycloaliphatic Epoxy Resins DOI
Jiaming Liu,

Jingjing Qin,

Xiaohua Cui

et al.

Industrial & Engineering Chemistry Research, Journal Year: 2024, Volume and Issue: 63(13), P. 5977 - 5985

Published: March 19, 2024

Cycloaliphatic epoxy resins are known for their synthesis process that eliminates hydrolyzable chlorine, thus avoiding the hydrolysis of chlorine to hydroxyl groups in conventional epoxies, which is very favorable preparation low dielectric resins. The curing using active ester generates no groups, also indicating a promising approach producing However, resistance cycloaliphatic nucleophilic reactions restricts it from reacting usually only with anhydrides. This study investigates reactivity epoxy, demonstrating its capability undergo complete at temperatures near 150 °C. Factors influencing this process, including volatilization catalyst DMAP and reactivity, examined. Two types epoxies (3,4-epoxycyclohexylmethyl-3′,4'-epoxycyclohexane carboxylate (EEC) bis (3,4-epoxycyclohexylmethyl) adipate (BEA)) combined an hardener, triacetyl resveratrol (TAR), prepare activation energies determined, optimal concentration 4-dimethylaminopyridine (DMAP) identified each resin. use catalysts specific concentrations results superior mechanical properties (91.7 71.4 MPa EEC/TAR BEA/TAR), excellent thermal stability (Td5% 354 347 °C), good (dielectric constant 3.68 3.95 10 MHz), outperforming anhydride-cured These findings expand selection hardeners highlight potential prepared electronic packaging materials, offering enhanced suitable various applications.

Language: Английский

Citations

6
Decoding High-Frequency Dielectric Loss of Poly(ester imide)s: Molecular Simulation and Experiment Validation DOI

Xiaojie He,

Songyang Zhang, Chenggang Zhang

et al.

Polymer, Journal Year: 2024, Volume and Issue: 308, P. 127337 - 127337

Published: June 28, 2024

Language: Английский

Citations

6
Preparation and dielectric properties research of a novel kind of intrinsic silane-containing polyimide DOI Open Access

Chunhui Qu,

Liang Shan,

Guoping Zhang

et al.

Polymer, Journal Year: 2023, Volume and Issue: 285, P. 126361 - 126361

Published: Sept. 13, 2023

Language: Английский

Citations

13
Thin films for nano-electronics applications based on BaCaTiO3–SrZnTiO3 perovskite with Au electrodes DOI
Kadhim R. Gbashi, Ali Bahari, Sadeq H. Lafta

et al.

Applied Physics A, Journal Year: 2023, Volume and Issue: 129(5)

Published: April 15, 2023

Language: Английский

Citations

12
Research Advances of Porous Polyimide—Based Composites with Low Dielectric Constant DOI Open Access

Zhenjiang Pang,

Hengchao Sun, Yan Guo

et al.

Polymers, Journal Year: 2023, Volume and Issue: 15(16), P. 3341 - 3341

Published: Aug. 8, 2023

With the burgeoning of microelectronics industry, in order to improve transmission speed between chips large-scale integrated circuits meet demands high integration, it is necessary for interlayer insulation materials possess a lower dielectric constant (k). Polyimide (PI) has been widely used as circuits, and exploration on reducing their attracted extensive attention recent years. In this work, porous PI-based composites with low are mainly reviewed. The application SiO2, graphene derivatives, polyoxometalates, polyhedral oligomeric silsesquioxane hyperbranched polysiloxane PI emphatically introduced. key technical problems challenges current research polyimide summarized, development prospect k also expounded.

Language: Английский

Citations

11