A Review of Advanced Thermal Interface Materials with Oriented Structures for Electronic Devices DOI Open Access
Yuan Tu, Bin Liu, Gang Yao

et al.

Electronics, Journal Year: 2024, Volume and Issue: 13(21), P. 4287 - 4287

Published: Oct. 31, 2024

In high-power electronic devices, the rapid accumulation of heat presents significant thermal management challenges that necessitate development advanced interface materials (TIMs) to ensure performance and reliability devices. TIMs are employed facilitate an effective stable dissipation pathway between heat-generating components sinks. recent years, anisotropic one-dimensional two-dimensional materials, including carbon fibers, graphene, boron nitride, have been introduced as fillers in polymer-based due their high conductivity specific directions. The orientation polymer matrix has become important issue a new generation high-performance TIMs. To provide systematic understanding this field, paper mainly discusses advances oriented with (>10 W/(m·K)). For each filler, its preparation strategies enhancement mechanisms analyzed separately, focus on construction structures. Notably, there few reviews related fiber TIMs, details research results field. Finally, challenges, prospects, future directions summarized hope stimulating efforts.

Language: Английский

Heat Transfer in Composite Materials: Mechanisms and Applications DOI Creative Commons
Mohammad Alaghemandi

Published: Feb. 5, 2025

Understanding heat transfer in composite materials is essential for optimizing their performance critical applications across industries such as aerospace, automotive, renewable energy, and construction. This review offers a comprehensive examination of the various mechanisms within explores how these processes, spanning different length time scales, are influenced by materials’ composition structure. Both traditional advanced analytical numerical modeling techniques explored, emphasizing importance predicting thermal behavior scales. Furthermore, evaluates current experimental methods measuring properties, discussing limitations potential areas enhancement. Significant attention devoted to practical materials, from management electronic devices heat-resistant components aerospace engineering. Recent innovations, integration phase change development nano-enhanced composites, assessed transform capabilities. Ongoing challenges addressed, future research directions outlined, highlighting need advancements material science engineering meet emerging demands. aims bridge gap between fundamental applications, providing understanding that both rooted driven possibilities.

Language: Английский

Citations

0
Outstanding self-healing and plasticity of imine-linked dynamic PDMS with high softness and stability DOI
Fubin Luo, Junyan Sun, Yingbing Zou

et al.

Chemical Engineering Journal, Journal Year: 2025, Volume and Issue: unknown, P. 161905 - 161905

Published: March 1, 2025

Language: Английский

Citations

0
Hierarchically Structured Composite Decorated with Core‐Sheath CoC@Carbon Fiber Felt: Exceptional Electromagnetic Interference Shielding and Applications in Thermal Management and Electro/Photo‐Thermal Conversion DOI
Yifan Wang, Xin Wang,

Fengyu Wen

et al.

Small, Journal Year: 2025, Volume and Issue: unknown

Published: April 21, 2025

Abstract In the microelectronics era, electromagnetic radiation and heat accumulation in electronic devices are urgent challenges requiring solutions, particularly through use of structure‐function integrated lightweight materials for interference (EMI) shielding thermal management. Hierarchically structured polyether‐ether‐ketone‐based composites prepared this study by situ deposition dip coating using a simple scalable method. Magnetic cobalt nanoparticles derived from magnetic metal–organic frameworks deposited on carbon fiber felt featuring macroscopic continuous conductive network. Next, hybrid slurry is applied to connect isolated fibers, which bridge gaps create new electron phonon transport channels, increasing conductivity (23.43 W m −1 K plane, 4.84 plane) efficient dissipation. Owing stable 3D crosslinked network with high electrical (13 608 S ), composite offers ultra‐high EMI X‐band (101.64 dB stability extreme environments), excellent Joule heating performance (220 °C at 4 V), photothermal conversion (94 500 mW cm −2 ). This multifunctional material has great application prospects precision equipment.

Language: Английский

Citations

0
Reactive extrusion for efficient preparation of high temperature resistant PA6T/66/BN composites with great thermal management and mechanical properties DOI

Zejun Cao,

S. G. Zhang,

Chen Wang

et al.

Composites Communications, Journal Year: 2024, Volume and Issue: 52, P. 102121 - 102121

Published: Oct. 11, 2024

Language: Английский

Citations

2
Bio-Inspired Thermal Conductive Fibers by Boron Nitride Nanosheet/Boron Nitride Hybrid DOI Open Access
Jiajing Zhang,

P Zhang,

Chunhua Zhang

et al.

International Journal of Molecular Sciences, Journal Year: 2024, Volume and Issue: 25(20), P. 11156 - 11156

Published: Oct. 17, 2024

With the innovation of modern electronics, heat dissipation in devices faces several problems. In our work, boron nitride (BN) with good thermal conductivity (TC) was successfully fabricated by constructing BN along axial direction and surface-grafted hybrid composite fibers via wet-spinning hot-pressing method. The unique inter-outer inter-interconnected structure exhibited 176.47% enhancement (TCE), which exhibits TC, mechanical resistance, chemical resistance. addition, depending on special fibers, it provides a new strategy for fabricating interface materials electronic device.

Language: Английский

Citations

1
A Review of Advanced Thermal Interface Materials with Oriented Structures for Electronic Devices DOI Open Access
Yuan Tu, Bin Liu, Gang Yao

et al.

Electronics, Journal Year: 2024, Volume and Issue: 13(21), P. 4287 - 4287

Published: Oct. 31, 2024

In high-power electronic devices, the rapid accumulation of heat presents significant thermal management challenges that necessitate development advanced interface materials (TIMs) to ensure performance and reliability devices. TIMs are employed facilitate an effective stable dissipation pathway between heat-generating components sinks. recent years, anisotropic one-dimensional two-dimensional materials, including carbon fibers, graphene, boron nitride, have been introduced as fillers in polymer-based due their high conductivity specific directions. The orientation polymer matrix has become important issue a new generation high-performance TIMs. To provide systematic understanding this field, paper mainly discusses advances oriented with (>10 W/(m·K)). For each filler, its preparation strategies enhancement mechanisms analyzed separately, focus on construction structures. Notably, there few reviews related fiber TIMs, details research results field. Finally, challenges, prospects, future directions summarized hope stimulating efforts.

Language: Английский

Citations

0